An Introduction To Area Array Probing
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1 An Introduction To Area Array Probing Fred Taber IBM Corporation 1998 Southwest Test WorkShop 1
2 Topics: Introduction & Background Considerations & Experiences Q & A 2
3 Introduction & Background Vertical Probe Market Growth Potentially 40% of the Probe Market Revenue by 2001 Technical Drivers Performance --> Data Rates, Power Distribution, etc. I/O Requirements --> 2500 and Growing Packaging --> Multi-Dut (e.g. TCM) Perimeter Pad Applications Business Drivers e.g. Cost/Performance, Customer Requirements, etc... 3
4 Introduction & Background (cont.) Area Array Probing History/Experience Over 30 Years in IBM A Variety of Vertical Technologies (Ref. 1) Until... COBRA Patented in 1977!! (Ref. 2) Key Enabler Even Today Typical Pitch:.005" on.009"/.010 "Vertical" Space Transformer (Fanout) Wired Ceramic Test System & Prober 'Tailoring' 4
5 Vertical Market Growth: Wafer Probes Growth Illustration Revenue Year Other Vertical Vertical Other 5
6 Considerations & Experiences: Test System/Methodology/Product Detecting Power/Ground Shorts "Soft Power" Protection AC Performance: Product & Test System Design Power Distribution Network Power/Ground I/O to Signal I/O Ratio and Placement Product Evaporated or Plated C4's Low Volume Solder / Height Variations Run out (Evaporated C4's) Retest Budget High Temperature Test -->Greater C4 Pad Deformation Reflow (If/When and Limits) 6
7 Considerations & Experiences (cont.): Test Head Planarity / Co-Planarity Set-ups May Differ By Probe Technology Deformation/Movement Higher Probe Forces Probe Technology Dependent Wafer Prober Alignment Look-up Optics Larger Probing Window/Target Chuck High Z Force Tilt Issues at Edge 7
8 Considerations & Experiences (cont.): Wafer Probe Mechanical Specifications I/O & DUT Capacity Pitch Boundaries PbSn Pick-up / Removal Electrical Performance Bandwidth Near-in Decoupling Sub-System Contributions (Space Transformer, DUT Board, etc.) Bulk & Contact Resistance Current Carrying Capacity C4 Deformation Effects Probe Technology Dependent Retest Capability Voids Occurring After Reflow --> Reliability Issue 8
9 Considerations & Experiences (cont.): Wafer Probe Manufacturing Considerations Robustness Set-up/Replacement/Repairability COO Source of Supply Limited Offerings /Suppliers Today Second-Sourcing Planarity / Compliance / Cleaning Effects Probe Life Force / Deflection - Operating Point/Range Contact Resistance Vs. Number of Touch Downs Cleaning Techniques: Abrasive, In-situ? 9
10 C4 Deformation / Reflow: After COBRA Probing (Optical 200x) After Reflow (SEM) 10
11 Force / Deflection Curves: ref. 1 11
12 Q & A: What Are Your Experiences? Any Questions? 12
13 References & Acknowledgements: Ref. 1 "Probing Considerations In C-4 Testing Of IC Wafers" by Dennis J. Genin and Manfred Wurster, IBM Corporation, 1992 Ref. 2 United States Patent #4,027,935; June 7, 1977; "Contact For An Electrical Contactor Assembly"; Herbert Byrnes and Richard Wahl (Assignee: IBM) For their support, assistance and encouragement, many thanks to Dr. Gobinda Das, Senior Engineer, IBM Corporation, and Samuel McKnight, Advisory Engineer, IBM Corporation 13
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