Supporting External circuit as Spice or S- parameters in conjunction with I-V/V-T tables
|
|
- Esmond Dawson
- 5 years ago
- Views:
Transcription
1 Supporting External circuit as Spice or S- parameters in conjunction with I-V/V-T tables Kent Dramstad, Adge Hawes IBM Microelectronics Taranjit Kukal, Feras Al-Hawari, Ambrish Varma, Terry Jernberg Cadence Design Systems, Inc. Presented by: Charlie Shih, Cadence Design Systems, Inc. (Previously presented at Asian IBIS Summits, November 15 and 18, 2011) Asian IBIS Summit Taipei, Taiwan November 21, 2011
2 Agenda Requirement Current Limitations of [External Circuit] Solution Supporting S-parameters in [External Circuit] (BIRD144) Simulating [External Circuit] in conjunction with I- V/V-T tables (BIRD145) Summary
3 Agenda Requirement Current Limitations of [External Circuit] Solution Supporting S-parameters in [External Circuit] Simulating [External Circuit] in conjunction with I- V/V-T tables Summary
4 Requirement At high frequencies, we need ways over and above I-V, V-T tables and AMI to model the buffer. On DIE Terminations (ODT) that vary with frequencies need to be expressed as S-parameters or RLGC Spice files On DIE Re-distribution layer (RDL) parasitics become significant and vary with frequencies and hence have to be expressed as S-parameters Analog portion of IO-buffer get expressed as Spice as against I-V/V-T curve; S-parameters get used to describe transfer characteristics of linear IO-buffer amplifiers.
5 Requirement At high frequencies, we need ways over and above I-V, V-T tables and AMI to model the buffer. Some algorithmic portion of IO-buffer model could be expressed as behavioral Spice to augment AMI code Example: if-then-else kind of spice to pick right sub-circuit based on parameter values/processes Example: Modeling continuous filters as behavioral spice to augment digital filters in AMI code
6 Requirement - Various Cases that need to be covered I B I S + [External Circuit] RDL Spice Simulating RDL parasitics in conjunction with I-V/V-T tables Case 1 A M I I B + I + S [External Circuit] RDL Spice Simulating RDL parasitics in conjunction with I-V/V-T tables and AMI Case 2 Simulating AMI with IO-buffer expressed as Spice A M I [External Circuit] + I/O Buffer (Spice) Case 3
7 Agenda Requirement Current Limitations of [External Circuit] Solution Supporting S-parameters in [External Circuit] Simulating [External Circuit] in conjunction with I- V/V-T tables Summary
8 Current Limitations - [External Circuit] Today, S-parameters have to be wrapped into Spice models (vendor specific) and then used under [External Model/Circuit] Keyword. On similar lines, BIRDs propose that Touchstone file name can be parameterized for the IBIS-ISS sub-circuit, which means that IBIS- ISS wrapper could be written for the S-parameter element. NEED: Extend support for direct usage of S- parameters
9 Current Limitations - [External Circuit] The current [External Circuit] and [Circuit Call] usage rules do not allow the direct interconnection and instantiation of existing IBIS I/O models with the rest of the [External Circuit] blocks. Traditionally, users either use Spice or I-V/V-T tables. [ExternalCircuit] I/O (SPICE) + I B I S NEED: Extend use of [External Circuit] keyword to point to Spice sub-circuits that augment I-V/V-T data for complete characterization of IO-buffer. [External Circuit] SPICE + I B I S
10 Current Limitations - [External Circuit] In order for a model developer to use an IBIS I/O model in an [External Circuit] the following steps need to be followed: Develop SPICE like wrappers in which the corresponding typ, min, and max IBIS I/O sub-circuits are instantiated Develop an [External Circuit] to point to the wrapper subcircuits Use the [Circuit Call] keyword to call the [External Circuit]. These usage rules are cumbersome especially when the developer can just directly call the desired IBIS I/O model without the need to develop a SPICE like wrapper as well as an [External Circuit] section.
11 Agenda Requirement Current Limitations of [External Circuit] Solution Supporting S-parameters in [External Circuit] (BIRD144) Simulating [External Circuit] in conjunction with I- V/V-T tables Summary
12 Solution: Leveraging [External Model/Circuit] to Support Package S-parameters For support of package S-parameters: IBIS model should have Keywords to support Touchstone S-parameters under Package section, with fields to Point to Touchstone file from the Package section Provide port-mapping of IO-buffer pins to S-parameter ports R/L/C values should be ignored by SI tools if S-parameter file is used For support of S-parameters when representing elements beyond package parasitics: This can be achieved through use of [External Model] keyword that directly instantiates Touchstone file
13 Solution: Leveraging [External Model/Circuit] to Support S-parameters (beyond Package) Positioning S-parameters as a method to completely define IO-buffer model or portions of IO-buffer requires support for: Direct support of S-parameters without the need for wrapping Port mapping of S-parameters Corners beyond typ/min/max to provide flexibility of choosing various S-parameter files under different conditions
14 Solution: Leveraging [External Model/Circuit] to Support S-parameters (beyond Package) Support for Language Touchstone with port-map
15 Solution: Leveraging [External Model/Circuit] to Support S-parameters (beyond Package) Picking different S-parameter files for different corners
16 Solution: Leveraging [External Model/Circuit] to Support S-parameters (beyond Package) Supporting user-defined corners each user-defined corner maps to typ/min/max IBIS corners
17 Solution: Leveraging [External Model/Circuit] to Support S-parameters (beyond Package) Use in [External Model] and [External Circuit]
18 Agenda Requirement Current Limitations of [External Circuit] Solution Supporting S-parameters in [External Circuit] Simulating [External Circuit] in conjunction with I- V/V-T tables(bird145) Summary
19 Solution: Include IBIS I/O table model in an [External Circuit] using the new [Model Call] Ability to connect External Circuit to IBIS I/O model. The External Circuit could represent RDL parasitics, portion of active I/O buffer, some algorithmic part of I/O buffer.
