X-Series Test Platform

Transcription

1 Focused, Cost-optimized ATE Solutions Configurations for optimal testing of DSP, power, automotive, mixed-signal and RF applications Focused Applications The X-Series is a comprehensive semiconductor test platform, with industry leading mixed signal and digital instrumentation and configurations that range from 20 to 80 instrument slots. Focused X-Series applications include: Power and power management Automotive switches and sensors Audio: CODECS, amplifiers Printer drivers & motor controllers Automotive microcontrollers DSP: digital, MS, analog Converters: precision, high speed, embedded and audio WLAN, WiMAX, UWB, DVB, LTE, CDMA, Edge, WCDMA, Bluetooth and other emerging standards Multiband RF Power Amplifiers, RF Front End Modules, RF Analog SiP and other discrete RF devices Highly integrated mobility devices, including SIP, SoC and single chip cell phones Wireless baseband The X-Series test platform offers a range of configurations designed to provide low-cost testing of a broad range of devices used in mobile, power, automotive, industrial and instrumentation markets. The X-Series has been designed to meet the challenges of testing a broad range of advanced mixed signal device technologies used in these markets. It offers a large suite of DC, power, DSP, RF and digital instrumentation that can be configured into a true mixed signal infrastructure. The X-Series offers: Market leading 0 pin infrastructure costs designed for mixed signal testing Cost effective, incremental investment Program and DUT site compatibility across the entire platform RF port scalability to 40 ports and 8GHz (18GHz with Scalar Frequency Extender) Full featured mixed signal digital pins, up to 1024 Tester-independent feature-rich software environment Broad range of DC instruments DSP instruments support both modulation and DUT-centric testing

2 Flexible The X-Series allows you to select the ideal configuration for your specific requirements, providing a flexible solution with the right test performance and the right cost of test for each device in your portfolio. Each configuration offers a comprehensive portfolio of DSP, DC and power instruments. LX The LX configuration is available in a low cost engineering configuration featuring a limited function stand to minimize costs for engineering deployments, or as a complete production configuration. The production configuration features a full-function manipulator and docking mechanics. The LX offers: Up to 20 instrument slots Up to 256 digital pins MX The MX configuration is architected to provide optimal cost of test for advanced RF wireless, power management, computing and automotive devices. It offers high configurability, with small instrument channel increments, to produce system configurations with a lower cost of test than competitive platforms. The MX offers: Up to 40 instrument slots Up to 512 digital pins PAx The PAx has been specifically developed to address the manufacturing test challenges of advanced front end RF devices, which require ever more demanding RF test requirements in a competitive pricing environment. The PAx delivers uncompromised RF performance in a low cost system to meet these demands. The PAx offers: Up to 20 instrument slots Up to 128 digital pins EX The EX configuration is uniquely suited for a variety of applications, including mixed signal SOCs such as baseband, DVD, DTV and other digital consumer applications. Its ability to deliver high pin count and transparent multi-site programs make it ideal for high pin count SOC and SiP device testing. The EX offers: Up to 80 instrument slots Up to 1024 digital pins

3 Comprehensive Capabilities Digital Instrumentation The X-Series offers full-featured, high speed and high voltage digital options designed to provide the most cost effective system configurations for the computing, entertainment, wireless, and automotive markets. DC and Power Instrumentation The X-Series extensive portfolio of DC and power options provide the capabilities you need to address the increasingly integrated test requirements of your most advanced mixed signal devices. X-Series DC instrumentation provides accurate DC measurement, tightly controlled sequenced testing, and superior pulsed power. In addition, X-Series instrument density and channel granularity allow test systems to be tightly configured to match your device requirements, enabling the lowest cost system configurations. RF Instrumentation X-Series can be configured with your choice of RF instrumentation: XRF XRF instrumentation is designed for cost effective high volume testing of PAs, FEM, transceivers, and RF SoC for cellular, WLAN, GPS and Bluetooth. It offers an integrated, coherent RF subsystem with 16 vector ports and multisite expansion up to 40 ports. 6GHz RF Source and Measure standard, and 18GHz with the Scalar Frequency Extender (SFE) option. DragonRF DragonRF, facilitates 16 or 32 universal vector RF ports. DragonRF provides 6GHz modulated source, 8GHz measure with less than 1ms settling time, and up to 16 parallel Intermediate Frequency (IF) paths each with an analog bandwidth exceeding 200MHz. Leveraging the extensive LTXC wireless modulation and demodulation library, DragonRF comes with the complete set of tools to test the entire range of cellular GSM, Edge, GPRS, HSDPA, HSUPA, CDMA, LTE and connectivity devices including BT, BT EDR, BT4.0, GPS, a/b/g/n/ac/p and other existing or emerging standards. All of these features provide the users with faster single site testing, greater than 95% efficiency on multi-site testing, and flexible system configuration to match the cost with the users testing requirement. DSP Instrumentation The X-Series DSP instrument suite provides flexibility and scalability for video to high precision instrumentation data converters, offering a range of AWG and digitizers, and supporting both modulation and DUT-centric testing. The Data Converter Test Module (DCTM) instrument provides capabilities needed to address the precision test requirements for advanced data converters, audio and power amplifiers and other mixed signal devices to better than 1 ppm. In a single card slot the DCTM provides 16 channels of independent AC or DC source and measure, making the DCTM ideal for multi-site testing, significantly lowering the cost of test.

