Sharp NC µm Pixel CCD Image Sensor

Transcription

1 Sharp NC µm Pixel CCD Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:

2 Imager Process Review Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Process Summary 2 Device Overview 2.1 Camera Assembly 2.2 CCD Die 2.3 Functional Blocks 2.4 Die Features 3 Process Analysis 3.1 General Device Structure 3.2 Bond Pads 3.3 Dielectrics 3.4 Metallization 3.5 Contacts 3.6 Transistors and Poly 3.7 Isolation 3.8 Wells and Substrate 4 Pixel Analysis 4.1 Plan View Analysis 4.2 Color Filters and Lenses 4.3 Cross-Sectional Analysis (Parallel to Vertical CCD) 4.4 Cross-Sectional Analysis (Parallel to Horizontal CCD) 5 Critical Dimensions 5.1 Horizontal Dimensions 5.2 Vertical Dimensions 6 References 7 Statement of Measurement Uncertainty and Scope Variation Report Evaluation

3 Overview Overview 1.1 List of Figures 2 Device Overview Kodak M873 Camera Front Kodak M873 Camera Back Kodak M873 Camera Back Removed Imager Assembly Front Imager Assembly Back Imager Assembly X-Ray CCD Imager Ceramic Package Front CCD Imager Ceramic Package Back Die With Filters Intact Die Mark Annotated Top Metal Die Photograph Functional Blocks Die Corner A Die Corner B Die Corner C Die Corner D Test Structures Probe Pads Minimum Pitch Bond Pads Pixel Array Corner A Pixel Array Corner B Pixel Array Corner C Pixel Array Corner D RGB Color Filters and Lenses Output Amplifier 3 Process Analysis General Structure Die Edge Edge Seal Bond Pad Right Edge Silicon Nitride Passivation Intermetal and Pre-metal Dielectrics Minimum Metal 2 Line Minimum Metal 2 Gap End of Metal 2 Line Metal 1 Apertures Metal 1 Composition Contact to Poly Contact to Silicon Minimum Pitch Contacts

4 Overview Transfer Transistor Plan View Transfer Transistor SEM View Minimum NMOS Gate Length Field Oxide SRP Peripheral P-Well and Buried N-Well SRP CCD Array P-Well SCM of N-Charge Transfer Channel Substrate Surface SCM of N-Charge Transfer Channel and P-Pinning Layer SCM of N-Charge Transfer Channel 4 Pixel Analysis Color Filters and Upper Lenses Metal 1 Light Shield Polysilicon Control Lines Color Filters and Lenses X Direction Color Filters and Lenses Y Direction CCD Array at Metal 1 Plane of Cross-Sectioning CCD Array at Poly Plane of Cross-Sectioning Pixel Blue and Green Color Filters Vertical CCD Pixel Red and Green Color Filters Vertical CCD Pixel and Lower Lens Vertical CCD Pixel AR Layer Detail Vertical CCD Poly 2 Gate Dielectric Detail Vertical CCD Pixel Red and Green Color Filters Horizontal CCD Pixel Blue and Green Color Filters Horizontal CCD Pixel and Lower Lens Horizontal CCD Interpoly Dielectric Detail Horizontal CCD Poly 1 Gate Dielectric Detail Horizontal CCD Poly Between Pixel Rows Horizontal CCD SCM of Photocathode

5 Overview List of Tables 1 Overview Device Identification NC9610 Image Sensor Device Summary NC9610 Image Sensor Process Summary 2 Device Overview NC9610 Functional Block Measurements Die and Bond Pad Dimensions 3 Process Analysis Dielectric Thicknesses Metallization Vertical Dimensions Metallization Horizontal Dimensions Contact Dimensions Transistor and Polysilicon Dimensions 4 Pixel Analysis Pixel Element Sizes Layer Thicknesses Center of Pixel Aperture 5 Critical Dimensions Minimum Pitch Metals Contacts and Vias Die, Transistors, Poly, and Isolation Vertical Dimensions

6 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at: Chipworks 3685 Richmond Rd. Suite 500 Ottawa, Ontario K2H 5B7 Canada T: F: Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com