Gas Discharge Tube Diodes
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1 Gas Discharge Tube Diodes 2R075~2R800(T,SB/D-8 Series GDTs (Gas Discharge Tubes are placed in front of, and in parallel with, sensitive telecom equipment such as power lines, communication lines, signal lines and data transmission lines to help protect them from damage caused by transient surge voltages that may result from lightning strikes and equipment in normal operation. However, in the event of an overvoltage surge, such as a lightning strike, the GDT switches to a low impedance state and diverts the energy away from the sensitive equipment. Dimension 0.8±0.05 unit:(mm GDTs offer a high level of surge protection, a broad voltage range, low capacitance, and many form factors including new surface mount devices, which makes them suitable for applications such as MDF (Main Distribution Frame modules, high data-rate telecom applications (e.g. ADSL, VDSL, and surge protection on power lines. Their low capacitance also results in less signal distortion. When used in a coordinated circuit protection solution with PTC devices, TSS thyristor surge protection devices, and MOV (Metal Oxide Varistor devices, they can help equipment manufacturers meet 66±4 6±0.3 4±0.5 8±0.3 (TSeries 6±0.3 4±0.5 8±0.3 (SSeries Features mounting lead forms Applications All data is subject to change,please check our data sheets at for updates. GDT 01
2 Type number DC Sparkover voltage Maimum Impulse sparkover voltage Impuise life Minimum Insulation resistance Maximum Capacitance Maximum surge Discharge Current Altermationg Dischare Curiren Test Voltage G V V Times DC(V pf A ±20% 90±20% ±20% 230±20% 300±20% 900 ±20% 1000 DC 100V 10A ±20% 1000 ±20% 1200 ±20% 1200 ±20% 1300 ±20% ±20% 90±20% ±20% 230±20% 300±20% ±20% 1000 DC 100V 20A ±20% 1000 ±20% 1200 ±20% 1200 ±20% 1300 ±20% DC 200V for other. GDT 02 All data is subject to change,please check our data sheets at for updates.
3 Temperature -Temperature Min (T s(min 150 C Pb Free assembly T P Ramp-up t P Critical Zone TL to T P Pre Heat -Temperature Max (T s(max 200 C -Time (Min to Max (t s secs Average ramp up rate (Liquidus Temp (T L to peak 3 C/second max T L T S(max T S(min Preheat t L Ramp-down T S(max to T L - Ramp-up Rate 5 C/second max t S -Temperature (T L (Liquidus 217 C -Temperature (t L seconds Peak Temperature (T P /-5 C 25 time to peak temperature (t 25ºC to peak Time Time within 5 C of actual peak Temperature (t p seconds Ramp-down Rate 6 C/second max Time 25 C to peak Temperature (T P 8 minutes Max. Do not exceed 260 C Soldering Parameters - Wave Soldering (Thru-Hole Devices 300 Recommended Process Parameters: Temperature ( C - Measured on bottom side of board Wave Parameter Preheat: (Depends on Flux Activation Temperature Temperature Minimum: Temperature Maximum: Preheat Time: Solder Pot Temperature: Solder Dwell Time: Lead-Free Recommendation (Typical Industry Recommendation 100 C 150 C seconds 280 C Maximum 2-5 seconds Time (Seconds Preheat Time Dwell Time Cooling Time Soldering Parameters - Hand Soldering Solder Iron Temperature: 350 C +/- 5 C Heating Time: 5 seconds max. All data is subject to change,please check our data sheets at for updates. GDT 03
4 Packaging Dimensions For 'T' Type Axial Lead Items <1.2 Max. Lead Bend [ ] <0.8 Max 52.4 [2.063] ] 22.8 [0.898] 6.4 [0.252] 5.0 Pitch [0.197] Core and 'MS' Type Items 0.4 ± 0.05 [0.016 ± 0.002] 10x4 ± 0.1 = 40 ± 0.2 [10 x ± = ± 0.008] 1.75 ± 0.1 [0.069 ± 0.004] [0.059] 4 ± 0.1 [0.157 ± 0.004] [10.83] 76.0 [2.99] [3.94] 25.0 [0.98] 8.5 ± 0.1 [0.335 ± 0.004] 7.5 ± 0.1 [0.295 ± 0.004] / -0.1 [ / ] 17.7 [0.697] 8.6 ± 0.1 [0.339 ± 0.004] [0.059] 12 ± 0.1 [0.472 ± 0.004] For 'LS' Type Shaped Lead Items 1.9 [0.075] 0.5 ± 0.05 [0.020 ± 0.002] 1.75 ± 0.1 [0.069 ± 0.004] 11.5 ± 0.1 [0.453 ± 0.004] 10x4 ± 0.1 = 40 ± 0.2 [10x.157 ± = ± 0.008] [0.059] 4 ± 0.1 [0.157 ± 0.004] [10.82] 76.0 [2.99] [3.93] 25.0 [0.98] ± 0.1 [0.463 ± 0.004] 8 ± 0.1 [0.315 ± 0.004] / -0.1 [ / ] 25.7 [1.01] 0.5 ± 0.01 [0.020 ± 0.004] 9 ± 0.1 [0.354 ± 0.004] [0.059] 16 ± 0.1 [0.630 ± 0.004] GDT 04 All data is subject to change,please check our data sheets at for updates.
5 Part Number Code 2 R 3 0 T - Series DC Line Voltage Lead Type T=Thrust S=SMD Characteristics D=20000A Dimensions Leiditech Electronics are trademarks. Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Leiditech Electronics reserves the right to change or update, without notice, any information contained in this publication; to change, without notice, the design, construction, processing, or specification of any product; and to discontinue or limit production or distribution of any product. This publication supersedes and replaces all information previously supplied. Without expressed or written consent by an officer of Leiditech Electronics, Leiditech Electronics does not authorize the use of any of its products as components in nuclear facility applications, aerospace, or in critical life support devices or systems. Leiditech Electronics expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose. Leiditech Electronics only obligations are those in the Leiditech Electronics Standard Terms and Conditions of Sale and in no case will Leiditech Electronics be liable for any incidental, indirect, or consequential damages. SHANGHAI LEIDITECH ELECTRONICS CO.,LTD Tel: Fax: sale1@leiditech.com Website: All data is subject to change,please check our data sheets at for updates. GDT 05
2 R x x x x A - 5. Description. Electrical symbol. Part Number Code
Description GDT is placed in front of, and in parallel with, sensitive telecom equipment such as power lines, communication lines, signal lines and data transmission lines to help protect them from damage
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