YANG AN ELECTRONICS CO., LTD.

Transcription

1 YANG AN ELECTRONICS CO., LTD. Professional Printed Circuit Board & Flex Printed Circuit Board Manufacturer

2 CONTENTS COMPANY INFORMATION BUSINESS OVERVIEW CAPABILITIES & TECHNOLOGY VISION

3 Company Information YANG AN is devoted to deliver the time-critical quality PCB & FPCB products to our clients since From our effort to remove variability in our system, we have a strong foundation to supply products complying with customers' specifications. Accordingly, our customer base is expanding yearly. ESTABLISHED JUNE 1987 MEN IN CHARGE CAPITAL Factory Location TOTAL CAPACITY CHAIRMAN PRESIDENT SPOKESMAN (VP) USD $50 million Taoyuan City, Taiwan - HQ Jhong Li City, Taiwan WuXi City, China 1,500,000 feet 2 / month Mr. Wei-Chang Yang Mr. James Yang Mr. George Chao

4 TaoYuan Plant-HQ Product Printed Circuit Board Land Area 10,765 m² Production Area 34,000 m² Employee 700 (Foreign workers 115) Capacity 800,000 feet² / month TEL FAX Address 246, Gwo Jih Rd., Sec. 1, Taoyuan, Taiwan, R.O.C

5 ChungLi Plant Product Land Area Production Area Flexible Printed Circuit Board 11,000 m2 6,600 m² Employee 150 (Foreign workers 21) Capacity 150,000 feet² / month TEL FAX Address No,16-1 Songjiang.N.Rd., Jhongli City. Taoyuan, Taiwan, R.O.C.

6 WuXi Plant Product Land Area Production Area Printed Circuit Board 76,758 m2 24,292 m² Employee 800 Capacity 450,000 feet² / month TEL FAX Address Fu-Rong 3rd Rd., Xi- Shan Economic Development District, Wu-Xi City, Jiang-Su Provice, P.R.C

7 ORGANIZATION - HQ Auditing President Office of President VP VP VP VP Sales Div. Manuf. Div. FPCB Manuf Div. R & D Div. QA Div. Admin Div. Finance Dept Sales 1 P. Ctl. P.Ctl. Design QA HR Account Sales 2 Sales 3 Prod. Design Develop QC E-TEST MIS Financial Sales 4 FQC Purchase Sales 5 Sales 6 Customer service

8 SALES REVENUE USD Million PCB Flex PCB

9 CERTIFICATES CERTIFICATE of SYSTEM YEAR ISO TY 1994 ISO TY & CL 1998 ISO 9001: TY, CL & WU 2000 TL TY 2001 TS TY 2006 CERTIFICATE of PRODUCTS YEAR UL (E114139) - TY, CL & WU 2001 Bellcore - TY 2003 It is important that our quality is recognized by international standards. The awards and certificates reinforce our effort to provide quality products to our customers.

10 SALES & PRODUCT DISTRIBUTION - PCB 8 Layers and Above 20% 2 Layers 25% 6 Layers 25% 4 Layers 30% Europe 5% USA 25% Domestic (Taiwan) 55% East Asia 15% *Current Main product: TFT-LCD (TV, Monitor & Laptop), Automotive, Memory Module, Telecom, Medical, PC Peripherals and so forth.

11 SALES & PRODUCT DISTRIBUTION - FPCB icrovia Products 0.1 elecom & Automotive 0.05 thers 0.05 ayer Count ingle Side 0.5 ouble Side 0.4 ultilayer 0.1 Multilayer 10% Double Side 40% Single Side 50% 150 um Year um 100 um Prepunch 150 um 120 um 150 um 200 um Single sided Double sided

12 MAJOR CUSTOMERS We have both domestic (Taiwan) and global customers. Since we are able to deliver quality products on-time, we have a stabilized customer based. It is our goal to provide time-critical PCB & FPCB and surpass our competitors in the tradition of our continual growth and progress. PCB: FPCB: AUO CMO CPT DOMESTIC CUSTOMERS HANNSTAR USI FOREIGN CUSTOMERS ADC TELECOM JABIL BI ELECTRONICS SOLECTRON NAVICO CUSTOMERS End Customer KURADA INNOLUX (Moto V3) TPO CHILIN GREEN POINT GROUP POWERTIP TECH CANON/Moto/HTC CHINA/EUROPE INNOLUX Europe/China/Benq

13 Capability & Technology Roadmap PCB (1) Process Current Items Step Standard advance Min.Line Width /Space 4/4 mil 3/3 mil 2/2mil 2/2 mil Inner Layer Board Dimension Lamination Material Drilling Technology Roadmap (1) Min Copper Thickness (Width /Space) 0.5 mil (4/4 mil) 0.5 mil (3/3 mil) 0.5 mil (2/2 mil) 0.5 mil (2/2 mil) Max Copper Thickness (Width /Space) 1 oz (4/4 mil) 2 oz (5/5 mil) 3 oz (6/6 mil) 4 oz (8/8 mil) Min Core Thickness 4 mil 2 mil 2 mil 2 mil Max Core Thickness 47 mil 110 mil 110 mil 130 mil Min Prepreg(Thickness) 106(2mil) 106(2mil) 106(2mil) 106(2mil) One Sheet max Prepreg(Thickness) 7630(8.5mil) 7630(8.5mil) 7630(8.5mil) 7630(8.5mil) Max.Panel Size 20 x x x x 24 Max.Finish Board Size 16 x x x x 22 Max.Board Thickness 95mil 130 mil 130 mil 140 mil Layer Count 12L 14 L 16 L 18L Layer to Layer Registration Request Material,Tg +/-3 mil 140/150 +/-2 mil 170/180 +/-2 mil 180/200 +/-2 mil 180/200 Halogen Free Flammability UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0 Low Dk Material 4.2~ ~ ~ ~3.5 Min. Mechanical Drill Size(PTH) Min. Hole to Hole Pitch 10 mil 26mil 8 mil 24 mil 6 mil 18mil 6mil 18mil NOTE: RD-RESEARCH & DEVELOPMENT, LP-LIMITED PRODUCTION, MP-MASS PRODUCTIONNR-NO RESEARCH

