Recent IoT/Automotive device Trends and testing challenges Presented To: SiP Conference China 2018 Presented By: Kotaro HASEGAWA

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Erica Arnold
5 years ago
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IoT Market Trend Morgan Stanley IoT sector survey 2017

IoT Module Standardization 2018/10/19 All

Sensing Image Sensing, LIDAR High Dynamic Range, Faster data transfer

Analyzing Decision Testing: Dark test sensitive, Image overlay As

FPGA, ASIC are rapidly growth GPU for AI is new segment of growth.

9 Sensing Image Sensing, LIDAR High Dynamic Range, Faster data transfer Processor/Memory embedded CIS Sensor fusion as integrated module Analyzing Decision Testing: Dark test sensitive, Image overlay As embedded devices Interface standardization Processing, AI Automotive FPGA, ASIC are rapidly growth GPU for AI is new segment of growth. Game changing and new company comes Testing: Guaranteed under many situation. Gap between Virtual Test driving and Real situation Source: SEMA 2016 COURTESY SAFELIGHT AUTOGLASS AND BOSCH 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 9

Controlling Engine, Motor Safety control Timing and level high accuracy control (x4

Higher temperature operation ( ~ 200 ) Energy efficiency 48V battery integration,

efficiency test High voltage rating test EV/HV Power Train ESD, Alternator Safety /

10 Controlling Engine, Motor Safety control Timing and level high accuracy control (x4 in 2years ) Integrated ECU to reduce harness on Vehicle. Higher temperature operation ( ~ 200 ) Energy efficiency 48V battery integration, Higher engine management accuracy Testing: Energy saving operation, low energy efficiency test High voltage rating test EV/HV Power Train ESD, Alternator Safety / Body ABS, Air Bag, Motor Cont., Breaking SOI BCD 200V/300V BCD 80V/120V 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 10

11 Trend of Integration Sensor + Processor + Memory Imaging, Magnetic, Pressure Power + MCU (ISPM) MCU + memory MCU +BaseBand + RF + antenna Motor Driver + MCU I/F CPU SiP High integrated SoC Module Hybrid packaging 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 11

12 SiP benefits Fast market launch Different process integration IP/Die/Process Reusability Low noise Faster bus communication SiP Small footprint 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 12

shifting Limited test port on package Highly

Die to die communication, timing marginal

for high quality SiP Packaging type variety

13 SiP technical challenges for testing Interposer connectivity, warpage, die shifting Limited test port on package Highly integration cause more testing requirement Die to die communication, timing marginal Stress (Level, Timing, Processing) testing for high quality SiP Packaging type variety for handling 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 13

15 IC level quality control to be 0 defect Early stage detecting (KGD) Package test with Quality Tracking, control De-facto Standard platform Massive Parallel for standardized device Best Cost of Test T2000, V93K 30+ years Automotive experiences 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 15

18 Function Test Application Layer Test DUT Centric Fixed mother board Legacy System Level Test Limited Failure coverage More high integrated complex device More stress condition is required Scan testing required DC parametric test required Fixed mother board design No flexibility Cannot execute trimming, fusing process Power profiling requirement coverage 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 18

Hybrid SLT Physical Layer Test ATE Centric Legacy ATE Test Time For Mass Prod.

19 Function Test Fixed mother board Scan/DFT Test Parameter Test Level/Timing Stress Test DPS stress test WS FT Application Layer Test DUT Centric Legacy System Level Test Hybrid SLT Physical Layer Test ATE Centric Legacy ATE Test Time For Mass Prod. Parallel Test Hybrid SLT /Trim End product 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 19

20 Measurement system for SiP EVA100 Ease of Use (Device behavior base arch.) Scalable to manufacturing System Level Test with Power Supply control (Vbuming, Profiling etc) Deep depth SCAN resources High Accuracy Parametric resources with high pin count (1024ch) Full package of Debugging, Analyzing feature 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 20

21 DUT Centric Device Test System Level Test Input DUT Output Input DUT I/F Output I/O CPU Resister, Test Mode Script Resister Test Program Test Program 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 21

22 Test program integrated system level testing I2C Test Flow WiFi SoftAP Test 11b (2.4GHz) Flow Editor SPI UART WiFi SoftAP Test 11g (2.4GHz) WiFi SoftAP Test 11n (2.4GHz) Test Result WiFi SoftAP Test 11a (5GHz) WiFi SoftAP Test 11n (5GHz) WiFi SoftAP Test 11ac (5GHz) HDMI validation Confirm by Instruments 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 22

23 R&D, QA (Temp., Voltage stress) Module Tester Compact SLT Cell High-mix low-volume Many I/F (USB, Ethernet, ) Large Scale SLT Cell Ultra high volume production & Long time of SLT Robot Arm 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 23

November 11, 2009 Chang Kim ( 김창식 )

Test Cost Challenges November 11, 2009 Chang Kim ( 김창식 ) 1 2 Where we are!!! Number of Die per wafer exponentially increasing!! Bigger Wafer Diameter 150mm 200mm 300mm 450mm 2000 2005 2010 2015 1985 1990