20 Solution: Include IBIS I/O table model in an [External Circuit] using the new [Model Call] [Pin] signal_name model_name R_pin L_pin C_pin 1 RAS0# Buffer m 5.0nH 2.0pF 2 RAS1# Buffer m NA 2.5pF 3 EN1# Input1 NA 6.3nH NA 4 A0 3-state 5 D0 I/O1 6 RD# Input m 3.0nH 2.0pF 7 WR# Input2 8 A1 I/O2 9 D1 I/O2 10 GND GND 297.0m 6.7nH 3.4pF 11 RDY# Input2 12 GND GND 270.0m 5.3nH 4.0pF HERE DO, D1 are to be modeled as I/O1, I/O2 buffers followed by RDL Spice and represent a differential buffer
21 Solution: Include IBIS I/O table model in an [External Circuit] using the new [Model Call] I/O1 and I/O2 are followed by RDL Spice model
22 Solution: Include IBIS I/O table model in an [External Circuit] using the new [Model Call] [Node Declarations] Must appear before any [Circuit Call] or [Model Call] keyword Die nodes a1 b1 c1 d1 e1 List of die nodes representing signals that connect models a2 b2 c2 d2 e2 [End Node Declarations] NOTE: A [Model] named "I/O1" must be present in the IBIS file in order to enable the tool to instantiate and connect the called model "as usual" based on the I-V and T-V curves as well as the subparameters under the corresponding [Model] section. [Model Call] I/O1 Instantiates [Model] named "I/O1" mapping port pad/node Port_map A_pcref a1 Port to internal node connection Port_map A_puref b1 Port to internal node connection Port_map A_signal c1 Port to internal node connection Port_map A_pdref d1 Port to internal node connection Port_map A_gcref e1 Port to internal node connection [End Model Call]
23 Solution: Include IBIS I/O table model in an [External Circuit] using the new [Model Call] NOTE: A [Model] named "I/O2" must be present in the IBIS file in order to enable the tool to instantiate and connect the called model "as usual" based on the I-V and T-V curves as well as the subparameters under the corresponding [Model] section. [Model Call] I/O2 Instantiates [Model] named "I/O2" mapping port pad/node Port_map A_pcref a2 Port to internal node connection Port_map A_puref b2 Port to internal node connection Port_map A_signal c2 Port to internal node connection Port_map A_pdref d2 Port to internal node connection Port_map A_gcref e2 Port to internal node connection [End Model Call]
24 Solution: Include IBIS I/O table model in an [External Circuit] using the new [Model Call] [Circuit Call] RDL_Interconnect Instantiates [External Circuit] named "RDL_Interconnect" mapping port pad/node Port_map vcc 18 Port to implicit pad connection Port_map gnd 12 Port to implicit pad connection Port_map io1 5 Port to implicit pad connection Port_map io2 9 Port to implicit pad connection Port_map vcca1 a1 Port to internal node connection Port_map vcca2 b1 Port to internal node connection Port_map int_io1 c1 Port to internal node connection Port_map vssa1 d1 Port to internal node connection Port_map vssa2 e1 Port to internal node connection Port_map vccb1 a2 Port to internal node connection Port_map vccb2 b2 Port to internal node connection Port_map int_io2 c2 Port to internal node connection Port_map vssb1 d2 Port to internal node connection Port_map vssb2 e2 Port to internal node connection [End Circuit Call]
25 Agenda Requirement Current Limitations of [External Circuit] Solution Supporting S-parameters in [External Circuit] Simulating [External Circuit] in conjunction with I- V/V-T tables Summary
26 Summary With increase in frequencies, we need enhanced usage of External Model / Circuit S-parameters are becoming common way to model portions of I/O buffers and package parasitics; Hence need to have direct support of S-parameter model under [External Model/Circuit]. This has been proposed as BIRD144 Significant portion of I/O buffer gets modeled as Spice/Sparameters to augment the main analog buffer to capture the high frequency behavior; Hence need to have easy way to connect External Circuit to I-V/V-T table-model. This has been proposed as BIRD145
27 Summary BIRD144 and BIRD145 can be accessed at The BIRDs would be considered and discussed by the IBIS open forum Other BIRDs will also be considered that might be alternatives or add-on to this proposal
28
Multi-lingual Model Support within IBIS
Multi-lingual Model Support within IBIS Bob Ross, Vice Chair. January 28, 2002 IBIS Summit, Santa Clara, CA Benefits of Multi-lingual Support Model advances beyond IBIS True differential buffers, current
More informationSpice Subcircuit Support for Serial Link Channel Design Using IBIS [External Model]
Spice Subcircuit Support for Serial Link Channel Design Using IBIS [External Model] IBIS Summit Asian IBIS Summit, November 9, 2010 Xiaoqing Dong, Huawei Technologies Shenzhen Zhangmin Zhong, Sigrity Ken
More informationMulti-Lingual Modeling Applications and Issues
