RClamp1502B. Ultra-Low Capacitance TVS for ESD and CDE Protection. PROTECTION PRODUCTS - RailClamp Description. Features. Mechanical Characteristics

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1 - RailClamp Description RailClamps are ultra low capacitance TS arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The RClamp TM 502B has a typical capacitance of only 0.60pF (pin to 2). This means it can be used on circuits operating in excess of GHz without signal attenuation. They may be used to meet the ESD immunity requirements of IEC , Level 4 (±5k air, ±8k contact discharge). Each device can be configured to protect bidirectional line or two unidirectional lines. These devices are in a small SC-75 (SOT-52) package and feature a lead-free, matte tin finish. They are compatible with both lead free and SnPb assembly techniques. They are designed for use in applications where board space is at a premium. The combination of small size, low capacitance, and high level of ESD protection makes them a flexible solution for applications such as Automatic Test Equipment and Infiniband circuits. Ultra-Low Capacitance TS for ESD and CDE Protection Features Transient protection for high-speed data lines to IEC (ESD) ±5k (air), ±8k (contact) IEC (EFT) 40A (5/50ns) Designed to replace polymer TS Protects up to two I/O lines Ultra-Low capacitance (<pf) No insertion loss to >.0GHz Low profile (<mm) Low leakage current and clamping voltage Low operating voltage: 5.0 Solid-state silicon-avalanche technology Mechanical Characteristics SC-75 (SOT-52) package Lead Finish: Matte Tin RoHS/WEEE Compliant Molding compound flammability rating: UL 94-0 Marking: P6 Packaging: Tape and Reel Applications Automatic Test Equipment Firewire Ports GaAs Photodetector Protection HBT Power Amp Protection Infiniband Transceiver Protection Dimensions Schematic & PIN Configuration BSC BSC 0.75 Revision 2//2009 Nominal Dimensions (mm) SC-75 L (Top iew)

2 Absolute Maximum Rating Rating Symbol alue Units Peak Peak Pulse Power (tp = 8/20μs) Pulse Current (tp = 8/20μs) P pk 00 2 Watts I PP 5 A ESD per IEC (Air) ESD per IEC (Contact) ESD 5 8 k Operating Temperature T J -55 to +25 C Storage Temperature T STG 55 to C Electrical Characteristics (T=25 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off oltage WM R Pin or Pin 2 to Pin and Between Pins and 2 5 Reverse Breakdown oltage B I t = ma Pin or Pin 2 to Pin and Between Pins and 2 R 6.7 Reverse Leakage Current I R RWM = 5, T=25 C Pin or Pin 2 to Pin and Between Pins and 2 Clamping oltage C I PP = A, tp = 8/20μs Clamping oltage C I PP = 5A, tp = 8/20μs Pin or Pin 2 to Pin Clamping oltage C I PP = 5A, tp = 8/20μs Junction Capacitance C R = 0, f = j Junction Capacitance C R = 0, f = j Pin or Pin 2 to Pin μa pf.5 pf 2009 Semtech Corp. 2

3 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve Peak Pulse Power - PPk (kw) Pulse Duration - tp (µs) % of Rated Power or IPP Ambient Temperature - T A ( o C) 6 Clamping oltage vs. Peak Pulse Current Pin or Pin 2 to Pin 40 Clamping oltage vs. Peak Pulse Current 4 8 Clamping oltage - C () Waveform Parameters: tr = 8μs td = 20μs Clamping oltage - C () Waveform Parameters: tr = 8μs td = 20μs Peak Pulse Current - I PP (A) Peak Pulse Current - I PP (A) Normalized Capacitance vs. Reverse oltage Pin or Pin 2 to Pin Junction Capacitance vs. Reverse oltage.5 Line to Ground Capacitance.2 Line to Line Capacitance Normalized Capacitance - Cj (pf) 0.5 f = Normalized Capacitance - C j (pf) f = Reverse oltage - R () Reverse oltage - R () 2009 Semtech Corp.

4 Typical Characteristics Insertion Loss S2 () Insertion Loss S2 (Pin or Pin 2 to Pin ) CH S2 LOG 6 db / REF 0 db CH S2 LOG 6 db / REF 0 db :.040 db 900 : db 900 2: db.8 GHz 2:.0200 db.8 GHz : db 2.5 GHz : db 2.5 GHz 0 db 2 0 db 2-6 db -6 db -2 db -2 db -8 db -8 db -24 db -24 db -0 db -0 db -6 db 0 00 GHz GHz -6 db 0 00 GHz GHz START. 00 STOP ESD Response (4k Contact per IEC ) START. 00 STOP ESD Response (8k Contact per IEC ) Analog Crosstalk CH S2 LOG 20 db / REF 0 db START. 00 STOP Semtech Corp. 4

5 Applications Information Device Connection Options Figure. Pin Configuration This device is optimized for protection of line operating in excess of GHz. It may also be used to protect two lines, but it is recommended it not be used much beyond GHz due to cross talk limitations. The device is connected as follows: One data line can be connected to either pin or pin 2 with the other connected to ground. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Pin is not connected. Protection of two lines is achieved by connecting data lines at pins & 2. Pin is connected to ground. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 00% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint Semtech Corp. 5

6 Applications Information - Spice Model Spice Model Table - Spice Parameters Parameter IS B J RS IB CJO TT U nit D (TS) D2 (TS) Amp.2E-4.2E-4 olt olt Ohm Farad.E-2.E-2 Amp.0E-.0E- sec 2.54E E- 9 M N --.. EG e Semtech Corp. 6

7 Outline Drawing -SC-75 (SOT-52) A D e 2 e B E E bxn bbb C A B DIMENSIONS MILLIMETERS DIM MIN NOM MAX A A A b c D E E e.00 BSC e 0.50 BSC L L (0.40) N aaa 0.0 bbb 0.20 A A2 A aaa C SEATING PLANE C H SEE DETAIL A GAUGE PLANE c NOTES: SIDE IEW. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-. DIMENSIONS "E" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS DETAILA L (L) 0 Land Pattern -SC-75 (SOT-52) X Z C G Y Y DIMENSIONS DIM INCHES MILLIMETERS C (.055) (.40) P p G X Y Z p P NOTES:. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET Semtech Corp. 7

8 Marking Ordering Information Part Number Qty per Reel Reel Size P6.TCT,000 7 Inch RailClamp and RClamp are registered marks of Semtech Corporation Tape and Reel Specification Device Orientation in Tape A0 B0 K0.85±0.05mm.85±0.05m m 0.88±0.05m m Tape Width B, (Max) D D (MIN) E F K (MAX) P P0 P 2 T(MAX) W 8 mm 4.2 mm (.65) mm mm ( ).0 mm (.09).750±.0 mm (.069±.004).5±0.05 mm (.8±.002) 2.4 mm (.094) 4.0±0. mm (.57±.00-4) 4.0±0. mm (.57±.00-4) 2.0±0.05mm (.079±.002) 0.4 mm (.06) 8. mm (.2±.02) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 902 Phone: (805)498-2 FAX (805) Semtech Corp. 8

9 Mouser Electronics Authorized Distributor Click to iew Pricing, Inventory, Delivery & Lifecycle Information: Semtech: RCLAMP502B.TCT