RClamp3324T PRELIMINARY. PROTECTION PRODUCTS Absolute Maximum Rating. Electrical Characteristics (T=25 o C Unless Otherwise Specified) I PP V R

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1 - RailClamp Description The RClamp 3324T provides ESD protection for USB3., HDMI.3/.4, and other high-speed ports. It features a high maximum ESD withstand voltage of ±25kV contact and ±3kV air discharge per IEC is designed to minimize both the ESD peak clamping and the TLP clamping. Peak ESD clamping voltage is extremely low and approximately the same at each pin. The dynamic resistance is among the industry s lowest at.35 Ohms (typical). Typical capacitance on each line to ground is approximately.4pf. This allows the to be used in applications operating in excess of 5GHz without signal attenuation. These devices are manufactured using Semtech s proprietary low voltage EPD technology for superior characteritics at operating voltages up to 3.3 volts. Each device will protect up to four lines (two high-speed pairs). The is in a 6-pin SLP7P4T package. It measures.7 x.mm with a nominal height of.4mm. The leads have a nominal pin-to-pin pitch of.4mm. The flow- through package design simplifies PCB layout and maintains signal integrity on high-speed lines. The combination of low peak ESD clamping, low dynamic resistance, and innovative package design enables this device provides the highest level of ESD protection for applications such as USB 3., HDMI and V-By-One interfaces. Circuit Diagram Low Voltage RailClamp 4-Line ESD Protection Features ESD protection for high-speed data lines to IEC (ESD) ±3kV (air), ±25kV (contact) IEC (Lightning) 5A (8/2μs) IEC (EFT) 4A (5/5ns) Flow-Through design Protects four high-speed lines Low capacitance:.4pf typical (I/O to ground) Low ESD clamping voltage Extremely low dynamic resistance:.35 Ohms (Typ) Solid-state silicon-avalanche technology Mechanical Characteristics SLP7P4T 6L package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions:.7 x. x.4 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V- Marking : Marking code + date code Packaging : Tape and Reel Applications USB 3. HDMI.3/.4 GBase-T Ethernet V-By-One Display Port MHL LVDS Interfaces esata Interfaces Pin Configuration (Top View) I/O Pin Pin 2 Pin 3 Pin 4 I/O 2 5, 6 I/O 3 I/O 4 Revision 9/24/24

2 Absolute Maximum Rating Rating Symbol Value Units Peak Peak Pulse Power (tp = 8/2μs) Pulse Current (tp = 8/2μs) P pk 75 Watts I PP 5 A ESD per IEC (Air) ESD per IEC (Contact) V ESD +/- 3 +/- 25 kv Operating Temperature T J -4 to +25 C Storage Temperature T STG 55 to +5 - C Electrical Characteristics (T=25 o C Unless Otherwise Specified) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off Voltage V RWM Any I/O to 3. 3 V Punch-Through Voltage V PT I PT = 2μA Any I/O to V Reverse Leakage Current I R V RWM = 3.3V Any I/O to Clamping Voltage V C I PP = A, tp = 8/2μs Any I/O to Clamping Voltage V C I PP = 5A, tp = 8/2μs Any I/O to Junction Capacitance C j V R = V, f = MHz, Any I/O to V R = V, f = MHz, Between I/O pins.5. μa 7 V.5 V.4.65 pf.3. 4 pf 24 Semtech Corporation 2

3 Electrical Characteristics (T=25 o C Unless Otherwise Noted) ESD Ratings (Each Pin) P arameter r S ymbo l C ondition s M inimu m T ypica l M aximu m Unit s ESD Withstand Voltage Contact discharge per IEC ESD Withstand Voltage Air discharge per IEC kv 3 kv ESD Peak Voltage V k ESD Peak Voltage V k p 8kV per IEC V p 8kV per IEC V 2 ESD Clamping Voltage V tlp 2 ESD Clamping Voltage V tlp I P P = 6A, tlp =.2/ns I P P = -6A, tlp =.2/ns.5 V V, 3 Dynamic Resistance (Positive), 3 Dynamic Resistance (Negative) 2 R Dyn 2 R Dyn tp = n s.35 Ohms tp = n s.5 Ohms Notes )ESD peak voltage measured with a 2dB attenuator, 5 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2)Transmission Line Pulse Test (TLP) Settings: t p = ns, t r =.2ns, I TLP and V TLP averaging window: t = 7ns to t 2 = 9ns. 3) Dynamic resistance calculated from I TLP = 4A to I TLP = 6A 24 Semtech Corporation 3

4 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve DR Peak Pulse Power - P PP (kw). % of Rated Power or I PP Pulse Duration - tp (µs) Clamping Voltage vs. Peak Pulse Current Ambient Temperature - T A ( O C) Capacitance vs. Reverse Voltage DR452:25:25:5 9. Clamping Voltage -V C (V) Waveform Parameters: tr = 8µs td = 2µs Capacitance - C j (pf) f = MHz Peak Pulse Current - I PP (A) Reverse Voltage - V R (V) TLP Characteristic (Positive Pulse) TLP Characteristic (Negative Pulse) 3 25 R DYN =.35-5 Current (A) 2 5 Transmission Line Pulse Test (TLP) Settings: t 5 p = ns, t r =.2ns, I TLP and V TLP averaging window: t = 7ns to t 2 = 9ns Current (A) - -5 R DYN =.5-2 Transmission Line Pulse Test (TLP) Settings: t -25 p = ns, t r =.2ns, I TLP and V TLP averaging window: t = 7ns to t 2 = 9ns Semtech Corporation 4