Multi-Lingual Modeling Applications and Issues Bob Ross June 13, 2002 IBIS Summit Meeting New Orleans, Louisiana Benefits of Multi-Lingual Support Model advances beyond IBIS True differential buffers,
More informationSimulation Using IBIS Models and Pin Mapping Issues
Power/Gnd Simulation Using IBIS Models and Pin Mapping Issues Raj Raghuram Sigrity, Inc. IBIS Summit Meeting, Sep. 13, 2001 2/14/96 Outline Motivation automated Power/Gnd simulation Example of Power/Gnd
More informationLeveraging IBIS Capabilities for Multi-Gigabit Interfaces. Ken Willis - Cadence Design Systems Asian IBIS Summit, Shanghai, PRC November 13, 2017
Leveraging IBIS Capabilities for Multi-Gigabit Interfaces Ken Willis - Cadence Design Systems Asian IBIS Summit, Shanghai, PRC November 13, 2017 Overview In writing EDI CON paper Signal Integrity Methodology
More informationBoard design and IBIS simulation in consideration of the delay control
Board design and IBIS simulation in consideration of the delay control Asian IBIS Summit Tokyo, JAPAN November 16, 2015 Makoto Matsumuro IB-ELECTRONICS IB-ELECTRONICS Page 1 Agenda Results of the simulation
More informationUsing S-parameters for behavioral interconnect modeling
欢迎与会的各位专家! Using S-parameters for behavioral interconnect modeling Asian IBIS Summit Zhu ShunLin 朱顺临 High-Speed System Lab, EDA Dept. ZTE Corporation Zhu.shunlin@zte.com.cn October 27, 2006 Agenda Using
More informationIBIS Quality Control Through Scripting
IBIS Quality Control Through Scripting Justin Butterfield DAC IBIS Summit San Francisco, CA, USA June 5, 2012 2012 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron
More informationIBIS Interconnect BIRD Update. Walter Katz Signal Integrity Software, Inc. IBIS Summit, DesignCon Santa Clara, CA January 22, 2016
IBIS Interconnect BIRD Update Walter Katz Signal Integrity Software, Inc. IBIS Summit, DesignCon Santa Clara, CA January 22, 2016 Overview IBIS Interconnect Task Group Models Represent Package and On-Die
More informationS-parameter interconnect model ports and terminals. Arpad Muranyi February 24, 2016
S-parameter interconnect model ports and terminals Arpad Muranyi February 24, 2016 Please accept my apologies for overlooking the sentence in red: For an Interconnect Model using File_TS with N ports,
More informationModeling Pre/de-emphasis buffers with [Driver Schedule]
Modeling Pre/de-emphasis buffers with [Driver Schedule] IBIS Summit at DesignCon 2005 Santa Clara Convention Center, CA January 31, 2005 Arpad Muranyi Signal Integrity Engineering Intel Corporation arpad.muranyi@intel.com
More informationModel Connection Protocol extensions for Mixed Signal SiP
Model Connection Protocol extensions for Mixed Signal SiP Taranjit Kukal (kukal@cadence.com) Dr. Wenliang Dai (wldai@cadence.com) Brad Brim (bradb@sigrity.com) Presented by: Yukio Masuko Cadence Note:
More informationBIRD AMI Model New IBIS Support
Industrial Solutions and Services Your Success is Our Goal BIRD 104.1 AMI Model New IBIS Support Manfred Maurer manfred.maurer@siemens.com www.siemens.de/edh Manfred Maurer Folie 1 Classical Way of IBIS
More informationIBIS Quality Review. IBIS Summit Meeting Design Automation Conference, San Francisco, California, July 28, 2009
IBIS Summit Meeting Design Automation Conference, San Francisco, California, July 28, 2009 IBIS Quality Review A status review of the IBIS Quality specification Mike LaBonte, Cisco Systems (Presented by
More informationPredicting BER with IBIS-AMI: experiences correlating SerDes simulations and measurement
Predicting BER with IBIS-AMI: experiences correlating SerDes simulations and measurement Todd Westerhoff (SiSoft) Mike Steinberger (SiSoft) Walter Katz (SiSoft) Barry Katz (SiSoft) Adge Hawes (IBM) Kent
More informationIBIS FORUM I/O BUFFER MODELING COOKBOOK
IBIS FORUM I/O BUFFER MODELING COOKBOOK Revision 2.0X (under development) Prepared By: The IBIS Open Forum Senior Editor: Stephen Peters Intel Corp. Sept 24, 1997 * Trademarks are the properties of their
More informationAN-715 APPLICATION NOTE One Technology Way P.O. Box 9106 Norwood, MA Tel: 781/ Fax: 781/
APPLICATION NOTE One Technology Way P.O. Box 9106 Norwood, MA 02062-9106 Tel: 781/329-4700 Fax: 781/326-8703 www.analog.com A First Approach to IBIS Models: What They Are and How They Are Generated by
More informationInconsistency of EBD (Electrical Board Description) specification in DDR3 DIMM
Inconsistency of EBD (Electrical Board Description) specification in DDR3 DIMM Asian IBIS Summit Yokohama, Japan November 20, 2014 Shogo Fujimori Fujitsu Advanced Technologies s.fujimori@jp.fujitsu.com
More informationIBIS PDN Feature Studies
IBIS PDN Feature Studies Randy Wolff Micron Technology Lance Wang IO Methodology DAC IBIS Summit San Diego, CA, USA based on 2011 European IBIS Summit presentation and updates 2010 Micron Technology, Inc.
