LTCC Hybrid Coupler

Transcription

1 1 / Description 1-1. Part number: 1-. Features - Hybrid Coupler 3dB, 90 - Surface mount type - Suitable for operation frequency 1150 ~ 1650MHz - RoHS compliance - High stability in temperature and humidity for LTCC base - Low loss for Silver(Ag) conductor - Miniature size and high power capability - Lead-free alloy solderable - Thermal expansion corresponding with common substrate. Electrical Specification Freq. Amplitude Balance Isolation Insertion Loss (MHz) max (db) min (db) max (db) ± VSWR Phase Power Capacity Operating Temp. Max (degrees) Avg. (Watt) ( ) ± to +15

2 / Mechanical Specification 3-1. Outline Dimension PROJECTION NO. DATE 1 3 REVISION & DESCRIPTION SIGNATURE NO. DESCRIPTION TITLE 3-. Weight Grams typical

3 3 / Port Configuration Port 1 Port Port 3 Port 4 Configuration Port 1 Port Port 3 Port 4 Case 1. Input Isolated -3dB, 0-3dB, -90 Case. Isolated Input -3dB, -90-3dB, 0 Case 3. -3dB, 0-3dB, -90 Input Isolated Case 4. -3dB, -90-3dB, 0 Isolated Input * Once Port 1 is determined, the other three ports are defined automatically. 5. Schematic Drawing Port1 Pin Port Piso Pout Port3 Pcou Port4

4 4 / Typical Performance Data (5 ) Freq. Coupling Out IL Amp. Bal Phase Isolation Return Loss [db] [MHz] [db] [db] [db] [db] [degree] [db] S11 S S33 S ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± * Data with PCB and Connector Loss ( 1.50 GHz = 0.04dB )

5 5 / Operation Temperature Curve (a) 0-10 Port1 Returnl Loss 0-10 Port Return Loss Port3 Return Loss 0-10 Port4 Return Loss Magniutde[dB]

6 6 / Operation Temperature Curve (b) Coupling Insertion Loss Isolation Phase Balance Magnitude[degrees]

7 7 / Test Method - Refer to Case 1 of 4. Port Configuration on page 4 - Have the network analyzer calibrated properly. - Measure the data of Coupling through port 1 to port 3. (S31) - Measure the data of Transmission through port 1 to port 4. (S41) - Measure the data of Isolation through port 1 to port. (S1) - Calculate the Insertion Loss and Amplitude Balance of coupler on the below power method formula. S-Parameter[dB] Power Method[dB] Coupling S31 10 P cou log Pin Transmission Loss S41 10 P out log Pin Isolation S1 10 P iso log Pin Insertion Loss P in 10 log Pcou + Pout Amplitude Balance P 10 log cou Pcou + Pout Phase Balance Phase (S31) Phase (S41) P in : Power of Input Port P out : Power of Output Port P cou : Power of Coupling Port P iso : Power of Isolated Port

8 8 / Measurement board layout PROJECTION No. 1 3 DATE REVISION & DESCRIPTION SIGNATURE REVIEWED CHECKED Through Via for connecting Bottom to GND Top-GND Signal(50ohm) Line No. DESCRIPTION UNIT TOTAL QUANTITY PERUNIT TOTAL TITLE -Measuremnet Board Outline RN DWG No. SCALE SIZE A4 DIMENSION mm

9 9 / Recommended PCB layout and Solder mask pattern NO. DATE REVISION & DESCRIPTION SIGNATURE 1 3 Solder Area('A') Solder Area('B') Solder Resistor 50ohm Signal Line Coupler Outline NO. DESCRIPTION TITLE

10 10 / Reflow profile Temp.[ ] T1 T T3 T4 t4 Air 100 Coolin 50 t1 t t Time [sec] Ramp Up Pre-Heating Peak Soaking Temp.[ ] T1:160±5 T:180±5 T4:60±5 T3:30±5 Time [sec] t1:60±5sec t:100±15sec t3:30±5sec t4:60±10sec

11 11 / Packaging P _ P=.0±0.1 D0 5. MIN10.0 B0 E F W P1=1.0±0.1 A0 MAX 5 t K0 Feed Direction 330 A0 B0 D0 K0 9.5± ± ± ±0.10 E F t w 1.75± ± ± ±0.30