Advanced Wafer Level Chip Scale Packaging Solution for Industrial CMOS Image Sensors Jérôme Vanrumbeke

Transcription

1 Advanced Wafer Level Chip Scale Packaging Solution for Industrial CMOS Image Sensors Jérôme Vanrumbeke Project Manager, Professional Imaging

2 Agenda

3 Agenda e2v Professional Imaging WLCSP for CIS Background Summary EV76C570 Sapphire 2 Mpx - WLCSP Demonstrator EV76C541 Sapphire WVGA - WLCSP Product WLCSP Product Development and Industrialization Conclusion

4 e2v Professional Imaging

5 e2v Professional Imaging Markets Innovation Partner, inspiring market leaders DEEP KNOWLEDGE OF IMAGING AND VISION APPLICATIONS Healthcare Automation Safety Drug discovery Life science X-ray Ophthalmology Bar code reading Food sorting Machine vision Flat panel display inspection 3D Imaging Low light surveillance Night vision Traffic surveillance

6 WLCSP for CIS Background Summary

7 WLCSP for CIS Background Summary Expanding from Consumer to Professional Applications Long History 1990 s : T-Contacts based (Original Shellcase CSP Patent 1990 s) 2000 s : Through Silicon Via (TSV) based (2000 s Shellcase / Tessera MVP, ). Via last technology. Nowadays : Expanding from Core Business Consumer Markets to Professional Markets. Key Parameters X,Y Integration Low Profile Low Cost Reliability

8 WLCSP for Professional CIS EV76C570 Demonstrator & EV76C541 Product

9 From the Demonstrator WLCSP Demonstrator : EV76C570 Sapphire 2Mpixels Quick Demonstrator with existing device, Based on TSV WLCSP Process (cavity type). Die Size beyond WLCSP technology limits. Evaluation : Electrical Tests, Reliability Trials MSL4, Comparison with nominal Ceramic LCC package solution.

10 to the Product EV76C541 Sapphire WVGA Product Silicon Design fully compliant with WLCSP Technology. Process development to adapt WLCSP to demanding professional markets. Enhanced Reliability : MSL3 / Mechanical Stress / Life Test Full Qualification - Comparison with nominal CLCC package solution. Status : In production

11 Mechanical Data Demonstrator Product EV76C570 Sapphire 2M WLCSP EV76C541 Sapphire WVGA WLCSP Resolution 2M 0,36M Pixel Area 1600x x480 Pixel Size (µm) 4,5 4,5 Die Size : X Y (mm) 8,18 8,13 4,65 4,64 Pkg OD Size (mm) 8,37 8,24 4,76 4,75 Pin Count Pin Pitch (mm) 0,8 0,5 Ball Diameter (mm) 0,35 0,25 Ball Height (mm) 0,18 0,13 Air Gap (mm) 0,045 0,045 Glass Tkn (mm) 0,4 0,4 Pkg Height (mm) 0,81 0,73

12 WLCSP Product Development and Industrialization

13 Design for Manufacturing Design Rules applied for EV76C541 Product Die Size : 21,6mm² Scribe Line Width : 160µm Die Pad size / Pitch : 80µm sq / 275µ Min. Pixel Area to Die Edge : 360µm Min. Dam Width : 250µm Min.

14 WLCSP Process Flow Overview Cost Competitive Process

15 WLCSP Process Development Technology Upscale Process Development was performed to adapt WLCSP technology to demanding CIS applications : Process yield and product reliability. Wafer bonding Process Development : Dam Design, Dam deposition, Glue Material... Cross Section - EV76C541 Product DAM Design A DAM Design B

16 Thermal Simulation (1/2) 3D Mesh View Bill of Materials WLCSP Material Thermal Conductivity [W/m.K] Die Silicon 95 Balls SAC Si Encapsulant BSM 0.3

17 Thermal Simulation (2/2) Boundary Conditions : Total Power dissipation : 174mW Reference Temperature = 0 C at bottom of balls Thermal Maps Max. Die Temperature : 7.78 C Temperature Gradient on Pixel Area : 1.8 C

18 Electro Optical Performances EV76C541 Sapphire WVGA - Sensor Key Performances EV76C541 WLCSP EV76C541 CLCC Parameter Unit Typical Value Typical TA 25 TA 25 C Dark Signal LSB10/s DSNU (rms) LSB10/s PRNU (rms) % <1 <1 Q.E. (550nm) % Key Performances are the same for WLCSP version and Ceramic LCC versions

19 SIGNAL LOSS (%) Particles Size sensitivity Signal Loss vs Dust Ø on Top of Glass 100% WLCSP Lid 400µm CLCC Lid 550µm Contrast 10% Contrast 40% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% DUST DIAMETER ON TOP OF THE GLASS LID (µm)

20 Reliability Trials Trials Flow & Conditions Industrial grade compliant Std Ref Condition Results Precond +125 C Preconditioning JESD22-A113F Moisture Soak : +30 C / 60% RH MSL3 J-STD-020-C Reflow : +245 C - 3x PASS HTSL JESD22-A103D 168H / 500H / 125 C PASS THT JESD22-A101C 168H / 500H / 85 C / 85% RH PASS TCT JESD22-A104D 500C / -40 C to C PASS HTOL JESD22-A108B 168H / 500H / Tj>125 C Vcc > Vcc Max. PASS ESD PASS Human Body Model JESD22-A114B Class 2 / 2kV ESD Charge Device PASS Model JESD22-C101C Class 2 / 500V / 250ms ESD Latch Up JESD78D I ±100mA / 1.5V max. PASS Mechanical Shocks JESD22-B104C Cond.B / 1500G / 0,5ms PASS Vibration Variable Frequency JESD22-B103B Cond 1-20Hz-2000Hz / 20G PASS Method2 - SM Process Simulation Test Solderability JESD22-B102B Reflow Peak 245 C PASS

21 Conclusion

22 Conclusion e2v barcode customers need both high integration and competitive pricing with industrial grade. e2v supports these customers by combining professionnal products expertise and strong innovation power. e2v has developed and started production for Wafer Level CSP for Sapphire WVGA EV76C541 sensor. E/O Performances are similar to Ceramic LCC package version. Integration is much higher Reliability has been proven. Building on this success, e2v will extend this Wafer Level CSP packaging solution to the future families of sensors.

23 Thank you for your attention

24 e2v Professional Imaging Value Proposition Our Strengths e2v leads developments in communications, automation, discovery, healthcare and the environment. We empower our customers value proposition differentiation by: Enabling our customers technology innovation. Providing customer with specific or application specific imaging solutions. Co-imagining and designing cutting edge CMOS sensors and subsystem platforms. Delivering innovative technology for high performance systems and equipment with a flexible supply chain. Presentation Value Proposition Sensor Requirements