Extra Large Multi-DUT Array Probing enabling > X100 Parallel Testing
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1 Extra Large Multi-DUT Array Probing enabling > X100 Parallel Testing Bassam Dabit FAB18 Test Process Integration Trung Nguyen CTM Test Process Integration Intel Corporation 06/06/2005
2 Introduction Motivation Challenges Preliminary Results Conclusions Acknowledgments Agenda Pg 2
3 XL Multi-DUT Probe-Card Multi-DUT: Multi Device-Under-Test, which is also defined as Die Parallel testing method. Probe-Card: Interface unit between Wafer/Die on Wafer and Test System. Why XL? Flash Industry use X16 / X32 / X64 parallelism testing which is considered as standard. X16 X32 X64 > X100 Pg 3
4 Motivation behind Multi-DUT testing Reduced Wafer Test Time: Reduction in number of steps required to test a wafer Increased test Output: Wafer throughput increase Decrease in Probe-Card and Tester Inventory Test Time Test Time as function of Parallelism X1 X2 X16 X32 X100 X200 Parallelism Test Time Pg 4
5 XL Multi-DUT Probe Card Challenges Probing Process Metrology Technology Existence & Capability Repair & Maintenance Tester capability Channel count, Parallelism and S/W Automation Support systems Advanced Process Control Pg 5
6 XL Multi-DUT Probing Challenges Very large effective probing area : Requirement for a large area contact uniformity through control of Alignment, Planarity and Test-Head deflections. High thermal sensitivity: Probe-Cards have to be operational within the required Temp Range of test. Deflection [Normalized] 10-6 Z Coordinate [Normalized] Probe Card Deflection as Function of Drive Over Drive 1 4 Probe Card Center Z coordinate as function of Time and Temp' Time 3 Corner1 Corner2 Corner3 Corner4 Temp1 Temp2 Temp3 Temp4 Temp5 Temp6 Pg 6
7 XL Multi-DUT Probing Challenges: Very large effective probing area: 10 Probe Card Deflection as Function of Drive Requirement for a large area contact uniformity through control of Alignment, Planarity and Test-Head deflections. Deflection [Normalized] Over Drive Corner1 Corner2 Corner3 Corner4 High thermal sensitivity: Probe Card Center Z coordinate as function of Time and Temp' Probe-Cards have to be operational within the required Temp Range of test. Z Coordinate [Normalized] Time Temp1 Temp2 Temp3 Temp4 Temp5 Temp6 Pg 7
8 XL Multi-DUT Probing Challenges: Probing Drive: Characterizing the best value which achieves Lowest Contact-Resistance & Pad Damage. Probe-Card Durability: Probe-Card & Process characteristics are to remain within given value window all through probe-card life time. Pg 8
9 XL Multi-DUT Probing Challenges: Y 3.9 Y Scrub Size as Function of Drive Contact Resistance as Function of Over Drive Y Scrub Size [Normalized] Contact Resistance [Normalized] Drive1 Drive2 Drive3 Drive4 Drive5 Drive Drive1 Drive2 Drive3 Drive4 Drive [Arbitrary] Drive5 X Scrub Size as Function of Over Drive Drive6 Over Drive [Arbitrary] X Scrub Size [Normalized] X 1.4 Drive1 Drive2 Drive3 Drive4 Drive5 Drive6 Over Drive [Arbitrary] Pg 9
10 XL Multi-DUT Probing Challenges: Probing Drive: Characterizing the best value which achieves Lowest Contact-Resistance & Pad Damage. Probe-Card Durability: Probe-Card & Process characteristics are to remain within given value window all through probe-card life time. Contact Resistance [ N o rm alized ] Contact Resistance as Function of Probe-Card Age Life-Stage1 Life-Stage2 Life-Stage3 Life-Stage4 Life-Stage5 Probe Card Touch Down Age [Arbitrary] Pg 10
11 Summary Flash Like XRam test evolution drive a need for ever increasing parallel testing. XL Multi-DUT Probing brings many challenges. Key challenges where Identified and Mitigated. Preliminary data have shown promising results. More work is needed to understand process characteristics. Pg 11
12 Acknowledgment Abdel Abdelrahman Reuben Gallegos Kurt Guthzeit Yossi Revah Mike Dang Barry Hulce Pg 12
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