Table of Contents. 1 Introduction. 2 Reliability Predictions for Electronic Equipment. 3 Steady State Failure Rate Prediction for Devices

Transcription

1 Reliability Prediction Procedure for Electronic Equipment SR-332 Table of Contents Table of Contents 1 Introduction 1.1 Purpose and Scope Changes Structure of this Report Participants in the Development of SR-332, Issue Automated Reliability Prediction Procedure (ARPP) Reliability Predictions for Electronic Equipment 2.1 Purposes of Reliability Predictions Definitions Equipment Definitions Definition of a Failure Definition of Failure Rate Life Cycle of Electronic Equipment RPP Failure Rate Predictions Factors Affecting Failure Rates Outline of Methods Flow of Early Life Failure Rate Calculations Flow of Steady-State Failure Rate Calculations Items and Factors Excluded from Failure Rate Calculations Guidance for Device Types/Technologies Not in Section Statistical Considerations Upper Confidence Levels Alternate and Supplementary Methods Automated Reliability Prediction Procedure (ARPP) Steady State Failure Rate Prediction for Devices 3.1 Method I-D: Black Box Technique Method II-D: Techniques Integrating Laboratory Data When Laboratory Test Devices Had No Previous Burn-in When Laboratory Test Devices Had Previous Burn-in Method III-D: Techniques Integrating Field Data Total Operating Hours Adjustment Factor (V) Examples Example 1: Method I-D, Black Box Technique Example 2: Method II-D, Integrating Laboratory Test Data Example 2a: No Burn-In of Laboratory Test Devices Example 2b: Previous Burn-In of Laboratory Test Devices Example 3: Method III-D, Integrating Field Data Example 3a: Subject Device Is in Test Unit and Operated at the Same Temperature and Electrical Stress Example 3b: Subject Device Is in Test Unit but Operated at Different Temperature v

2 SR-332 Table of Contents Issue 3, January Early Life Factor Prediction for Devices 4.1 Early Life Factor for Device with Limited or No Burn-In Early Life Factor for Device with Extensive Burn-In Equivalent Operating Time for Burn-in Early Life Factor Examples Example 1: Limited or No Burn-In Example 2: Extensive Burn-In Failure Rate Prediction for Units 5.1 Method I: Unit Steady-State Failure Rate Using the Parts Count Method Method II: Integrating Laboratory Test Data on Units When Laboratory Test Units Have No Previous Unit/Device Burn-In When Laboratory Test Units Had Previous Burn-in Method III: Integrating Field Data on Units Total Operating Hours Adjustment Factor (V) Unit Early Life Factor Sampling Method - Using Default Temperature and Stress Factors on a Sample of Units Examples Example 1: Method I, Parts Count Prediction Example 2: Early Life Factor Example 3: Method II, Integrating Laboratory Test Data Example 3a: No Burn-In of Laboratory Test Units Example 3b: Previous Burn-In of Laboratory Test Units Example 4: Method III, Integrating Field Test Data Example 4a: Subject Unit and Test Unit are Identical and Operated Under the Same Conditions Example 4b: Subject Unit and Test Unit are Identical but Operated in Different Environments Example 4c: Test Unit Is Similar but Not Identical to Subject Unit Example 5: Method I, Parts Count Prediction, Devices Within a Device Type Have Different Operating Temperatures System Reliability (Service Affecting Reliability Data) 6.1 Serial System Reliability Steady-State Failure Rate Early Life Factor Non-Serial Systems Upper Confidence Levels for Failure Rates 7.1 Upper Confidence Level Calculation Examples Example 1: 90% Upper Confidence Level of the Steady-State Failure Rate Example 2: 90% Upper Confidence Level of the Early Life Failure Rate vi

3 Reliability Prediction Procedure for Electronic Equipment SR-332 Table of Contents 8 Device Parameter Values 8.1 Capacitor Parameter Values Connector Parameter Values Diode Parameter Values Inductor Parameter Values Integrated Circuit Parameter Values Analog Integrated Circuit Devices Digital Integrated Circuit Devices Random Access Memory (RAM) Read Only Memory (ROMS, PROMS, EPROMS) Microprocessor Microcontroller Hybrid Microcircuits Combined Analog-Digital Integrated Circuit (Gate Array and Program Array Logic) Microwave Element Devices Opto-Electronic Device Parameter Values Fiber Optic Communication Devices and Modules Other Opto-Electronic Devices Relay Parameter Values Resistor Parameter Values Fixed Resistor Variable Resistor Resistor Networks Switch Parameter Values Thermistor Parameter Values Transistor Failure Rates Rotating and Miscellaneous Device Parameter Values Failure Rate Factors 9.1 Temperature Factor Electrical Stress Factor Electrical Stress Curves Electrical Stress Percentage Quality Factor Environment Factor Appendix A: Failure Rate Units Appendix B: References B.1 Telcordia Documents B 1 B.2 External Documents B 1 B.3 Telcordia Documents Referencing SR-332 or a Predecessor B 1 B.4 Note B 5 B.5 Contact Telcordia B 5 B.6 Order Documents Online From the Telcordia Information SuperStore..... B 5 B.7 Telcordia Web Sites for Generic Requirements Information B 6 B.8 Telcordia Licensing Agreements B 6 vii

4 SR-332 Table of Contents Issue 3, January 2011 Appendix C: Glossary C.1 Acronyms C 1 C.2 Definition of Terms C 3 viii

5 Reliability Prediction Procedure for Electronic Equipment SR-332 List of Figures List of Figures Figure 2-1 Bathtub Curve ix

6 SR-332 List of Tables Issue 3, January 2011 List of Tables Table 1-1 Participants in the Development of SR-332, Issue Table 8-1 Capacitor Failure Rate Parameters Table 8-2 Connector Failure Rate Parameters Table 8-3 Diode Failure Rate Parameters Table 8-4 Inductor Failure Rate Parameters Table 8-5 Analog Integrated Circuit Failure Rates Table 8-6 Digital Integrated Circuit Failure Rate Parameters Table 8-7 Digital Integrated Circuit Failure Rates Table 8-8 Random Access Memory Failure Rate Parameters Table 8-9 Static Random Access Memory (SRAM) Failure Rates Table 8-10 Dynamic Random Access Memory (DRAM) Failure Rates Table 8-11 Read Only Memory Failure Rate Parameters Table 8-12 Read Only Memory Failure Rates Table 8-13 Microprocessor Failure Rate Parameters Table 8-14 Bipolar and NMOS Microprocessor Failure Rates Table 8-15 CMOS Microprocessor Failure Rates Table 8-16 Microwave Element Device Failure Rate Parameters Table 8-17 Fiber Optic Communication Device/Module Failure Rate Parameters Table 8-18 Opto-Electronic Device Failure Rate Parameters Table 8-19 Relay Failure Rate Parameters Table 8-20 Fixed Resistor Failure Rate Parameters Table 8-21 Variable Resistor Failure Rate Parameters Table 8-22 Resistor Network Failure Rate Parameters Table 8-23 Switch Failure Rate Parameters Table 8-24 Thermistor Failure Rate Parameters Table 8-25 Transistor Failure Rate Parameters Table 8-26 Miscellaneous Device Failure Rate Parameters Table 8-27 Rotating and Miscellaneous Device Failure Rate Parameters Table 9-1 Temperature Factors πt Table 9-2 Electrical Stress Factors π S Table 9-3 Guidelines for Determination of Electrical Stress Percentage Table 9-4 Device Quality Level Description and Factor π Q Table 9-5 Environmental Conditions and Multiplier Factors (π E ) Table A-1 Reliability Conversion Factor A 1 x