Contents. Telcordia SR-332-Documentation Information

Transcription

1 Telcordia SR-332-Documentation Information Special Report Notice Of Disclaimer iii 1. Introduction Purpose and Scope Changes Structure of the Report Reliability Predictions for Electronic Equipment Purposes of Reliability Predictions Equipment Definition of a Failure Failure Rates Factors Affecting Failure Rates Choice of Method Flow of Calculations Items Excluded from Failure Rate Calculations Instructions for Device Types/Technologies Not in Table Statistical Considerations Automated Reliability Prediction Procedure (ARPP) Steady-State Failure Rate Prediction for Devices Black Box Technique Techniques Integrating Laboratory Data When Laboratory Test Devices Had No Previous Burn-in When Laboratory Test Devices Had Previous Burn-in Techniques Integrating Field Data Total Operating Hours Adjustment Factor (V) Examples Example 1: Black Box Technique Example 2: Integrating Laboratory Test Data Example 2a: No Burn-In of Laboratory Test Devices Example 2b: Previous Burn-In of Laboratory Test Devices Example 3: Integrating Field Data Example 4a: Subject Device Is in Test Unit and Operated at Same Temperature Example 4b: Subject Device Is in Test Unit but Operated at Different Temperatures Example 4c: Subject Counterpart Device in Test Unit Is Similar but Not Identical to Subject Device First-Year Multiplier Prediction for Devices First-Year Multiplier for Device with Limited or No Burn-In First-Year Multiplier for Device with Extensive Burn-In Equivalent Operating Time for Burn-in First-Year Multiplier Examples v

2 4.3.1 Example 1: Limited or No Burn-In Example 2: Extensive Burn-In Failure Rate Prediction for Units Unit Steady-State Failure Rate Using the Parts Count Method Integrating Laboratory Test Data on Units When Laboratory Test Units Have No Previous Unit/Device Burn-In When Laboratory Test Units Had Previous Burn-in Integrating Field Data on Units Total Operating Hours Adjustment Factor (V) Unit First-Year Multiplier Sampling Method - Using Default Temperature and Stress Factors on a Sample of Units Examples Example 1: Parts Count Prediction Example 2: First-Year Multiplier Example 3: Integrating Laboratory Test Data Example 3a: No Burn-In of Laboratory Test Units Example 3b: Previous Burn-In of Laboratory Test Units Example 4: Integrating Field Test Data Example 4a: Subject Unit and Test Unit are Identical and Operated at Same Temperature Example 4b: Subject Unit and Test Unit are Identical but Operated at Different Temperatures Example 4c: Test Unit Is Similar but Not Identical to Subject Unit System Reliability (Service Affecting Reliability Data) Serial System Reliability Steady-State Failure Rate First-Year Multiplier Non-Serial Systems Tables Appendix A: References A 1 Appendix B: Glossary B 1 vi

3 Figure 2-1 Bathtub Curve vii

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5 List of Tables List of Tables Table 7-1 Device Failure Rates (Sheet 1 of 16) Table 7-2 Hybrid Microcircuit Failure Rate Determination (Sheet 1 of 2) Table 7-3 Device Quality Level Description (Sheet 1 of 2) Table 7-4 Device Quality Factors (π Q ) Table 7-5 Guidelines for Determination of Stress Levels Table 7-6 Stress Factors (ps) Table 7-7 Temperature Factors π T (Sheet 1 of 2) Table 7-8 Environmental Conditions and Multiplying Factors (pe) Table 7-9 First Year Multiplier (pfy) Table 7-10 Typical Failure Rates of Computer Related Systems or Subsystems Table 7-11 Reliability Conversion Factors Table 7-12 Upper 95% Confidence Limit (U) for the Mean of a Poisson Distribution ix