More informationIBIS-ATM Update: SerDes Modeling and IBIS
IBIS-ATM Update: SerDes Modeling and IBIS (Originally presented at the Sept 11 th Summit in Beijing) Presented by: Todd Westerhoff, SiSoft twesterh@sisoft.com IBIS Summit Tokyo, Japan September 14, 2007
More informationConcerns when applying Channel Simulation to DDR4 Interface
Concerns when applying Channel Simulation to DDR4 Interface Masaki Kirinaka mkirinaka@jp.fujitsu.com Akiko Tsukada tsukada.akiko@jp.fujitsu.com FUJITSU INTERCONNECT TECHNOLOGIES LIMITED Asian IBIS Summit
More informationIBIS Package Proposal. Walter Katz Signal Integrity Software, Inc. IBIS Summit, Santa Clara January 31, 2014
IBIS Package Proposal Walter Katz Signal Integrity Software, Inc. IBIS Summit, Santa Clara January 31, 2014 Overview Decisions Made What These Decisions Mean Intent of this proposed syntax New Keywords
More informationIBIS Model Simulation with R/L/C_dut. Xuefeng Chen Asian IBIS Summit Meeting Shanghai, China November 11, 2016
IBIS Model Simulation with R/L/C_dut Xuefeng Chen Asian IBIS Summit Meeting Shanghai, China November 11, 2016 Outline Introduction of IBIS R/L/C_dut subparameters IBIS algorithm enhancement for R/L/C_dut
More informationInterconnect Modeling Update - EMD Specification
Interconnect Modeling Update - EMD Specification Randy Wolff Micron Technology 2013 European IBIS Summit Paris, France 2013 Micron Technology, Inc. All rights reserved. Products are warranted only to meet
More informationIBIS and Power Delivery Systems
IBIS and Power Delivery Systems Jiang, Xiangzhong Li, Jinjun Zhang, Shengli Huawei Technologies, China Content 1. IBIS history in Huawei 2. Model Platform in Huawei 3. IBIS Validation 4. HUAWEI spice circuit
More informationIBIS-ISS: What It Is and What It Means to You
IBIS-ISS: What It Is and What It Means to You Michael Mirmak Intel Corporation Chair, IBIS Open Forum マイケルマ一マク インテルコ一ポレ一ション 会長, アイビス IBIS Summit Tokyo November 15, 2010 Originally presented in Shenzhen
More informationModeling DDR3 with IBIS
Modeling DDR3 with IBIS Randy Wolff, Micron Technology DesignCon 2008 IBIS Summit Products are warranted only to meet Micron s production data sheet specifications. Information, products and/or specifications
More informationA Tour of the IBIS Quality Specification DesignCon East IBIS Summit April 5, 2004
A Tour of the IBIS Quality Specification DesignCon East IBIS Summit April 5, 2004 Robert Haller rhaller@sisoft.com Signal Integrity Software, Inc. 6 Clock Tower Place Suite 250 Maynard MA. 01754 978-461
More informationIBIS Model Process For High-Speed LVDS Interface Products
IBIS Model Process For High-Speed LVDS Interface Products National Semiconductor Corp. Interface Products Group Overview With high-speed system designs becoming faster and more complicated, the need to
More informationHFSS Solver On Demand for Package and PCB Characterization Using Cadence. Greg Pitner
HFSS Solver On Demand for Package and PCB Characterization Using Cadence Greg Pitner 1 Problem Statement Usually SI engineers extract only the package or the pcb due to the trade offs between capacity
More informationHFSS Solver-On-Demand for Package and PCB Characterization Using Cadence Greg Pitner
HFSS Solver-On-Demand for Package and PCB Characterization Using Cadence Greg Pitner 1 ANSYS, Inc. September 14, Problem Statement Usually SI engineers extract only the package or the pcb due to the trade-offs
More informationIBIS and Behavioral Modeling
IBIS and Behavioral Modeling Michael Mirmak Intel Corporation Chair, EIA IBIS Open Forum IBIS Summit Shenzhen, China December 6, 2005 迈克尔. 莫马克英特尔公司 IBIS 委员会主席 亚洲 IBIS 技术研讨会中国深圳 2005 年 12 月 6 日 Legal Disclaimers
More informationEffective Signal Integrity Analysis using IBIS Models
Effective Signal Integrity Analysis using IBIS Models Syed B. Huq Cisco Systems, Inc 2000 High-Performance System Design Conference 1 Abstract Authors/Speakers IBIS models are being widely used in various
More informationIBISCHK6 IBISCHK6 (IBIS Golden Parser) User Guide Version 6.1.4
IBISCHK6 IBISCHK6 (IBIS Golden Parser) User Guide Version 6.1.4 June 29, 2017 WIP1 Copyright 2017 IBIS Open Forum Contents 1 Introduction... 3 2 IBISCHK6 Usage... 4 2.1 Input File FLAGS... 4 2.2 Output
More informationSerDes Channel Simulation in FPGAs Using IBIS-AMI
White Paper: Virtex-6 FPGA Family WP382 (v10) December 9, 2010 SerDes Channel Simulation in FPGAs Using IBIS-AMI By: Romi Mayder The IBIS Algorithmic Modeling Interface (IBIS-AMI) was developed to enable
More informationIBIS 4.1 Macromodel Library for Simulator Independent Modeling
IBIS 4.1 Macromodel Library for Simulator Independent Modeling Arpad Muranyi, Mike LaBonte, Todd Westerhoff Sam Chitwood, Ian Dodd, Barry Katz, Scott McMorrow, Bob Ross, Ken Willis 1 Agenda History How
More informationAppendix E1: IBIS Model Syntax. Reference IBIS 3.2
Appendix E1: IBIS Model Syntax Roy Leventhal Used with permission of 3Com Reference IBIS 3.2 3Com Carrier R&D 1 Contents Table 1: General Rules... 9 Format...9 File Names... 9 Reserved Words... 9 POWER...
