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1 9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) info@systemplus.fr - website : October Version 1 Written by: Romain FRAUX DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module ST CIS + Heptagon WLO 1
2 Table of Contents Glossary 1. Overview / Introduction Executive Summary Reverse Costing Methodology 2. Companies Profile CMOS Image Sensors Volume Shipments STMicroelectronics Profil Heptagon Profil 3. Nokia 2330 Teardown Physical Analysis Synthesis of the Physical Analysis Physical Analysis Methodology Camera Module Views & Dimensions Camera X-Ray Camera Module Disassembly CIS Views & Dimensions CIS Markings CIS Bonding CIS Microlenses CIS Pixels CIS Technology node CIS Back view Camera Module Cross-section Package Cross-section Optical Module Cross-section CIS Packaging Cross-section CIS Cross-section Physical Data Summary 5. Manufacturing Process Flow Global Overview CIS Process Flow CIS Wafer-level packaging Process Flow Description of the CIS Wafer Fabrication Unit WL-Optic Process Flow Description of the WL-Optic Wafer Fabrication Unit 6. Cost Analysis Synthesis of the Cost Analysis Main Steps of Economic Analysis Yields Explanation Yields Hypotheses CIS Front-End : Hypotheses CIS FEOL + BEOL Cost CIS Front-End Cost CIS Back-End 0 : 1 st Probe Test & Optical Test CIS WLP Cost CIS WLP Cost per Process Steps CIS WLP : Equipment Cost per Family CIS WLP : Material Cost per Family CIS Die Cost WL-Optic : Hypotheses WL-Optic Front-End Cost WL-Optic Cost per Process Steps WL-Optic : Equipment Cost per Family WL-Optic : Material Cost per Family WL-Optic : Test, dicing and assembly WL-Optic Price Back-End : Final Packaging & Test Camera Module Cost (CIS + WLO + Packaging) 7. Estimated Price Analysis Definition of Prices Manufacturer Financial Ratios Camera Module estimated Manufacturer Price 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module ST CIS + Heptagon WLO 2
3 Physical Analysis Methodology Package is analyzed and measured. X-ray pictures are used to identify the package construction and the redistribution. Package is opened in order to identify the elements constituting it. Cross-section are realized to get overall package data : dimensions, main characteristics. An analysis of the technologies and of the materials used is performed. Lens #1 FR-4 Prepreg Chrome AP layer Glass wafer IR filter Metal housing Lens #2 Polymer spacer wafer Glue Glass carrier CIS photo-diodes TSV Redistribution layer + bumps 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module ST CIS + Heptagon WLO 3
4 Camera Module Views & Dimensions Dimensions: 3.5mm x 3.2mm x 2.5mm Package Top view Package side view Package back view 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module ST CIS + Heptagon WLO 4
5 CIS View & Dimensions CIS + glass carrier top view 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module ST CIS + Heptagon WLO 5
6 CIS Microlenses Microlenses SEM view 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module ST CIS + Heptagon WLO 6
7 Camera Module Cross-Section Camera module cross-section SEM view 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module ST CIS + Heptagon WLO 7
8 CIS Packaging Cross-Section CIS cross-section Vias are performed from the back side of the CIS by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module ST CIS + Heptagon WLO 8
9 WL-Optic Process Flow Lens wafer Blank Glass wafer 200mm Borosilicate type glass IR filter layers evaporation coating Chrome layer sputtering deposition Specific Mastering preparation Master Mold Polymer «Drop deposition» Chrome layer patterning (litho + etch) Replication tool 1st Polymer UV replication Polymer drop + 2 nd UV replication + mask alignement 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module ST CIS + Heptagon WLO 9
10 CIS Back-End 0 : WLP Cost 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module ST CIS + Heptagon WLO 10
11 CIS Back-End 0 : WLP Cost per process steps CIS WLP Steps Cost (Simulated with MEMS CoSim+ Cost Simulation Tool) 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module ST CIS + Heptagon WLO 11
12 CIS Die Cost 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 Camera Module ST CIS + Heptagon WLO 12
21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website :
21 rue La Nouë Bras de Fer - 44200 Nantes - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr November 2012 - Version 1 Written by: Romain FRAUX DISCLAIMER :
9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :
9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr August 2011 - Version 1 Written by: Sylvain HALLEREAU
9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :
9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr May 2011 - Version 2 Written by: Sylvain HALLEREAU DISCLAIMER
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9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :
9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr June 2012 - Version 1 written by : Maher SAHMIMI DISCLAIMER
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