21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website :

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1 21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) info@systemplus.fr - website : August Version 1 Written by: Maher SAHMIMI DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 1

2 Table of Contents 1. Overview / Introduction 3 Executive Summary Reverse Costing Methodology Process Flow X/Y Magnetometer Process Flow Packaging Description of the Wafer Fabrication Unit 2. Company Profile Physical Analysis.9 Synthesis of the Physical Analysis Physical Analysis methodology Package characteristics & markings Package opening Package Opening : Dies Bonding Package Cross Section Accelerometer ASIC Marking Accelerometer ASIC Dimensions Accelerometer ASIC minimal dimensions Accelerometer ASIC Cross section Accelerometer ASIC Process Characteristics Accelerometer MEMS marking Accelerometer MEMS Opening Accelerometer MEMS Sensing Area Accelerometer MEMS Cap Accelerometer MEMS Process Characteristics Z-Axis Magnetometer + ASIC marking Z-Axis Magnetometer + ASIC Dimensions Z-Axis Magnetometer + ASIC Cross Section Z-Axis Magnetometer + ASIC process Characteristics X/Y-Axis Magnetometer marking X/Y-Axis Magnetometer Dimensions X/Y-Axis Magnetometer Cross Section X/Y-Axis Magnetometer Process Characteristics 4. Manufacturing Process Flow. 100 Global view Process Flow Accelerometer ASIC Process Flow MEMS Accelerometer Process Flow Z-Axis Magnetometer + ASIC 5. Cost Analysis..123 Synthesis of the cost analysis Methodology Hypothesis Yield Synthesis Accelerometer ASIC Wafer Cost Accelerometer ASIC Die Cost Data Z-Axis Magnetometer + ASIC Wafer Cost Z-Axis Magnetometer + ASIC Die Cost MEMS Accelerometer Wafer Cost MEMS Accelerometer cost per Steps MEMS Accelerometer Equipment cost MEMS Accelerometer Material cost MEMS Accelerometer Die Cost X/Y-Axis Magnetometer Wafer Cost X/Y-Axis Magnetometer cost per Steps X/Y-Axis Magnetometer Material cost X/Y-Axis Magnetometer Die Cost Back-End : Package Cost Back-End : Package Cost Per Steps Back-End : Package Material cost Back-End : Final Test BMC050 Manufacturing Cost Cost Analysis Evolution over yield 6. Estimated Selling Price Analysis 163 Supply Chain Analysis Estimated Selling Price Price Evolution according to the yield Glossary Contacts 2012 by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 2

3 2012 by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 3

4 Package Characteristics & Markings Package type : LGA-16pins 3.00mm Dimensions : 3.00mm x 3.00mm x 0.95mm Pin pitch : 0.5mm Package Top view Package Tilt view 3.00mm 0.50mm 0.95mm Package Back view Package Side view 2012 by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 4

5 Package Opening :Main Parts 2012 by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 5

6 MEMS Accelerometer - Pad opening 2012 by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 6

7 X/Y Magnetometer - Principle 2012 by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 7

8 2012 by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 8

9 MEMS Accelerometer - Process Flow Drawing 2/4 Structural Layer Metal Layer Sensor Si wafer Structural Layer (Poly 3) deposition CMP & ion implant Metal deposit Pattern & etch C4F8 / SF6 Sensor Si wafer Poly 3 Pattern & etch (DRIE) HF Vapor Sensor Si wafer Oxide 2 & 3 etch, HF Vapor : Release mobile elements drawing not to scale 2012 by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 9

10 Main steps of economic analysis Accelerometer ASIC Front-End Cost MEMS Accelerometer Front-End Cost Z-Axis Magnetometer + ASIC Front-End Cost X/Y-Axis magnetometer Front-End Cost Probe Test Cost Probe Test Cost Probe Test Cost Probe Test Cost Dicing Cost Dicing Cost Dicing Cost Dicing Cost Packaging Cost Final Test Cost Component Cost We perform the economic analysis of the Accelerometer ASIC and the Z-Axis Magnetomer + ASIC with the IC Price+ software. We perform the economic analysis of the MEMS Accelerometer, the X/Y-Axis Magnetometer and the packaging with the MEMS CoSim+ software by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 10

11 X/Y Magnetometer - Wafer cost Breakdown 2012 by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 11

12 X/Y Magnetometer - Cost per step X/Y Magnetometer Manufacturing Steps Cost (Simulated with MEMS CoSim+ Cost Simulation Tool) 2012 by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 12

13 Estimated Prices 2012 by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 13

14 Conclusion Reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates. Given the hypothesis presented in this analysis the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated) IC +/- 8% MEMS +/- 5% Packaging +/- 10% Test +/- 20% These results are open for discussion. We can re-evaluate this circuit with your information. Please contact us: 2012 by SYSTEM PLUS CONSULTING, all rights reserved. Bosch BMC050, 6-Axis Electronic Compass 14