More informationCreating Xnets for Resistor Packs in Allegro PCB Editor. Product Version SPB16.6 April 2, 2014
Creating Xnets for Resistor Packs in Allegro PCB Editor Product Version SPB16.6 April 2, 2014 Copyright Statement 2014 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence and the Cadence
More informationIBIS-AMI Modeling Using Scripts and Spice Models
IBIS-AMI Modeling Using Scripts and Spice Models Asian IBIS Summit Shanghai, China November 13th, 2017 (Previously presented October 18 th, 2017) Wei-hsing Huang, SPISim Wei-hsing.Huang@spisim.com 1 Agenda:
More informationUsing IBIS-AMI in the Modeling of Advanced SerDes Equalization for Serial Link Simulation
Using IBIS-AMI in the Modeling of Advanced SerDes Equalization for Serial Link Simulation CDNLive Boston August 2013 Mark Marlett and Mahesh Tirupattur, Analog Bits Ken Willis and Kumar Keshavan, Cadence
More informationNew AMI API to Resolve Model Parameter Dependencies
New AMI API to Resolve Model Parameter Dependencies Fangyi Rao and Radek Biernacki Agilent Technologies, Inc. IBIS Summit at DesignCon Santa Clara, California Page 1 Requirements Model parameters used
More informationIBIS QUALITY SPECIFICATION
IBIS QUALITY SPECIFICATION Version 2.0 Ratified October 30, 2009 IBIS Quality Specification Version 2.0 page 1 Purpose This document is a specification covering a methodology to enhance the quality of
More informationPARAMETER SYMBOL MIN MAX Address Access Time
TECHNICAL NOTE TN-00-17 TIMING SPECIFICATION DERATING FOR HIGH CAPACITANCE OUTPUT LOADING Introduction Memory systems are varied in the number of controllers, memory, and other devices that may share a
More informationA Practical Methodology for SerDes Design
A Practical Methodology for SerDes Design Asian IBIS Summit, Shanghai, China, November 14, 2018 Authors: Amy Zhang, Guohua Wang, David Zhang, Zilwan Mahmod, Anders Ekholm agenda Challenges in Traditional
More informationHEADER SECTION (.ibs,.pkg,.ebd) Version 1.1 Version 2.1 Version 3.2 Version 4.2 Version 5.1 Version 6.0. TOP-LEVEL KEYWORDS (with END Keywords)
IBIS EVOLUTION (IBIS, PACKAGE, ELECTRICAL BOARD DESCRIPTION, EMI, SSO, ALGORITHMIC MODELING INTERFACE) Bob Ross, July 25, 2006, updated September 14, 2007, September 8, 2013, April 20, 2014 HEADER SECTION
More informationThe Touchstone 2.0 Format for Interconnect Modeling
29 The Touchstone 2. Format for Interconnect Modeling SIEMENS AG manfred.maurer@siemens.com 29 Purpose / goal 2 Importance of the channel description for SI+PI Touchstone format 2. is a good choice 29
More informationIBIS Model Validation Review. Lance Wang IBIS Asian Summit 2012 Nov. 16, 2012 Yokohama, Japan
IBIS Model Validation Review Lance Wang lwang@iometh.com IBIS Asian Summit 2012 Nov. 16, 2012 Yokohama, Japan TM Outlines Motivation History Method Review Common Mistakes Conclusion 2006-2012 IO Methodology
More informationA Proposal for Developing S2IBISv3
A Proposal for Developing S2IBISv3 Paul Franzon Michael Steer Automated Design Tools for Integrated Mixed Signal Microsystems (NeoCAD) Outline Background DARPA Program NeoCad Program Objectives Program
More informationSimulation and Modeling for Signal Integrity and EMC
Simulation and Modeling for Signal Integrity and EMC Lynne Green Sr. Member of Consulting Staff Cadence Design Systems, Inc. 320 120th Ave NE Bellevue, WA 98005 USA (425) 990-1288 http://www.cadence.com
More informationA Beginner s Guide to SerDes and AMI Modeling. Todd Westerhoff, SiSoft Corey Mathis, MathWorks
A Beginner s Guide to SerDes and AMI Modeling Todd Westerhoff, SiSoft Corey Mathis, MathWorks SPEAKERS Corey Mathis Industry Marketing Manager, MathWorks Corey.Mathis@mathworks.com, www.mathworks.com Corey
More informationMAS9278 IC for MHz VCXO
IC for 10.00 30.00 MHz XO Low Power Wide Supply Voltage Range True Sine Wave Output Very High Level of Integration Integrated Varactor Electrically Trimmable Very Low Phase Noise Low Cost DESCRIPTION The
More informationIBIS (I/O Buffer Information Specification) Version 6.1
IBIS (I/O Buffer Information Specification) Version 6.1 Ratified September 11, 2015 IBIS Open Forum 2015 Contents 1 General Introduction... 3 2 Statement of Intent... 4 3 General Syntax Rules and Guidelines...
