Camera Module 2017 Physical Analyses Overview

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Ada Agnes Charles
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1 Camera Module 2017 Physical Analyses Overview Imaging report by Audrey LAHRACH November rue la Noue Bras de Fer NANTES - FRANCE info@systemplus.fr by System Plus Consulting Camera Module Industry

2 Table of Contents Overview / Introduction 4 o Executive Summary o Reverse Costing Methodology 6 o smartphones 7 15 Standard Dual 3D 184 Standard Dual/Iris Scanner Fujitsu Iris Scanner Arrows NX F-04G o 291 TRW Bosch Continental Nissan Range Rover Company services by System Plus Consulting Camera Module Industry

3 Executive Summary This comparative review was conducted to provide insights into the structure and technology of 19 CMOS camera modules (CCM) released in flagship smartphones from the major brands. In this report, rear and front-facing compact camera modules (including standard (mono), dual, iris scanners, and 3D camera modules) are analyzed and compared in terms of structural overview, module integration, lens number and dimensions, CIS resolution, and pixel size. Indeed, OIS and dual-cameras are the big new trends for mobile camera modules. Since our last report in 2015, the automotive camera module has changed completely. Manufacturers have rationalized their components in terms of size and number of boards and connectors, expressing their desire to get closer to the mobile camera module s structure in order to reduce their manufacturing cost. Also, an analysis of five automotive camera modules (three forwards and two surrounds) was realized to highlight the main differences. Mobile is the main driver for technology, asking for more performance in a constrained footprint. Sensor technology has been transformed by stacked BSI technologies. This report explains the main players technology choices and provides a comparison between competitors by System Plus Consulting Camera Module Industry

4 Executive Summary The reverse costing analysis is conducted in 2 phases: Component choice Teardown of the smartphone in order to have access to the Camera Module. Camera Module are studied. Physical analysis Package is analyzed and measured Module are opened and dies are extracted to get data on dimensions, marking Cross-section is made to have access to module structure 2017 by System Plus Consulting Camera Module Industry

5 Mobile CCM Analyzed Rear Facing - Standard 2017 by System Plus Consulting Camera Module Industry

6 Mobile CCM Analyzed Rear Facing Dual/3D 2017 by System Plus Consulting Camera Module Industry

7 Mobile CCM Analyzed Front Facing 2017 by System Plus Consulting Camera Module Industry

8 For more details, complete report is available! 2017 by System Plus Consulting Camera Module Industry

9 Specs (from DeviceSpecifications) 2017 by System Plus Consulting Camera Module Industry

Camera Module with Flex Global View 2017

10 xxxx mm Camera Module with Flex xxxx mm Camera Module with Flex Top View Camera Module with Flex Back View Flex PCB Connector xxxx Positions Flex Marking Camera Module with Flex Global View 2017 by System Plus Consulting Camera Module Industry

11 Camera Module with Flex Marking: RAYOG WLP 30-pin 3.7x3.2x0.45mm Marking: 601 2NWT Gyro 2-Axis ST Microelectronics LGA 16-pin 2.3x2.3x0.7mm Marking: Winbond Q32FWXGIG XSON 4x4x0.45mm 2017 by System Plus Consulting Camera Module Industry

12 Camera Module Dimensions Dimensions without Flex : xxmm x xxmm x xxmm xxmm xxmm Camera Module Top View Disassembly Connector xxx Positions xxxmm Camera Module Side View 2017 by System Plus Consulting Camera Module Industry

13 Camera Module Teardown Camera Module Disassembly overview Plastic Plate with IR Filter Camera Module Disassembly : top part (optic) Camera Module Disassembly : bottom part 2017 by System Plus Consulting Camera Module Industry

14 Camera Module Teardown Passives components Camera Module Disassembly : bottom part 2017 by System Plus Consulting Camera Module Industry

15 Camera Module Teardown Microlenses SEM View Camera Module Disassembly : CMOS Image Sensor 2017 by System Plus Consulting Camera Module Industry

Xxx mm CIS View and Dimensions Xxx mm xxxmm Pixel Array Xxx mm Die Area: xx mm² (xx x xx mm) Nb of PGDW per 12-inch wafer: xxx Pad number: xxx Pixel array: xxx mm² (xx x xx mm) CIS

16 Xxx mm CIS View and Dimensions Xxx mm xxxmm Pixel Array Xxx mm Die Area: xx mm² (xx x xx mm) Nb of PGDW per 12-inch wafer: xxx Pad number: xxx Pixel array: xxx mm² (xx x xx mm) CIS resolution: 4032x3024 (12.2Mp) Pixel area: xx µm² Pixel size: xx µm CIS top view (microlenses and color filters removed) 2017 by System Plus Consulting Camera Module Industry

17 Camera Module Cross-Section - Overview Cross-Section Planes 2017 by System Plus Consulting Camera Module Industry

18 Camera Module Cross-Section Xx mm Xx mm Xx mm Xx mm Xx mm Xx mm Xxx mm Xx mm Xx mm Xx mm Xx mm Xx mm Camera Module Cross-Section Optical View 2017 by System Plus Consulting Camera Module Industry

19 Camera Module Cross-Section Camera Module Cross-Section Optical View All lenses are in xxxx by System Plus Consulting Camera Module Industry

20 Related Reports o Company services o Related reports o Feedbacks o Contact o Legal REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING Iris Scanner Sony IMX400 Tri-stacked Image Sensor Lenovo Phab2Pr Time of Flight Camera Apple Dual Camera Module Rear Facing Dual Camera Module Fujitsu Iris Authentication IR Camera Module & IR LED Camera Module Industry 2015 Mobile CCM Technology Review MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT MEMS & SENSORS Status of the CMOS Image Sensor Industry D Imaging and Sensing by System Plus Consulting Camera Module Industry

21 COMPANY SERVICES 2017 by System Plus Consulting Camera Module Industry

reports per year) Costing Tools Trainings

22 Business Models Fields of Expertise o Company services o Related reports o Feedbacks o Contact o Legal Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings 2017 by System Plus Consulting Camera Module Industry

23 Contact o Company services o Related reports o Feedbacks o Contact o Legal PHOENIX YOLE Inc. FRANKFURT/MAIN Europa Sales Office NANTES Headquarter LYON YOLE HQ KOREA YOLE TOKYO YOLE KK GREATER CHINA YOLE Headquarters 21 rue La Noue Bras de Fer Nantes FRANCE sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA (310) laferriere@yole.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr 2017 by System Plus Consulting Camera Module Industry

Bosch LRR4 Long and Short Range 77GHz Radar

Bosch LRR4 Long and Short Range 77GHz Radar System report by David Le Gac April 2017 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr 2017 by System