When Less Is More: Bigger & Faster Memory in Shrinking Packages for the Mobile Market

Transcription

1 When Less Is More: Bigger & Faster Memory in Shrinking Packages for the Mobile Market Kathy Choe Thomas, Flash Product Mktg Samsung Semiconductor, Inc.

2 Living in the Connected World Like it or Not, We Are Connected Anytime, Anywhere Cloud Services Mobile Social Media Imaging Augmented Reality Online Games Wireless Bio Sensing Tagging Gesture 3D Displays Robotics Nano Cloud computing and seamless connectivity are real Mobile devices going far beyond laptops & cell phones Memory technology at the center of this evolution

3 Connect Everything, Everywhere 1980 s Stand-alone Ever-increasing Data Traffic Load 40% Annual Growth 55, s 2010 s Wired Connectivity Hardware Performance Improvements & Virtualization 10, , , ,811 21, (Petabytes Per Month) The Cisco Visual Networking Index Cloud Computing & Seamless Connectivity Smart Mobile Clients for Rich Mobile Experience

4 Mobile Internet will be 10X Desktop Internet Computing Growth Drivers Over Time 100,000 10,000 1, Increasing Integration Minicomputer Mainframe 10MM+ Units PC 100MM+ Units Desktop Internet 1B+ Units / Users Mobile Internet 10B+ Units??? 1MM+ Units Source: Morgan Stanley

5 Mobile Internet Users to Outgrow Desktop Users Mobile users to exceed desktop users within 5 years Connectivity Everywhere More WiFi/Broadband Products Text, , Internet on-the-fly Mobile Apps, ecommerce Cloud Computing (Data 24x7) Growth of Social Networking Creating the NEED for: Instant communication Getting & Giving Info Instant Gratification The NEED to be Always Connected Source: Morgan Stanley Research

6 Social Networking Driving Internet Usage Social Networking > Communication Source: Morgan Stanley Research

7 Evolution of Device Usage, Interface, & Content Evolution Changes: Hardware, Software Form Factor Usage Model Content Form, Source Memory Solutions Source: Morgan Stanley Research Physical Digital Content. Home/Office Mobile Cloud

8 Smartphones Broaden the Mobile Experience Breakdown of Smartphone Usage Time 10% MUSIC 12% VOICE 47% GAME 2% Seamless Connectivity At Home,At Work & On the Go Others 2% TEXT 15% INTERNET 12% Mobile Phone Production Unit in Billions Smartphones Smartphones greatly increasing mobile internet usage Smartphones Drive Growth Non-Smartphones isuppli, Gartner CAGR 8% 0% 36%

9 Smartphones Driving Memory Consumption GB s/system growing 3X faster than PC s Smartphone memory content averaging over 7GB+/set in GB+ > 300MB 173% 111% 188% 75% 119% 3.6GB 6.5~6.9GB 178MB 3.4GB DRAM NAND Smartphones driving Memory Consumption 1.6GB Overall handset 273% DRAM NAND

10 Overall Mobile Market Driving Memory Demand Mobile DRAM CAGR of 75% NAND CAGR of 109% DRAM Bit Outlook NAND Bit Outlook 1Gb Equivalent 31B 16Gb Equivalent 13.5B CAGR 44% 10% CAGR 53% 6% 10B 84% 75% 80% 42% % 4% 2.8B 26% 109% 14% 160% Computers Mobile Others SSD Mobile Others Company Data

11 Small Devices Driving Big Requirements Seamless Connectivity Instant ON Always ON Battery Life Portability The Mobile Network Storage Performance Reliability Memory technology must support these requirements Memory technology can enhance these requirements

12 THINnovation Diet with Samsung Memory Build Muscle: More Memory in the same space Trim the Fat: Die Shrinks = Smaller Chips/Pkg Run Fast: Higher Performance Memory Consume Less: Power Reduction even at higher performance Run Long: Lower Power = Longer Battery Life Better Products Better User Experience

13 THINnovation Diet with Samsung Memory Trim the Fat Die Shrinks = Smaller Chips/Pkg Conventional Mobile Memory Build More Muscle More Memory in the Same Pkg (Die Stack) Run Fast: Higher Performance Memory Consume Less: Power Reduction even at higher performance Run Long: Lower Power = Longer Battery Life Better Products Better User Experience

14 Packing Transistors into Tinier Silicon DRAM NAND Process 56nm 2Xnm 35nm 1Xnm Process Density 2Gb 8Gb Density 32Gb 128Gb/ 256Gb Density doubling every 1-2 years until 2012 Performance & Power Reduction improvements Cost Reduction/Productivity Increase with each new shrink Economies of Scale through Process Migration continue

15 MCP & MoviNAND: More Die & Capacity per Pkg Chip Stack Number 16GB 120GB Packaging Technology 20 EA 11Gb 32Chip Stack 15 EA 16 Chip Stack 64GB 3.2Gb movinand (emmc) 10 EA 8 EA 8- Chip 6/7-Chip 4/5-Chip 3- Chip 1/2- Chip 8 Chip Stack 10 Chip Stack 8GB 16GB 32GB 6 EA MCP 5Chip 4GB 4GB 16GB 4 EA movimcp Year

16 Unique Packaging: PoP for Slim & Small ND MCP Modem Over 40% Space Gain + Higher Performance MCP Solution POP Solution Modem (169mm2) ND MCP (136.5mm2) POP Stack ( CDMA Phone ) Over 305mm 2 144mm 2 ~ 196mm 2 PoP = Package-on-Package 1 Package footprint instead of 2 40% space gain > 50% higher performance Proven high volume manufacturing capability

17 Samsung s 1-Stop Shop for Memory Total memory package for any & all mobile devices High Density, High Performance, Low Power, Small Package Size movinand (emmc) SSD Mobile DRAM Internal Memory External (Optional) Storage Up to 256GB LPDDR1/LPDDR2 Up to 64GB Up to 4Gb & 800MHz SD & microsd Cards 2-bit MLC 3-bit TLC CL6/CL10 CL2/CL4 Hi Speed MCP Up to 32GB High Density Communication Memory NAND/eMMC+DRAM NOR+UtRAM Any combo in single pkg Baseband/Cellular to Total System Memory

18 Memory Highlights Samsung increasing memory in the space of a single chip Packing higher density into a single die Up to 16 die stacks into a single chip Stacked Package-on-Package Power reduction through process shrinks and lower voltages While increasing performance! Samsung Memories creating value & driving mobile evolution Better End Products Better User Experience THINnovation! Samsung has the expertise in advanced Memory technology to drive the mobile revolution with THINnovative solutions

19 Mobile Applications Win with Samsung! Samsung at the center of Mobile and Multimedia evolution Creating the Future with Samsung THINnovation

20 Thank You!