Generic Vendor Qual Checklist Rev. A

Transcription

1 S300-ultra S300-ultra Generic Vendor Qual Checklist rev A Generic Vendor Qual Checklist Rev. A Customer Name ProMOS FAB 6 Customer Address Taichun, Taiwan City, State Zip Phone - - Fax - - Tool Owner/Contact Bob Wu bob_wu@promos.com.tw Tool Owner/Contact pager - - IQ Owner/Contact IQ Owner/Contact Phone - - IQ Owner pager - - Tool Location Thin Film Tool Phone - - DPI Location DPI Phone - - Customer Tool ID # RTI Tool ID# S925 Tool Serial # 1-05-VSD-1441-AK-08 Tool Dock Date 05/04/06 Install Start Date 05/04/14 S/L1 Date 4/14/05 S/L2 Date 5/16/05 Section I. Unpacking YES NO Crates damaged * Exterior shock sensor tripped * Wheel damage * Interior shock sensor tripped * Condensation or contamination within cello wrap * Desiccate packed inside cello wrap * Any parts missing * Any signs of mishandling * Arrange with tool owner for proper storage of all manuals shipped with tool. Section II Unwrap/Wipe-down/Roll-in * Stray parts found in plastic wrap layer * Damaged panels * Damaged monitor * Damaged frame * All shipping brackets in place and secured properly * Proper access panels in place for tool configuration * Correct floor cutouts in place * Circuit breaker off, lockout tag-out installed on plug * Will tool swing open without damage to OFA, PVAC and water lines * Right angle metal quick-disconnect for OFA * OFA line purged * OFA source pressure set to 80 psi * PVAC connected * X/Y stage shipping bracket removed * Objective stage shipping bracket removed * Robot shipping restraints removed

2 * Robot L axis shipping bracket removed * Pod shipping bracket removed * X/Y stage moves freely * Objective stage moves freely * Robot R, T, Z & L axis move freely * All shipping clamps stored * Any bad cable connections or stray hardware found * All drawer assembly s open freely * Cables checked at rear of computer * Objective and X/Y stage controller cables connected securely * Boards in optic card cage and computer seated correctly * Verify ground straps connections are tight * Check connections of all interlocks * All warning labels correctly placed. * Any loose or broken optical components (DO NOT ADJUST KNOBS) * Any cables shifted into beam path * Measurement module leveled * Robot module leveled * Verify blower isolation from frame * Blower shipping pins removed * Blower isolated from robot assembly * Printer installed and connected * Seismic brackets installed (if Necessary) * Quick disconnects connected to vacuum and OFA of tool * All doors and monitor move smoothly Section III Initial Power-Up/Hardware Test * Setup software settings for E84 box * OVH Testing and setup * Proper safety protocols observed when powering up equipment * Confirm OFA pressures at source & tool to fingerprint values * OFA source pressure recorded in tool fingerprint * Air exhaust connected as per customer spec (may not be needed) * Ensure the dip-proof inverter (DPI) is installed and properly configured * EMO and interlock tested OK * All fuse indicators OK * Computer boots and all programs start normally * All Lasers and Illumination bulbs power up with tool * All PC drives A, C, D, E, CD, Jaz function normally - files copied and verified * Gold reference files obtained from tool owner and installed * Backup the d:\rtiapps\bin directory to a jaz disk * Archive the OS/2 desktop with SysBack Version of Measurement processor firmware (gv ocb) = 5.20 build 021 B Version of UV measurement processor firmware (gv uv) = 4.01 build 016 Version of optics arbitrator firmware (gv arb) = 6.10 build 033 B Version of base arbitrator firmware (gv arb) = 8.90 build 272 B Version of base firmware (gv base) = 11.2 Version of height firmware (gv height) = 4.30 build 015 Version of F/N Interface firmware (gv intf) = 0.31 Version of Robot Macro (verbatim base DR NAME) = 3.70 build 030 B mm Version of spectrometer firmware (spectro version) = 1026 Version of PC BIOS = AmWard 6.00PG Version of OS/2 = Warp 3 Connect

3 Version of Operator = 7.406S Version of SLmesapp = 7.406S Version of SLmodapp = 7.406S Version of RRTest = 7.406S Date & filename of gold recipe database = * Setup Program Hardware Verification * Verify RRtest Hardware Setup * Hardware initialize correctly * Pod s initialize correctly * Verify z chuck speeds (acc h 200, vel h 20) * Operator start without errors Section IV Coarse Optics Alignment Verification * Visible Light Voltage check = Volts DC * All four laser shutters, and UV tested OK * Was coarse alignment necessary to obtain signal UV and VIS reference position x (mm) = UV and VIS reference position y (mm) = htm h (steps) = mod height (pixel) = 255 counts at pixel P (counts) = 2303 Section V. Automation Alignment * Station Controller connected and configured for delivery of wafers. * Robot vacuum sensor calibrated * Pods pressure and vacuum levels calibrated/tested * Stage vacuum sensor calibrated Vacuum counts at source vof all, val source = 866 Vacuum counts at source with wafer on robot = 769 Vacuum counts at source with wafer on stage = 753 * Ballast Tested Pod 1 OFA adjusted to = 0.6M Pod 2 OFA adjusted to = 0.6M * Robot trained to load, center, and unload both pods all slots * Flat/notch sensor calibrated. * Autocal 21 done slot 12 both pods Eccentricity for slot 12 pod 1 = 433 Eccentricity for slot 12 pod 2 = 259 * Robot Alignment Verification on all FOUP types * Back side wafer check OK - * Test wafer move reproducibility < ±30 microns for x & y axis - xls spreadsheet * Test stage load/unload reproducibility, data logged in - xls spreadsheet * The std. deviation for site (a) less than 20 microns for x & y axis * The std. deviation for site (b) less than 20 microns for x axis * The std. deviation for site (b) less than 80 microns for y axis * Z-chuck height test less than 25 steps difference * Z-chuck leveled to less than 1000 steps between all 4 quadrants Z-chuck height (wrs h) of stage position (145,0) = Z-chuck height (wrs h) of stage position (-145,0) =

