A Professional PCB Manufacturer. Meeting ISO Standards. Contact Us Now. Contact information:

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1 Address: Room 1301, Tianyue Building, NO.110 Zhongxin Road,Shajing Twon,Baoan district, Shenzhen,China A Professional PCB Manufacturer Shenzhen Well-Wisdom PCB Co. Ltd was established in 2010, which is the overseas marketing company of Boluo Xian Well-Tech PCB Co. Ltd, established in 2004, with a registered fund of $1.5 million. Currently, our total investment is $10.5 million. We are a professional PCB manufacturer focusing on high mix, low volume, quick turn service, as well as build double layer, multi-layer and aluminum-based boards. Our products are widely used in consumer electronics, computer, lighting, industrial and automotive. Currently, we have 20,000-square-meter factory area and 668 staff. Our yearly capacity is over 300,000 square meters and we are ready to try our best to provide one stop service to all customers. Meeting ISO Standards Our PCB markets are facing a keen competition for a lower cost with a higher quality requirement. To meet these requirements, we have a stringent quality system which is compliant to ISO 14001, ISO 9001, ISO/TS and UL (E363740), as well as RoHS recognition. Contact Us Now We strive to provide good services to meet our valuable customer s needs by manufacturing PCB ranging from one layer to 12 layers. Since its establishment in 2004, our company has been developing to a high technology concentrated and research guided professional PCB manufacturer. For more detailed information regarding our products, contact us now. Contact information: Manager Moonzhou Moonzhou@well-wsidompcb.com Sales manager Julia Julia@well-wisdompcb.com Sales manager Nicole Nicole@well-wisdompcb.com Technical director Byron szwzsales@well-techpcb.com 1

2 Address: Room 1301, Tianyue Building, NO.110 Zhongxin Road,Shajing Twon,Baoan district, Shenzhen,China PCB Pictures 12L 6.5MM 6OZ 4L 0.4MM 1OZ Halogen Free 2L 2.0MM 1OZ 6L 1.6MM 1OZ G/F 30U 2

3 PCB Pictures 4L 1.0MM 1OZ 8L 1.6MM 1OZ 4L 1.6MM 2OZ 6L 1.0MM 1OZ 3

4 Technical parameter Project 项目 Specification 规格 Factory Assessment 工厂评定 Layers Count 层数 Min-Max 1 layer-12ayer Warp & Twist 板弯板翘 <=0.75% Panel Size( 尺寸 ) Max 510*1100MM Material type 板材类型 Double Layer 双面板 Multilayer 多层板 Board Thickness 材料厚度 Artwork 底片 Inner layer (Signal layer) 内层 Copper Foil Thickness 芯板铜箔厚度 Minimum Core Thickness 最小芯板厚度 Copper Foil Thickness (Inner Layers ) 芯板铜箔厚度 ( 内层 ) Copper Foil Thickness (Outer Layers) 铜箔厚度 ( 外层 ) Minimum Core Thickness 最小芯板厚度 Minimum B-stage Thickness 最小 PP 厚度 Minimum Board Thickness (Double-Sided) 最小板厚 ( 双面板 ) Minimum Board Thickness (Multilayers Board) 最小板厚 ( 多层板 ) Maximum Board Thickness (Double-Sided) 最大板厚 ( 双面板 ) Maximum Board Thickness (Multilayers Board) 最大板厚 ( 多层板 ) Minimum Line width 最小线宽 3mil Minimum space between circuits 4mil 最小线距 CEM-3,FR4,Aluminium base, High TG, Halogen-free ( )oz 0.4mm ( )oz ( )oz 0.1mm 2.0mil 0.4mm 0.4mm 3.2mm 3.2mm 4

5 Project 项目 MechanicalDrill(Through-holes) 钻孔 ( 通孔 ) 机械钻孔 Through holes 过孔 Electroless Nickel / Immersion Gold 化镍 / 金 Immersion Silver (over copper) 化银 HAL 喷锡 OSP 抗氧化 Inner Layer and Outer Layer ( 内外层 ) Outer Layer Imaging 外层成像 Artwork 底片 Outer layer 外层 Drilling 钻孔 Specification 规格 Minimum Via Diameter (After Plating) 最小过孔直径 ( 沉铜后 ) Maximum aspect ratio 最大板厚比最小孔径 ( 纵横比 ) Minimum / Maximum Nickel Thickness 最小 / 大镍厚 Minimum / Maximum Gold thickness 最小 / 大金厚 Minimum / Maximum Silver thickness 最小 / 大银厚 Minimum / Maximum Solder thickness 最小 / 大锡厚 Minimum / Maximum Coating thickness 最小 / 大膜厚度 Minimum Line width / spacing tolerance 线宽 / 线距 Artwork registration tolerance 底片对位公差 Min line width 最小线宽 space between circuits 最小线距 space between BGA PAD to circuit BGA 焊盘到线的距离 accuracy of hole to hole 钻孔孔位精度 Space between hole edge 孔边到孔边距离 lint to hole size 孔到线距离 Mini diameter of slot hole Slot 孔最小孔径 Tolerance of PTH hole size PTH 孔公差 Factory Assessment 工厂评定 0.2mm 10: u" 1-5u" 0.1um-0.5um 1um-40um 0.2um-0.6um 3mil/4mil 2mil 4mil 4mil 0.15mm 3mil 12mil 4L:7mil; 6L:8mil 0.2mm 3mil 5

6 Project 项目 Specification 规格 Factory Assessment 工厂评定 Minimum opening path on pad (one side) 防焊 PAD 开窗单边 (b) 3mil Solder Mask 防焊 Tolerance of exposure registration 曝光精度 Minimum solder mask Thickness (Above Trace) 最小油墨厚度 ( 线路上 ) Minimum solder mask strip (pass tape test) 最小绿油桥 ( 通过抗拉测试 ) 2mil 10um 0.1mm Solder Mask 防焊 Color of Solder Mask 阻焊颜色 绿蓝白红黑 /green blue white red black Legend (Silkscreen) 文字 Minimum height & width of legend 最小文字高度与宽度 Minimum spacing between legends 文字最小间距 0.15mm 0.13mm Routing 成型 Mini space between routing edge to copper surface 成型边到铜面的间距 Length & width of routing slot(tolerance) 成型槽长宽公差 0.25mm 0.1mm V-cut angles V-CUT 角度 V-cut Min space between V-cut edge to V-cut edge V-CUT 到 V-CUT 的最小距离 Min space between V-cut edge to board edge V-CUT 到板边的最小距离 3mm 3mm Beveling angle 斜边角度 Gold Finger 金手指 Tolerance of beveling depth 斜边深度公差 0.15mm Tolerance 公差 10% Impedance Control 阻抗控制 Space between probes 测针间距 0.15mm 6