4 X-Series Test Platform Comprehensive Capabilities Fast test program development to address the critical time-to-market demands of the consumer electronics market, Powerful test program development tools to streamline the validation process of complex systemon-chip and system-in-package devices, Highly flexible test program structure to allow a single test program to serve an entire device family across wafer sort, final test, and different site counts, Protection of legacy test program investment by being able to run legacy test programs in the Unison software environment. Time Measurement Instrumentation The X-Series offers full-featured time measurement instruments with event digitization, hysteresis, and wide voltage ranges. Instrumentation includes both an integrated and stand-alone quad instrument for low speed, high voltage measurements to parallel asynchronous signals. Software The X-Series can be configured with your choice of software: envision A productive, proven programming environment for device oriented test program development, offering: IP reuse tools enable rapid test development for critical device time to market advantages Concurrent test with inherent capabilities for test time optimization beyond device segmentation Transparent multi-site programming with minimal development time Graphical tester debug tools for quick tester to device interactions Unison Our next generation cross platform software contains a full suite of graphical software tools for test creation, debug, characterization and highvolume production of digital and consumer ASSP devices. Based on industry standards such as the IEEE Standard Test Interface Language (STIL), C++, and Linux. A common graphical test programming environment for Diamond, X-Series, and future product offerings enabling easy migration of

5 Specifications General PAx LX MX EX Instrument slots or 40, field upgradeable 40 or 80, field upgradeable Digital pin count Up to 128 Up to 256 Up to 512 Up to 1024 Thermal management Prober and handler interfaces Instrumentation Air cooled Standard interfaces available for all probers and handlers Broad range of DC, RF, DSP, and time measurement instrumentation Electrical Single phase 208 VAC, ± 10% Three-phase 208 VAC, ± 10% Ethernet Other Test head dimensions 26.5 T x 32.5 W x 21 D (82 cm W x 67cm T 53 cm D) Required No compressed air or chilled water requirements T x 27.5 W x 27.5 D (70 cm W x 91 cm T x 70 cm D) 26.5" W x 20.5" T x 43.25" D (67 cm W x 52 cm T x 109 cm D) 38.75" W x 20.25" T x 41" D (98 cm W x 51 cm T x 104 cm D) Test head weight 350 lbs (159 Kg) 350 lbs (159 Kg) 255 lbs (95 Kg) fully loaded 437 lbs (199 Kg) fully loaded Mainframe dimensions 66.5 W x 53.5 T x D (169 cm W x 136 cm T x 68 cm D) (Test Head, Mainframe & std manipulator) Not applicable 27.62"W x 68.25" T x 32.75" D (70 cm W x 173 cm T x 83 cm D) 27.62"W x 68.25" T x 32.75" D (70 cm W x 173 cm T x 83 cm D) Mainframe weight 500 lbs (227 Kg) Not applicable 465 lbs (211 Kg) without PPVI and RF 465 lbs (211 Kg) without PPVI and RF Digital Instrumentation I/O Max Pins Drive/Comp Pattern Rate DDP (PAx only) V to 6.5V 33/66MHz FX1 16 NA/128/256/ V to 6.5V 200Mhz/400Mbps FX2 32 NA/256/512/1024-2V to 6.5V 200Mhz/400Mbps FX-HS 16 NA/64/128/256-2V to 6.5V 400Mhz/800Mbps FX-HV 16 NA/128/256/512-1V to 24V 50Mhz/65Mbps DC & Power Instrumentation Power I/O Max Pins Max Current Continuous/Pulsed Max Voltage HCOVI A, ganged to -2V to +8V 8A per card HVVI 8 NA/32/128/128 50mA / 500mA -40 to +100V QFVI 4 NA/8/32/32 1.5A / 5A ±60V Gang to 20A Stack to 240V VS1K 8 NA/16/16/16 20mA (MI only) +1000V DC VI /128/256/ mA ±16V VI16B 16 NA/128/256/ mA +44 to -4V OVI 8 NA/72/144/ mA / 1A ±16V DSP Instrumentation I/O Max Pins Resolution Sample Rate AWG-HR 2 NA/12/24/48 24 Bits 768 Ks/s DIG-HR 2 NA/12/24/48 16 Bits 500 Ks/s SWG-HSB 2 12/12/24/48 16 Bits 250 Ms/s DIG-HSB 2 12/12/24/48 14 Bits 105 Ms/s DCTM High Precision Instrumentation I/O Max Pins Key Specifications DCTM(DC) Source 8 NA/32/64/128 <1 PPM Linearity DCTM (DC) Measure 8 NA/32/64/ dB CMRR DCTM (AC) Source 8 NA/32/64/ dB THD+N DCTM (AC) Measure 8 NA/32/64/128 >130dB Null Mode SFDR RF Instrumentation Max Pins Frequencies Range RF16D 16 10MHz to 6GHz -130 to +10 dbm DragonRF 16/32 10MHz to 8GHz -130 to +23 dbm Software Time Measurement Instrumentation I/O Max Pins Resolution/ Max Voltage Accuracy FX-TMP 1 per 128 1/2/4 30ps Resolution Per Dig Pin digital pins QTMP 4 16/32/64 30ps Resolution +100V/-15V Software environment Operating systems envision or Unison High speed Performance Linux based PC All specifications are subject to change without notice LTX-Credence Milpitas, CA T: Xcerra Corporation All rights reserved. Xcerra, LTX-Credence, LTXC, Integrated Multi-system Architecture, IMA, all product names and the LTXCredence, XC, and IMA logos are trademarks of Xcerra Corporation and its affiliates.