Discover 3D measurements for flexible electronics: a metrology masterclass

Transcription

1 Discover 3D measurements for flexible electronics: a metrology masterclass Samuel Lesko Bruker Nano Surfaces 21 November 2013 Smithers Pira the worldwide authority on the packaging, paper and print industry supply chains

2 Housekeeping Your moderator: Dan Rogers Head of Digital Publishing +Plastic Electronics Proceedings Questions & Answers Technical issues: use chat feature Post event survey

3 Introducing Samuel Lesko Samuel Lesko, Ph.D. European Applications Manager, 13 years experience in Applications at Bruker Earned Ph.D. in Burgundy University (France).

4 Discover 3D measurements for flexible electronics: a metrology masterclass

5 Introductions Bruker Nano Surfaces Division Scanning Probe Microscopy 3D Optical Microscopy Stylus Profilometry Tribology and Mechanical Testing 10/12/2015 5

6 Introductions Bruker Stylus and Optical Metrology Technology Leadership 60+ Patents 3 R&D 100 Awards 6 Photonics Circle of Excellence Awards Manufacturing Excellence Lean, six sigma-based process >100 systems/quarter capacity Rapid production ramp capability Bruker NSD SOM is part of Bruker Materials (BMAT), a division of Bruker 10/12/2015 6

7 What you will learn today Be aware of 3D microscope techniques for metrology at nm, µm and mm scales How 3D microscopes based on light coherence help flexible electronic and PCB manufacturing Be able to decide with confidence whether this type of 3D microscope is right for your QC/QA needs Know the value delivered for accurate, gage capable imaging metrology by this core technology in flexible electronic and PCB 10/12/2015 7

8 Outline Technology review on 3D optical microscopy Principle of White light interferometry profiler Examples of imaging metrology applications Summary 10/12/2015 8

9 Surface profilometry: technology review V e r t i c a l F e a t u r e S i z e 10 mm 1 µm nm Å AFM Stylus Profiler Optical Profiler Scatterometry Å nanometers microns millimeters L a t e r a l Feature Size CMM/ Surface Contour 9

10 3D optical profiler based on WLI Z stack reconstruction by focal plan confocal interferometry Low coherence of white light discriminates focal plan and recording of Z stack allows 3D reconstruction of surface. 10/12/

11 3D optical profiler based on WLI Always the best vertical resolution Repeatability over 8µm calibration step with 5x and 50x objectives Better than 0.1% Independent from Numerical Aperture of objectives Vertical background noise < 3nm 10/12/

12 3D optical profiler based on WLI Last evolutions This technic has expanded toward: Amazing lateral resolution: up to 150 nm Rough samples: up to 65 slope with 5x objective Smooth steady slopes: 45 capability 200nm grid / abrasive cone with 60 slope / Crystals with 40 slope 10/12/

13 ContourGT and ContourSP Table top to high end automation ContourGT-I Table top automated ContourGT-K manual ContourGT-X Advanced automation with wafer loader capability SP flat panel, large substrate and PCB 10/12/

14 Polymer substrates Roughness & waviness study Mylar Fine features and large waviness affects: Adhesion of deposited film Longevity of deposited film Silicone Requirements: Fast Large field of view Vertical resolution below 1nm October 12, 2015 Slide 14

15 Inkjet Applications Development Inkjet enters new era: Custom OLED display as an OEM inkjet manufacturing RFID sensor growth New processes/ink/nozzles to refine lateral resolution OEMs supplying print devices in this space will need to verify that heads (fixed heads, disposable heads) are accurate and provide best quality volume control for end application 10/12/

16 Volume Characterization on OLED Display Manufacture Application Lateral & vertical resolution ensure proper metrology in tight GR&R requirement 0.25 pl volume dots, measured with world-leading accuracy and repeatability for ink nozzle output control 3 seconds per measurement with automated tilt/focus allows high throughput for quality monitoring over long run 10/12/

17 Brief Processing Overview Solar Large substrate a-si Thin Films Glass or Stainless Transparent Oxide Spray/Sputter/APCVD Automated Continuous Process Laser Scribe Semi-Layer Dep. PECVD/PVD/Evap/Ink Laser Scribe Metalization Screen Print Veeco Instruments Roll to Roll PVD Deposition Applied Materials PECVD Laser Scribe InnoLas Laser Scriber October 12,

18 Solar panel Silver line study Ag paste/trace analysis Accurate, fast 3D surface texture isolation, trace uniformity Volume control October 12,

19 Solar panel Texture analysis across the roll Multiple inspection points enable easy correlation and computation of relative efficiency to master 1 October 12,

20 Various texturing processes Optical 3D microscopy differentiates Acid etch (Ssk) Alkaline etch - Sbi, Sdr, Sdq October 12,

21 Copper Wire Bonding Process Reliability issues Aluminium splash on Cu bonding Splas h Depth Splas h SEM control: time consuming & partial information October 12,

22 Copper Wire Bonding Process Optical profiler Color image overlay over 3D topography Wire Bond Cavity, Depth ~ 1 µm Time to Data < 15s Sample prep = 10 mins October 12,

23 Why section is not enough? Need for 3D characterization 211% fluctuation October 12,

24 Optimisation of analysis Need for advanced functions Raw Data Remove Tilt Mask Non-Relevant Area Final Analysis 10/12/

25 Copper wire bonding Full automatic analysis Bruker Confidential Stylus and Optical Metrology Unit

26 Operator level interface One click analysis 10/12/

27 Printed Circuit Board HDI Development 10/12/

28 PCB key requirement Need longer working distance First, some sample like the IC chip below requires working distance of > 1mm so that while measuring the die at the center, the objective will not crash at the molding compound. Secondly, it is more user friendly, operator will not crash the objective on the sample easily while focusing on the sample. Z > 1 mm 10/12/

29 PCB key requirements Throughput SPEED = Image Acquisition + Data Analysis One Image Acquisition Multiple Analyses Same Speed!!! 10/12/

30 HDI PCB and Substrate Applications Via Recess / Dimple Copper Trace Roughness, depth, width on top & bottom Via Via and pad Alignment 10/12/

31 Conclusion White light interferometry profiler enables Undisturbed measurement over flexible membrane High throughput & accuracy Single characterization tool for all applications In the field of flexible electronic and PCB Contrary to other optical technic, it has intrinsic benefits of constant sub-nm vertical resolution: Safer operation PCB ready measurement 10/12/

32 Questions? Copyright Bruker Corporation. All rights reserved.

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