5 Typical Characteristics ESD Clamping at Each Pin (+8kV Contact per IEC 6-4-2) Measured with 5 Ohm scope input impedance, 2GHz bandwidth. Corrected for 5 Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane ESD Clamping at Each Pin (-8kV Contact per IEC 6-4-2) Measured with 5 Ohm scope input impedance, 2GHz bandwidth. Corrected for 5 Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane Time (ns) Time (ns) ESD Clamping vs. Positive Discharge Voltage (Contact Discharge per IEC 6-4-2) ESD Clamping vs. Negative Discharge Voltage (Contact Discharge per IEC 6-4-2) kV V pk =54.6V +6kV V PK =4.8V +4kV V pk =34.V +2kV V pk =22.5V Measured with 5 Ohm scope input impedance, 2GHz bandwidth. Corrected for 5 Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane kV Vpk= -9.2V -4kV Vpk= V -6kV Vpk= -48.V -8kV Vpk= -6.2V Measured with 5 Ohm scope input impedance, 2GHz bandwidth. Corrected for 5 Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane Time (ns) Typical Insertion Loss S2 (5GhZ) Time (ns) Analog Crosstalk Insertion Loss (db) -3-9 Insertion Loss (db) Data includes loss due to SMA connector -5.E+6.E+7.E+8.E+9.E+ Frequency (Hz) -2-4.E+7.E+8.E+9.E+ Frequency (Hz) 24 Semtech Corporation 5

6 PROTECTION PRODUCTS Applications Information Layout Guidelines is designed to protect 2 high speed differential pairs. The PCB traces enter and exit each I/O pin. Ground is connected at pins 5 and 6. Figure 2 is an example of how to route the high speed differential traces through the. The differential impedance of each pair can be controlled for high-speed interfaces such as HDMI ( Ohms +/- 5%) and USB 3. (85 Ohms +/-5%) while maintaining a minimum trace-to-trace and trace-to-pad spacing of.25mm when using.mm wide traces. These are only guidelines. Individual PCB design constraints may necessitate different spacing or trace width. Both ground pads should be connected for optimal performance. Ground connection is made using.254mm diameter filled via-in-pad. The via should be filled with a conductive paste. This technique saves board space and eliminates the capillary effect of a non filled via. I/O I/O 2 I/O 3 I/O 4 Figure - Pin Configuration Figure 2 - Example Flow-Through Layout 24 Semtech Corporation 6

7 PROTECTION PRODUCTS Applications Information USB 3. - Type A Host Connector SSTX- SSRX- SSRX+ D+ D- SSTX+ VBus uclamp54t Land Pad Trace Via Device Outline Figure 3 - USB 3. Layout (Type A Host Connector) USB 3. - Type B Device Connector SSTX- SSTX+ D+ D- VBus SSRX- SSRX+ uclamp54t Land Pad Trace Via Device Outline Figure 4 - USB 3. Layout (Type B Device Connector) 24 Semtech Corporation 7

8 Applications Information HDMI Connector HPD 5V RClamp7528T SDA SCL HEC_DAT CEC CLK CLK+ D D+ D D+ D2 D2+ Figure 5 - HDMI.4 Layout Land Pad Via Trace Device Outline Recommended Assembly Parameters Stencil Opening Assembly Parameter Recommendation.25 Land Pad ( Follow drawing ) Solder Stencil Design Laser cut, Electro-polishe d Aperture shape Rectangular with rounded corners.75 S older Stencil Thickness. mm (.4") Solder Paste Type Type 3 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD PCB Solder Pad Design Non-Solder mask defined.23.7 PCB Pad Finish OSP OR NiAu.7 Note that these are only recommendations and should serve only as a starting point for design. The exact manufacturing parameters will require some experimentation to get the desired solder application. All Dimensions are in mm. Land Pad. Stencil opening Component Recommended Mounting Pattern 24 Semtech Corporation 8

9 Outline Drawing - - SO-8 SLP7P4T PIN INDICATOR (LASER MARK) aaa C A2 A e D A B E A C SEATING PLANE DIMENSIONS MILLIMETERS DIM MIN NOM MAX A A..2.5 A2 (.3) b D E e.4 BSC e. BSC L L N 4 aaa bbb.8. e/2 LxN N E/2 Lx2 e/2 D/2 e bx6 bbb C A B NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP7P4T (C) G P/2 P P/2 P Y X Y Z DIMENSIONS DIM MILLIMETERS C (.825) G.25 P.4 P. X.2 Y.45 Y.7 Z.4 NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 24 Semtech Corporation 9

10 Marking Codes Ordering Information 3324T YYWW Part Number Qty per Reel Reel Size.TCT 3, 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. YYWW = Alphanumeric character Date Code Carrier Tape Specification 3324T YYWW 3324T YYWW 3324T YYWW Pin Location (Towards Sprocket Holes) User Direction of feed A B K Device Orientation in Tape.8 +/-.5 mm.88 +/-.5 mm.53 +/-.5 mm Tape Width B, (Max) D D E F K (MAX) P P P 2 T(MAX) W 8 mm 4.2 mm.5 +. mm -. mm ).5 mm ±.5.75±. mm 3.5±.5 mm 2.4 mm 4.±. mm 4.±. mm 2.±.5 mm.4 mm 8. mm +.3 mm -. mm Contact Information for Semtech International AG Taiwan Branch Tel: Fax: Korea Branch Tel: Fax: Shanghai Office Tel: Fax: Japan Office (Osaka) Tel: Fax: Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the U.S.A. Japan (Tokyo) Office Tel: Fax: Semtech Limited (U.K.) Tel: Fax: Semtech France SARL Tel: 33-() Fax: 33-() Semtech Germany GmbH Tel: 49-() Fax: 49-() Semtech Corporation