More informationThe 3S Proposal: A SPICE Superset Specification for Behavioral Modeling
The 3S Proposal: A SPICE Superset Specification for Behavioral Modeling Michael Mirmak Intel Corporation June 5, 2007 Legal Disclaimer THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS
More informationModeling and Simulation for Multi- Gigabit Interconnect System
Asian IBIS Summit Modeling and Simulation for Multi- Gigabit Interconnect System Zhu Shunlin ( 朱顺临 ) Hu Weidong Chen Songrui High-Speed System Lab,ZTE Corporation Zhu.shunlin@zte.com.cn Beijing,China September
More informationSerDes Modeling: IBIS-ATM & Model Validation July 2007
SerDes Modeling: IBIS-ATM & Model Validation July 2007 Signal Integrity Software, Inc. IBIS-ATM Effort Goal: SerDes Rx/TX model interoperability Multiple EDA environments Multiple SerDes vendor models
More informationAMI Applications in High-speed Serial Channel Analysis and Measurement Correlation
AMI Applications in High-speed Serial Channel Analysis and Measurement Correlation Jia Wei, Sunanbing, Zhu ShunLin Jia.wei@zte.com.cn, sun.anbing@zte.com.cn, Zhu.shunlin@zte.com.cn High-Speed System Lab,ZTE
More informationHIERARCHICAL DESIGN. RTL Hardware Design by P. Chu. Chapter 13 1
HIERARCHICAL DESIGN Chapter 13 1 Outline 1. Introduction 2. Components 3. Generics 4. Configuration 5. Other supporting constructs Chapter 13 2 1. Introduction How to deal with 1M gates or more? Hierarchical
More informationOutline HIERARCHICAL DESIGN. 1. Introduction. Benefits of hierarchical design
Outline HIERARCHICAL DESIGN 1. Introduction 2. Components 3. Generics 4. Configuration 5. Other supporting constructs Chapter 13 1 Chapter 13 2 1. Introduction How to deal with 1M gates or more? Hierarchical
More informationAdvanced SI Analysis Layout Driven Assembly. Tom MacDonald RF/SI Applications Engineer II
Advanced SI Analysis Layout Driven Assembly 1 Tom MacDonald RF/SI Applications Engineer II Abstract As the voracious appetite for technology continually grows, so too does the need for fast turn around
More informationInterfacing RLDRAM II with Stratix II, Stratix,& Stratix GX Devices
Interfacing RLDRAM II with Stratix II, Stratix,& Stratix GX Devices November 2005, ver. 3.1 Application Note 325 Introduction Reduced latency DRAM II (RLDRAM II) is a DRAM-based point-to-point memory device
More informationAddressing the Power-Aware Challenges of Memory Interface Designs
Addressing the Power-Aware Challenges of Memory Interface Designs One of the toughest challenges in designing memory interfaces is accurately measuring timing while also considering fluctuations in power
More informationEMD (Electronic Module Description Specification) Version 1.0 Draft 12 February 27, 2013
EMD (Electronic Module Description Specification Version 1.0 Draft 12 February 27, 2013 Ratified TBD 1 ELECTRICAL MODULE DESCRIPTION INTRODUCTION: A module level component is the generic term to be used
More informationStatus Report IBIS 4.1 Macro Working Group
Status Report IBIS 4.1 Macro Working Group IBIS Open Forum Summit July 25, 2006 presented by Arpad Muranyi, Intel IBIS-Macro Working Group Intel - Arpad Muranyi Cadence Lance Wang, Ken Willis Cisco - Mike
More informationCadence Virtuoso Schematic Design and Circuit Simulation Tutorial
Cadence Virtuoso Schematic Design and Circuit Simulation Tutorial Introduction This tutorial is an introduction to schematic capture and circuit simulation for ENGN1600 using Cadence Virtuoso. These courses
More informationValidating and Using IBIS Files
National Semiconductor Corp. Interface Products Group Overview The IBIS (Input/Output Buffer Information Specification) behavioral model is widely used for high- and faster, speed designs to evaluate Signal
More informationSENSYLINK Microelectronics Co., LTD. (CT1820S) Single-Wire Digital Temperature Sensor
SENSYLINK Microelectronics (CT1820S) Single-Wire Digital Temperature Sensor CT1820S is a Digital Temperature Sensor with±0.5 C Accuracy over -10 C to 80 C. Single-Wire Digital interface is Compatible with
More informationPowerAmp Design. PowerAmp Design PAD131 FAN CONTROLLER MODULE
PowerAmp Design FAN CONTROLLER MODULE KEY FEATURES LOW COST ACCESSORY REDUCES AUDIBLE FAN NOISE IREASES FAN LIFE CONVENIENT SIP PIN-OUT OPERATES FROM 12-15 VOLTS APPLICATIONS HIGH POWER AMPLIFIER ADD-ON
More informationASIC Physical Design Top-Level Chip Layout
ASIC Physical Design Top-Level Chip Layout References: M. Smith, Application Specific Integrated Circuits, Chap. 16 Cadence Virtuoso User Manual Top-level IC design process Typically done before individual
More informationHiPAC High Performance Actives & Passives on Chip
HiPAC High Performance Actives & Passives on Chip Passive Integration on Silicon Solutions & Target Components to be integrated Solutions Resistors Inductors Transformers Capacitors Diodes Transistors
More informationAN 754: MIPI D-PHY Solution with Passive Resistor Networks in Intel Low-Cost FPGAs
AN 754: MIPI D-PHY Solution with Passive Resistor Networks in Intel Low-Cost FPGAs Subscribe Send Feedback Latest document on the web: PDF HTML Contents Contents AN 754: MIPI D-PHY Solution with Passive
More informationIntegrated Circuits Inc. apr H2.2. Datasheet. 40 ~ 80 sec recording voice IC APLUS INTEGRATED CIRCUITS INC.