14 NOTE: RD-RESEARCH & DEVELOPMENT, LP-LIMITED PRODUCTION, MP-MASS PRODUCTIONNR-NO RESEARCH Capability & Technology Roadmap PCB (2) Process Current Items Step Standard advance Plating Outer Layer Material Finish Solder Mask Testing Aspect Ratio D9.8/T62 D7.8/T62 D7.8/T62 D6.2/T62 Cu Thickness in Through Hole >0.8 mil >0.8 mil >0.8 mil >0.8 mil Line Width/Space 4/4 mil 3/3 mil 2/2 mil 2/2 mil Min. Copper Thickness (Width /Space) 1.0mil (4/4 mil) 1.0 mil (3/3 mil) 0.7 mil (2/2 mil) 0.7 mil (2/2 mil) Electro Nickel >150μ >150μ >150μ >150μ IMG. Gold 2μ-4.5μ 2μ-4.5μ 2μ-4.5μ 2μ-4.5μ IMG. TIN 30μ-50μ 30μ-50μ 30μ-50μ 30μ-50μ IMG. Silver 6μ-20μ 6μ-20μ 6μ-20μ 6μ-20μ HASL Lead Free 50~1000μ 50~1000μ 50~1000μ 50~1000μ HASL,Aspect Ratio <= Selective EN/IMG+OSP Entek Cu-wpf-207 Thickness S/M Thickness YES 8~20μ >0.2 mil YES 8~20μ >0.3 mil YES 8~20μ >0.3 mil YES 8~20μ >0.3 mil Solder Dam Width 3 mil 2 mil 2 mil 2 mil S/M Registration Tolerance Max.Test Points Per Board (O/S Test) Smallest SMT Space +/-2 mil 26,000 8 mil +/- 1.5 mil 30,000 6 mil +/- 1.5 mil 40,000 5 mil +/- 1.5 mil 40,000 5 mil

15 NOTE: RD-RESEARCH & DEVELOPMENT, LP-LIMITED PRODUCTION, MP-MASS PRODUCTIONNR-NO RESEARCH Capability & Technology Roadmap PCB (3) Process Current Items Step Standard advance Others Process Step Impedance Control Tolerance Differential Impedance Control +/- 10 % +/- 8 % +/- 7 % /- 5 % +/- 10 % +/- 8 % +/- 8 % +/- 8 % Tolerance Via-In-Pad (VIP) 12mil 10~8mil 8mil 6mil Thick Copper (Width /Space) 2oz (5/5mil) 3oz (6/6mil) 4oz (8/8mil) 4oz (8/8mil) Rigid-Flex Board Sample limit production mass production Items Current NPN-150 Material test limit production mass production Others NPN-170 Material test limit production mass production NP-140M Material test limit production mass production

16 Production Capability China Plant Item Description 1Q 08 2Q 08 Layer count 2 ~ 6 Based Materials FR4 Tg140-Tg170 Copper thickness Inner & Outer layer H & 1 oz Working Panel Size 21 x 24 Layer to Layer Registration Machanical Drill Aspect Ratio Min. Line/Space Surface Finish Type +/-3 mil 8mil 6.3 (D9.8/T62) 4mil ENIG & OSP Controlled Impedance +/-10%

17 Capability & Technical Road Map - FPCB Item Min. Pitch of S/S FPC 70 um 38 um 30 um Min. Pitch of D/S FPC 100 um 70 um 50 um Min. Pitch of multi layer FPC 150 um 100 um 80 um Solder resist misalignment +/-0.15 mm +/-0.1 mm +/-0.07 mm Outline punch misalignment +/- 0.2 mm +/-0.15 mm +/- 0.1 mm Connector punch misalignment +/-0.07 mm +/-0.05 mm +/-0.05 mm OLB shrinking rate +/-0.07% +/-0.05% +/-0.05% Silk printing line width (min.) 0.15 mm 0.1 mm 0.1 mm Silk printing misalignment +/-0.15 mm +/- 0.1 mm +/ mm Via. Hole size 0.1mm 0.1mm 0.1mm

18 VISION CHINA WUXI FACTORY FUTURE MAIN PRODUCT RIGID-FLEX PRODUCTION EXPANDING WORLDWIDE BUSINESS

19 LOCATION OF YANG-AN CHINA WuXi is approximately 180 Km from Shanghai Airport & 50 Km from New WuXi Airport is also available. To supply Rapid service to both domestic and oversea customers. WuXi ShangHai

20 WuXi FACTORY BIRD S EYE VIEW Additional Future Expansion Sewage Treatment Area Dormitories of Local employers Wuxi Plant 1 Dormitory of Taiwan employers

21 WuXi FACTORY Building

22 FUTURE MAIN PRODUCT TFT-LCD : TV, Monitor & Notebook Memory Module : DRAM Modules DDR1~3 Automotive : GPS & Parts HDI Products : NB, DSC, PDA & Mobile Phone ETC Niche Products

23 YANG AN ELECTRONICS CO., LTD. Thank You