4 Z-chuck height (wrs h) of stage position (0,145) = Z-chuck height (wrs h) of stage position (0,-145) = * Perform cassette mapper calibration * Perform cassette mapping validation test in RRtest * Perform cassette mapping validation test in cassette run mode * Iron-man test completed without errors on both pods, print screen 1st & last page of log data for both pods print screen * Perform Mini Environment Differential pressure sensor setup Section VI Fine-Tune Optic Alignment Verification * Verify Lo, Medium, and Hi mag scale factors * Hi mag image focus verification * Hi mag image FOM verification Hi mag Magnification value = ( ) * Medium mag image focus verification * Medium mag spot verification(is the spot centered in laser spot) Medium mag FOM value = (<0.002) Medium mag Magnification value= ( ) Medium mag image rotation value= (±0.200 ) * Low mag focus verification * Hi, Med, Lo mag matching verification * Blue laser and HeNe laser overlapped. Verify alignment (if applicable) * Verify Tilt laser alignment * Verify adjustable (tilt) reference post alignment. * DAD board centering and alignment verification Center pixel Number= 68.5 Pixel width = 82 * Pixel Qualification verification 633nm pixel (lo/hi) 45/45 780nm pixel (lo/hi) 45/45 905nm pixel (lo/hi) 45/45 * Laser Intensity verification 633nm counts= nm counts= nm counts= 905 * Perform 1 average verification at 633nm Static Repeatability = 0.13 (<0.15) * Static Repeatability test 50 pts (all wavelengths, 458 if applicable)

5 Table 1 Thickness 5 run average Wavelength 50Pt. Std. Ideal Absolute Max 110 A A <0.025 < A A <0.03 < A A <0.1 <0.15 * Perform Check Sample calibration Fit error 633= 0.14 (<0.16, <0.12 Ideal) Fit error 780= 0.12 (<0.20, <0.12 Ideal) Fit error 905= 0.21 (<0.30, <0.24 Ideal) * Verify finger print specifications * Ellipsometer Spot Size Verification as per spot size verification recipe. Table 2 Box Fit Error 100 micron < Tolerance 30 micron < Fit Error 20 micron < * Perform measure vs model verification * Height Sensitivity Test Measured thickness 400A= A Height Scan difference 400A= ~ = 0.93A Standard Deviation 100A = 0.04 * Tilt Compensation complete Std = 1.6 (<3.0) * Stage Center Correction * Wafer Rotation correction Wafer offset = * Overlay video calibration * Stage mapping Table 3 Parameter Spec Actual Max < Min < Avg <

6 * HeNe laser measurements Recorded below Table 4 NIST Thickness HeNe_actual Tolerance Measurement 110 Å A ± 2Å 271 Å A ± 4Å 432 Å A ± 4Å 925 Å A ± 4Å 1106 Å A ± 4Å 2265 Å A ± 5Å Å A ± 10Å * Additional Wavelengths recorded below Table 5 (Using standard SiO2.chy model) NIST Thickness 780 actual measurement 905 actual measurement 110 Å ± 1Å of ± 1Å of Å ± 5Å of ± 5Å of Å ± 5Å of ± 5Å of Å 922.5± 5Å of ± 5Å of Å ± 6Å of ± 15Å of Å ± 10Å of ± 10Å of Å ± 10Å of ± 10Å of 633 Section VII Verifying Visible Reflectometer Calibrations * Spot alignment verification (under blue diamond) * Integration Times Hi mag = 500 (< 1000 ideal) Med mag = 250 (<250 ideal) Lo mag = 80 (<500 ideal) * Peak Counts (1300 ±100) Hi mag = 1273 Med mag = 1229 Lo mag = 1310 * Visible spot size verification Fit error in 5um box = (<0.300) * 1um Numerical Aperture Correction 633nm thickness = Hi mag thickness = (±6Å of 633nm thickness) Med mag thickness= (±6Å of 633nm thickness) Lo mag thickness= (±6Å of 633nm thickness) * Visible reflectometer repeatability verification Lo mag = 0.76 (<1.00) Med mag = 0.79 (<1.00) Hi mag = 0.92 (<1.00)

7 Section VIII Verifying UV Reflectometer Calibrations * UV measurement Verification * UV Read 250nm measurement counts = 2079 ( ) * Refine UV spot Size using Rudolph Wafer. UV offset value x = UV offset value y = * Refine UV spot position using Rudolph wafer. * UV scan nm measurement counts = 811 ( ) * 193nm measurement scan counts(uv read 193) = 539 ( ) * UV dark counts = 127 (< 250 max, < 100 ideal) * UV integration time = 50 (msec) (Target = 50 msec; Max = 100 msec) * UV 50 point short term Repeatability Test Table 7 Wavelength Specification STD reflectivity 193nm < nm < nm < * Check UV measure vs model curves Field Engineer Signature Frank Chiang Date complete / / Customers Signature Date / /