apr2060 --- H2.2 Datasheet 40 ~ 80 sec recording voice IC APLUS INTEGRATED CIRCUITS INC. Address : 3 F-10, No. 32, Sec. 1, Chenggung Rd., Taipei, Taiwan 115, R.O.C. TEL : 886-2-2782-9266 FAX : 886-2-2782-9255
More informationIBIS-AMI: Assumptions, Terminology & Analytical Flows
IBIS-AMI: Assumptions, Terminology & Analytical Flows Walter Katz (wkatz@sisoft.com) Mike Steinberger (msteinb@sisoft.com) Todd Westerhoff (twesterh@sisoft.com) SiSoft DesignCon IBIS Summit February 3,
More informationTUTORIAL II ECE 555 / 755 Updated on September 11 th 2006 CADENCE LAYOUT AND PARASITIC EXTRACTION
TUTORIAL II ECE 555 / 755 Updated on September 11 th 2006 CADENCE LAYOUT AND PARASITIC EXTRACTION After finishing a schematic of your design (Tutorial-I), the next step is creating masks which are for
More informationUnderstanding IBIS-AMI Simulations
Understanding IBIS-AMI Simulations IBIS European Summit SPI, Turin, Italy May 11, 2016 Richard Allred, Signal Integrity Software Agenda IBIS-AMI Assumptions & Terminology IBIS-AMI Model Components Analysis
More informationSPISim1. SPISim Modeling Suite. IBIS, IBIS-AMI model generation and general modeling
SPISim1 SPISim Modeling Suite IBIS, IBIS-AMI model generation and general modeling SPISim EDA expertise in Signal, Power Integrity and Simulation EDA focusing on SI and PI: SPISim is an EDA company specialized
More informationVirtuoso System Design Platform Unified system-aware platform for IC and package design
Unified system-aware platform for IC and package design The Cadence Virtuoso System Design Platform is a holistic, system-based solution that provides the functionality to drive simulation and LVS-clean
More informationEnabling SI Productivity Part 2. Venkatesh Seetharam Aaron Edwards
Enabling SI Productivity Part 2 Venkatesh Seetharam Aaron Edwards 1 Problem Statement SI engineers use simulation software to squeeze the most performance out of their design. They will tend to focus on
More informationAdvanced Design System 2011 September 2011 IBIS Models
Advanced Design System 2011 September 2011 IBIS Models 1 Agilent Technologies, Inc 2000-2011 5301 Stevens Creek Blvd, Santa Clara, CA 95052 USA No part of this documentation may be reproduced in any form
More informationInterfacing LVPECL 3.3V Drivers with Xilinx 2.5V Differential Receivers Author: Mark Wood
XAPP696 (v1.3) May 1, 2008 Application Note: Virtex-II Pro, Virtex-4, Virtex-5, Spartan-3/3E Families Interfacing LVPECL 3.3V Drivers with Xilinx 2.5V Differential eceivers Author: Mark Wood Summary This
More informationEngineer-to-Engineer Note
Engineer-to-Engineer Note EE-299 Technical notes on using Analog Devices DSPs, processors and development tools Visit our Web resources http://www.analog.com/ee-notes and http://www.analog.com/processors
More informationAC108 Datasheet. 4 Channel High Performance Voice Capture ADCs with I2C/I2S. Revision 1.1. July, 30, 2017
Datasheet 4 Channel High Performance Voice Capture ADCs with I2C/I2S Revision 1.1 July, 30, 2017 Copyright 2017 X-Powers Limited.All Rights Reserved REVISION HISTORY Revision Data Author Description V0.1
More informationTABLE OF CONTENTS 1.0 PURPOSE INTRODUCTION ESD CHECKS THROUGHOUT IC DESIGN FLOW... 2
TABLE OF CONTENTS 1.0 PURPOSE... 1 2.0 INTRODUCTION... 1 3.0 ESD CHECKS THROUGHOUT IC DESIGN FLOW... 2 3.1 PRODUCT DEFINITION PHASE... 3 3.2 CHIP ARCHITECTURE PHASE... 4 3.3 MODULE AND FULL IC DESIGN PHASE...
