IMOLA a modular and interactive OLED-based lighting system
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1 IMOLA a modular and interactive OLED-based lighting system Jan Doutreloigne, imec project coordinator Slide 1
2 Outline Facts and figures IMOLA concept Technical objectives / challenges Project demonstrators Partner involvement Driver IC design Questions & answers Slide 2
3 Facts and figures IMOLA = Intelligent Light Management for OLED-on-Foil Applications EU - FP7 research project (STREP, ICT) Duration = 3 years Started on Oct. 1 st, 2011 Balanced consortium of 8 partners: 3 academic and research institutes 5 private companies 6 nationalities: Belgium, Netherlands, Germany, Croatia, Italy and Israel Slide 3
4 IMOLA concept Current OLED technology developments focus on material research, higher efficiency, low-cost production,... However, for fully exploiting the potential of OLED-on-foil technology in a lighting system, new developments in other domains are needed: Driving electronics Power distribution Integration & miniaturization Interaction with human environment, based on sensors... IMOLA wants to bridge this gap!!! Slide 4
5 IMOLA concept Interactive, modular, flexible, large-area, OLED-based lighting system on low-cost foil with built-in intelligent light management Laminated together Slide 5
6 IMOLA concept 3D impression: Slide 6
7 IMOLA concept Electrical connection: Slide 7
8 IMOLA concept Advantages of the modular architecture: HV power supply in combination with local down-conversion to suitable OLED voltage reduces the conduction losses in the power supply tracks increased power efficiency Possibility of displaying patterns instead of uniform lighting Sensor-based human/ambient interaction capability: light on a wall/ceiling can follow the position of a person or mimic a person s gestures, touch screen, reaction to sound, Local control allows compensation of OLED ageing effects or compensation of brightness non-uniformity increased life-time and better brightness uniformity Slide 8
9 Technical objectives / challenges Backplane technology: Development of low-cost flexible backplane (PET + Al) Process for IC mounting on backplane foil (flip-chip, UTCP) Development of suitable adhesives and ferrite pastes Lamination of OLED tiles (on foil or glass) onto the backplane foil Reliable electrical interconnection between OLED tile, driver IC and embedded inductor... Slide 9
10 Technical objectives / challenges Backplane technology: Development of low-cost flexible backplane (PET + Al) Process for IC mounting on backplane foil (flip-chip, UTCP) Development of suitable adhesives and ferrite pastes Lamination of OLED tiles (on foil or glass) onto the backplane foil Reliable electrical interconnection between OLED tile, driver IC and embedded inductor... Slide 10
11 Technical objectives / challenges Backplane technology: Development of low-cost flexible backplane (PET + Al) Process for IC mounting on backplane foil (flip-chip, UTCP) Development of suitable adhesives and ferrite pastes Lamination of OLED tiles (on foil or glass) onto the backplane foil Reliable electrical interconnection between OLED tile, driver IC and embedded inductor... Slide 11
12 Technical objectives / challenges Backplane technology: Development of low-cost flexible backplane (PET + Al) Process for IC mounting on backplane foil (flip-chip, UTCP) Development of suitable adhesives and ferrite pastes Lamination of OLED tiles (on foil or glass) onto the backplane foil Reliable electrical interconnection between OLED tile, driver IC and embedded inductor... Rigid OLED-on-glass (Philips) Flexible OLED-on-foil (TNO-Holst) Slide 12
13 Technical objectives / challenges Driver IC + inductor: Design of high-performance embedded inductor based on very tough targets (inductance, parasitic resistance and capacitance, resonance frequency,...) Development of accurate inductor model Design of power-efficient high-frequency OLED driver IC EMC-compliance (radiated + conducted emission)... Slide 13
14 Technical objectives / challenges Functionality: Compensation of OLED degradation and non-uniformity based on electrical measurements Integration of central + local intelligence for enhanced sensorbased interaction with the human environment Inter-module communication (DALI protocol)... Slide 14
15 Project demonstrators General lighting demonstrator: (Philips) Wall light Goal: alternative for Philips Living Shapes wall light, featuring reduced cost, reduced weight, reduced thickness and fully integrated electronics on a flexible backplane Slide 15
16 Project demonstrators Automotive lighting demonstrators: (CRP) Tail light Dome light Slide 16
17 Project demonstrators Intermediate demonstrators: OLED 1 OLED 2 INDUCTOR 1 INDUCTOR 2 OLED 3 OLED 4 ELECTRONICS INDUCTOR 3 INDUCTOR 4 Sensor-based interaction Intelligent backplane Flexible tail light + = Slide 17
18 Partner involvement Academic and research institutes: Imec: Project coordination OLED driver IC design Backplane technology development TNO-Holst: Supply of OLED-on-foil cells Backplane technology development Investigation of sensor options for interaction with human environment Zagreb University: Embedded inductor design EMC analysis Implementation of compensation algorithm Implementation of system-level communication Slide 18
19 Partner involvement Private companies: Hanita: Supply/development of PET + Al foils Henkel: Supply/development of ferrite pastes Supply/development of adhesives for lamination + interconnection CRP: Design/development of automotive tail light and dome light demonstrators Philips: Supply of OLED-on-glass cells Design/development of wall light demonstrator Fundico: Project administration Reporting Logistics Slide 19
20 Driver IC design Switching DC-DC buck converter with PWM control: Slide 20
21 Driver IC design Switching DC-DC buck converter with PWM control: Current sensing + feedback to control the OLED brightness! Slide 21
22 Driver IC design Block diagram of OLED driver IC COLD : Electrical feedback loop for OLED brightness control DC-DC buck converter power stage Slide 22
23 Driver IC design Layout of OLED driver IC COLD : 0.35µm 80V I 3 T80 technology of ON Semiconductor Die size: 12mm 2 Slide 23
24 Driver IC design Example: measured HV output Slide 24
25 Questions & answers Slide 25
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