Common Platform Ecosystem Enablement

Transcription

1 Joe Abler Common Platform Ecosystem Enablement

2 IBM provides a complete Foundry solution Innovative technology Leadership road map with advanced SiGe & RF offerings Leading-edge CMOS process development SoC and integration of analog / RF functions Silicon-on-insulator (SOI) and strained silicon expertise World class enablement Accurate model-to-hardware correlation can result in fewer design passes Experienced local & factory support Manufacturing expertise Robust line control Continuous process yield and defect density learning Collaborative ecosystem 90nm, 65nm, 45nm, and 32/28nm Common Platform technology collaboration with Chartered Semiconductor Manufacturing and Samsung Common Platform Solution Provider and Ready for IBM Technology networks Industry-standard standard libraries and 3 rd party IP development program IBM Microelectronics and 3rd party design services

3 Collaboration for innovation A value creator for the semiconductor industry Joint chip development alliance Chartered Toshiba Infineon Freescale IBM STMicro Samsung Common Platform manufacturing NEC GLOBAL FOUNDRIES Technology Collaborations Research IBM, GLOBALFOUNDRIES, Toshiba, STMicroelectronics, NEC SOI development IBM, GLOBALFOUNDRIES, Freescale CMOS development Common Platform manufacturing IBM, Chartered Semiconductor Manufacturing, Samsung Electronics, Infineon, STMicroelectronics, Toshiba, NEC, GLOBALFOUNDRIES IBM, Chartered and Samsung Leadership semiconductor solutions 90 nm 65 nm 45 nm 32 nm 22nm

4 From research breakthroughs to real-world solutions Fundamental Research Advanced Semiconductor R&D Technology Development Worldwide Manufacturing Screen new materials & processes Innovation in integrated device & process technology Multi-company co-located joint development Process synchronized fabricators (GDSII compatible) Patterning solutions High-k / metal gate Device structures Stress techniques Interconnects Ultra low-k Packaging IBM Almaden & Yorktown Equipment Applied Mat ls, ASML, Tokyo Electron Research IBM, Toshiba, NEC, STMicro, NEC, GLOBALFOUNDRIES Albany Nanotech Center High perf SOI IBM, Freescale, GLOBALFOUNDRIES Foundry bulk IBM, Chartered, Samsung, Infineon, STMicro, Toshiba, NEC, GLOBALFOUNDRIES IBM East Fishkill High perf SOI IBM & Chartered Foundry bulk IBM, Chartered & Samsung USA, Korea, Singapore

5 Realizing Innovation 32/28nm High-k/Metal Gate Technology Equivalen nt Oxide Thickness s (nm) 10 1 Metal Gate High-k 40nm Gate Len ngth (nm) 32 nm gate-first, HKMG technology announced, including functional 32 nm bulk & SOI SRAM (<0.15 µm 2 ). December nm HKMG Low Power Technology released for Early Access Performance/power advantages validated ARM shows off 32nm mobile processor Ac ctive Ene ergy (fj) February 2009 April nm 20 ARM, Chartered, IBM and Samsung Collaborate to Enable Energy-Efficient 32 and 28nm Systems on Chip 10 September HKMG Technology Node (nm) Technology Design Alpha Level Kit released 1400 SiON, T=25 C July HKMG, HK/MG optimized T=25 C 1000 Opt., Technology Design Evaluation Kit released T=25C -32% Performance/power advantages validated 800 April Innovative high-k metal gate (HKMG) technology announced. January % +50% 44% Frequency (MHz)

6 CP & ARM Joint Collaboration 32/28nm Leadership Enablement ARM and Common Platform Collaborate to Enable Energy Efficient 32/28nm SoC Optimized 32/28nm High-k Metal Gate Design Platform High performance, power efficient ARM SoC Implementations ti High K leadership in performance and power Targeting exploding Mobile Internet Device market Competitive advantage for mutual licensees/clients IBM grants early access to 32nm Bulk technology ARM will supply enhanced physical and core IP differentiated for the JDA technology

7 Market Requirement Mobile internet leads the convergence of PC-Mobile domains Mobile devices need higher CPU performance ( > GHz ) PC/Notebooks need lower cost / lower power consumption PC/Notebook Lower Cost Lower Power Net-Book MID Mobile Internet Convergence Smartphone 1.00 WW Mobile Device Market (2007 ~ 2012) Billion Units Smartphone /MID Higher CPU Performance Mobile (Source: S.LSI MKT, Gartner 2008) Slide Source Samsung 0.50 Enhanced Phone Basic Phone

8 GHz Era of Mobile Processors 32nm HKMG opens the GHz era of mobile processors Lower power & smaller geometry enables multi-core integration Performance of mobile devices will be comparable to today s PC Mobile Processor Clock Speed > 1 GHz 32nm HKMG ~800MHz 32nm SiON - All TR s are RVT for minimum leakage - Clock speed@130nm = 1 130nm 90nm 65nm 45nm 32nm Mobile Multi-core using 32nm 45nm Single Core CPU Dual Core Option 1 Option 2 ~Same Area Performance 32nm Dual Core CPU [Comparison to 45nm single core] Power 1.7 X 1 X 2.8 X 2 X Further integration (ex. Quad-core) will lead to PC-comparable performance with ultra low power ( < 2W ) Slide Source Samsung

9 Leading Implementation Needs Partnership ARM IP on advanced foundry process uses integrated design Architecture RTL Coding Architecture through to RTL is co-designed with physical IP Physical IP is tightly coupled with process technology development Optimization DFM Physical IP Performance Yield Implementation 1+ GHz in 32nm Low Power process 2+ GHz in 32nm Generic process Process Development Kit Transistor / Bitcell / Interconnect Manufacturing Process ARM Processor & Physical IP Advanced HKMG Process Innovation and industry leadership through collaboration Slide Source ARM

10 CP/ARM Collaboration Overview Innovation and industry leadership through collaboration ARM Processor ARM Physical IP Transistor/Bitcell Bitcell/Interconnect Technology Early Access Agreement Advanced Node Technology Development Program Optimized Techniques for Building Physical IP at Advanced Nodes Std-Cell Libraries Memories IO Libraries RA1 RF1 IO Optimized Cells Optimized Memories Custom Blocks Optimized Cells RA1 RF1 Optimized Memories Custom Blocks Foundation Std-Cell Libraries Memory Compilers RF1 RF2 Enhanced Core IP Processor Optimized IP Enhanced Physical IP es Chan nnel irect Sal Driven by ARM D Foundation Physical IP Agreement Common Platform Advisory and Marketing Agreement Enhanced IP Agreement Optimized for IBM 32/28nm HKMG LP bulk technology RA1 RA2 Slide Source ARM IO Libraries IO Foundry Licensed End User Licensed

11 In today s environment, it takes an ecosystem Comprehensive support through the Common Platform model Design Compatibility GDSII Compatibility Process and manufacturing compatibility Packaging Design center collaborators Reference design flows Libraries and IP Technology design kits Design manual SPICE models 90 nm, 65 nm, 45 nm, 32 nm process platforms Uniquify ASIC design & IP solutions

12 Thank you Explore more about IBM and related IP at ChipEstimate.com or CommonPlatform.com Use IP specific to IBM to plan your next chip! Please stay and talk with Joe Abler 12