More informationHP07 Digipot Interface Module
HP07 Digipot Interface Module Overview: The module is designed to provide an easy to use interface for the industry standard Up/Down interface based digital potentiometers. The module accepts either parallel
More informationGrove - I2C Thermocouple Amplifier (MCP9600)
Grove - I2C Thermocouple Amplifier (MCP9600) The Grove - I2C Thermocouple Amplifier (MCP9600) is a thermocouple-to-digital converter with integrated cold-junction and I2C communication protocol. This module
More informationCAN / RS485. Product Description. Technical Reference Note. Interface Adapter. Special Features
CAN / Interface Adapter For SHP Series Total Power: < 1 Watts Input Voltage: 5V Internal Outputs: CAN,, USB, I 2 C Special Features Input Protocols: 1) using Modbus 2) CAN using modified Modbus Output
More informationMPXHZ6130A, 15 to 130 kpa, Absolute, Integrated Pressure Sensor
Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 1.2, 06/2015, 15 to 130 kpa, Absolute, Integrated Pressure Sensor The series sensor integrates on-chip, bipolar op amp circuitry
More informationUNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences Lab #2: Layout and Simulation
UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences Lab #2: Layout and Simulation NTU IC541CA 1 Assumed Knowledge This lab assumes use of the Electric
More informationInstruction on padframe
Instruction on padframe The padframe is a 40-pins padframe for the AMI ABN 1.6um process from MOSIS located at http://www.mosis.org/cell-libraries/scn16-pads/. You should download the CIF file from the
More informationAllegro Sigrity SI Streamlining the creation of high-speed interconnect on digital PCBs and IC packages
Streamlining the creation of high-speed interconnect on digital PCBs and IC packages The Cadence Allegro Sigrity signal integrity (SI) integrated high-speed design and analysis environment streamlines
More informationIBIS (I/O Buffer Information Specification) Version 6.0
IBIS (I/O Buffer Information Specification) Version 6.0 Ratified September 20, 2013 IBIS Open Forum 2013 Contents 1 General Introduction... 3 2 Statement of Intent... 4 3 General Syntax Rules and Guidelines...
More informationAdding scalability to IBIS using AMS languages. Paul R. Fernando
ABSTRACT FERNANDO, PAUL R. Adding scalability to IBIS using AMS languages. (Under the direction of Dr. Paul Franzon.) From 1993 to about 1998, IBIS remained THE digital IO buffer model format. But as the
More informationInnostor Technology Corporation IS817 USB2.0 Flash Disk Controller Specification
IS817 USB2.0 Flash Disk Controller Specification Copyright 2013. All rights reserved. 1 Copyright All Rights Reserved. No part of this document may be reproduced or transmitted in any form or by any means.
More informationMIPI D-PHY Solution with Passive Resistor Networks in Altera Low Cost FPGA
2015.12.23 MIPI D-PHY Solution with Passive Resistor Networks in Altera Low Cost FPGA AN-754 Subscribe Introduction to MIPI D-PHY The Mobile Industry Processor Interface (MIPI) is an industry consortium
More information8051 Interfacing: Address Map Generation
85 Interfacing: Address Map Generation EE438 Fall2 Class 6 Pari vallal Kannan Center for Integrated Circuits and Systems University of Texas at Dallas 85 Interfacing Address Mapping Use address bus and
More informationSPISim StatEye/AMI User s Guide
SPISim StatEye/AMI User s Guide Latest Version: V20180315 SPISim LLC Vancouver, WA 98683, USA Tel. +1-408-905-6692 http://www.spisim.com This user s guide describes the SPISim s StatEye channel analysis
More informationPCB PCB. (dielectric constant) (Crosstalk) ground guard/shunt traces. (termination) side-by-side
PCB 1 PCB PCB PCB ( GHz ) FR-4 GHz (dielectric loss) (dielectric constant) 2 (Crosstalk) ground guard/shunt traces 3 (output impedance)(topology) (termination) 4 ( ) (side-by-side) (over-under) side-by-side
More informationLecture 20: Package, Power, and I/O
Introduction to CMOS VLSI Design Lecture 20: Package, Power, and I/O David Harris Harvey Mudd College Spring 2004 1 Outline Packaging Power Distribution I/O Synchronization Slide 2 2 Packages Package functions
More informationModern Memory Interfaces (DDR3) Design with ANSYS Virtual Prototype approach
Modern Memory Interfaces (DDR3) Design with ANSYS Virtual Prototype approach 1 ANSYS, Inc. Proprietary 2012 ANSYS, Inc. November 14, 2012 1-1 Agenda DDR Design Challenges How does simulation solve these
More informationDescription. Features
1 Description This device is an extension cable between USB device and host (computer) with embedded into connector intelligent integrated circuits on both sides of the cable. The USB cable with the chip
More informationFreescale Semiconductor Data Sheet: Technical Data
Freescale Semiconductor Data Sheet: Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and
More information