RClamp0521PA. Ultra-Low Capacitance 1-Line ESD protection. PROTECTION PRODUCTS - RailClamp Description. Features. Mechanical Characteristics
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1 - RailClamp Description RailClamp TS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The RClamp 052PA has a maximum capacitance of only 0.50pF. This allows it to be used on circuits operating in excess of 3GHz without signal attenuation. They may be used to meet the ESD iunity requirements of IEC , Level 4 (±5k air, ±8k contact discharge). The RClamp052PA is in a 2-pin SLP006P2 package measuring.0 x 0.6 x 0.5. The leads are spaced at a pitch of 0.65 and feature a lead-free finish. Each device will protect one high-speed line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size, low capacitance, and high ESD surge capability makes them ideal for use in applications such as cellular phones and digital video interfaces. RClamp052PA Ultra-Low Capacitance -Line ESD protection Features Transient protection for data lines to IEC (ESD) ±5k (air), ±8k (contact) IEC (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (.0 x 0.6 x 0.5) Protects one data or I/O line Low capacitance: 0.5pF Low clamping voltage Low operating voltage: 5.0 Solid-state silicon-avalanche technology Mechanical Characteristics SLP006P2 package Molding compound flaability rating: UL 94-0 Marking: Marking code Packaging: Tape and Reel Lead Finish: NiPdAu Pb-Free, Halogen Free, RoHS/WEEE Compliant Applications Cellular Handsets & Accessories Digital isual Interface (DI) Display Port MDDI Ports USB Ports PCI Express Serial ATA Dimensions Schematic & PIN Configuration Revision 03/8/200 Maximum Dimensions () SLP006P2 (Bottom iew)
2 Absolute Maximum Rating Rating Symbol alue Units Peak Peak Pulse Power (tp = 8/20μs) Pulse Current (tp = 8/20μs) ESD per IEC (Air) ESD per IEC (Contact) P pk 00 Watts I PP 4 A ESD +/- 5 +/- 8 k Operating Temperature T J -55 to +25 C Storage Temperature T STG 55 to C Electrical Characteristics (T=25 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off oltage RWM 5 Reverse Breakdown oltage R B I t = ma Reverse Leakage Current I R RWM = 5, T=25 C μa Clamping oltage C I PP = A, tp = 8/20μs 5 Clamping oltage C I PP = 4A, tp = 8/20μs 25 Junction Capacitance C R = 0, f = MHz pf j 200 Semtech Corp. 2
3 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve Peak Pulse Power - P PP (kw) Pulse Duration - tp (μs) % of Rated Power or I PP Ambient Temperature - T A ( o C) Clamping oltage vs. Peak Pulse Current Normalized Capacitance vs. Reverse oltage f = MHz 20 Clamping oltage - C () Waveform Parameters: tr = 8μs td = 20μs C J ( R ) / C J ( R =0) Peak Pulse Current - I PP (A) Reverse oltage - R () ESD Clamping (8k Contact per IEC ) Insertion Loss S2 CH S2 LOG 6 db / REF 0 db : db 900 MHz 0 db -6 db -2 db 2 3 2: db.8 GHz 3: db 2.5 GHz -8 db -24 db -30 db -36 db -42 db Note: Data is taken with a 0x attenuator START. 030 MHz STOP MHz 200 Semtech Corp db MHz 0 MHz 00 MHz GHz 3 GHz
4 Applications Information Device Connection Options These low capacitance TS diodes are designed to provide coon mode protection for one high-speed line or differential protection for one line pair. The device is bidirectional and may be used on lines where the signal polarity is positive and negative. Equivalent Circuit Diagram Circuit Board Layout Recoendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recoended: Place the TS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. 200 Semtech Corp. 4
5 Outline Drawing - SLP006P2 A D B aaa C A TOP IEW E A C SEATING PLANE DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A A b D E e.026 BSC 0.65 BSC L R N 2 2 aaa bbb PIN ID bxn bbb C A B R e 2x L BOTTOM IEW NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP006P2 (C) G Z X Y DIMENSIONS DIM INCHES MILLIMETERS C (.033) (0.85) G X Y Z NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 200 Semtech Corp. 5
6 Marking Code Ordering Information Part Number Lead Finish Qty per Reel Reel Size N RClamp052PATCT Pb Free 3,000 7 Inch RailClamp and RClamp are marks of Semtech Corporation. Notes: )Marking will also include line matrix date code 2) Device is electrically syetrical Tape and Reel Specification Cathode Band/Date Code Location User Direction of feed Device Orientation in Tape A0 B0 K / / /-0.0 Tape Width B, (Max) D D E F K (Max) P P0 P2 T (Max) W (.65) ( ) 0.8 ±0.25 (.03).750±0. (.069±.004) 3.5±0.05 (.38±.002) 2.4 (.094) 4.0±0.0 (.57±.004) 4.0±0. (.57±.004) 2.0±0.05 (.079±.002) 0.4 (.06) (.32±.02) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 9302 Phone: (805)498-2 FAX (805) Semtech Corp. 6
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More informationSurge Components, Inc.
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Description The SRV05-4A is a low capacitance TVS (Transient Voltage Suppressor) array designed to protect sensitive semiconductor components from electrical overstress when interfaced to high-speed data
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