Specification for release - Preliminary
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1 Description: Features: B Schematic and Pin Configuration: ESD Protection for 2 high-speed I/O channels and DD Provide ESD protection for each channel to IEC (ESD) ±15k (air), ±8k (contact) IEC (EFT) (5/50ns) 20 (I/O), 40 (DD) IEC (Lightning) 6 (8/20µs) Below 5 operating voltage: Ultra Low capacitance: 2.0pF typical I/O 1 DD I/O Mechanical Characteristics: Package Molding compound flamability rating: UL94-0 Packaging: Tape & Reel I/O 1 GND I/O 2 C bsolute Maximum Ratings: Symbol Rating Unit Peak Pulse Current (tp = 8/20µs) Operating Supply oltage, DD to GND 6 ESD per IEC (ir / Contact), I/O to GND DC oltage at any I/O Pin I PP DC ESD,IO ESD,DD ESD per IEC (ir / Contact), DD to GND 15 / 8 Operating Temperature T Op -40 to +125 C Storage Temperature T Sto -20 to +60 C IO 6 15 / 8 (GND -0,5) to (DD +0,5) k k D Electrical Characterisitcs: Properties Test Conditions alue alue alue Unit min typ max RWM Pin 5 to Pin 2 5 B I B =1m, Pin 5 to Pin I R Pin5 =5, Pin 5 to Pin 2 5 µ I R,IO Pin5 =5, Pin2 =0, I/O to GND 1 µ F I F = 15m, Pin 2 to Pin v C I PP =5, tp=8/20µs, I/O to GND 7.7 v Cl,IO I TLP = 17, I/O to GND 10.0 v Cl,DD I TLP = 17, DD to GND 9.2 C IO Pin5 =5, Pin2 =0, IO =2.5, f=1mhz, I/O to GND pf C X Pin5 =5, Pin2 =0, IO =2.5 f=1mhz, between I/O pins pf PGE 1 OF 5
2 E Typical Characteristics: Peak Pulse Derating in % of PeakPulse Current in % Temp Ipp 12 Current I/O to GND I/O to GND DD to GND DD to GND 6,2 6, ,7 7, ,4 8, mbient Temperature T ( ) Power Derating Curve Clamping oltage [] Peak Pulse Current [] Waveform Parameters: tr= 8 µs td = 20µs Clamping oltage vs. Peak Pulse Current Capacitance [pf] 4,0 3,5 3,0 2,5 2,0 1,5 1,0 U I/O to GND DD to GND 0 2,3 3,3 DD = floated 0,5 2,2 3,05 GND = 0 1,5 2,05 f = 1MHz 2,9 2,5 2 2,8 3,5 2,1 2,7 4,5 2,32 2,65 5 DD = 2,55 5 2,6 GND = 0 f = 1MHz 0,5 0, oltage [] ariation of C IO vs. IO PGE 2 OF 5
3 E Typical Characteristic: TLP Current [] 18,0 16,0 14,0 12,0 10,0 8,0 6,0 4,0 I/O to GND U I/O to GND DD to GND DD to GND 0,5 0,1 0,1 9 0,1 0,1 9,5 0,1 0,1 I/O start 6,2 0,2 I/O end DD start 6,2 0,2 DD end 9, ns Rise time: 1ns Pulse DUT I 2,0 0, TLP oltage [] Transmission Line Pulsing (TLP) Measurement Transmission Line Pulsing System F Recommended Land Layout: G Body Marking: C 0.30 mm F E D B 0.5 mm C 0.5 mm D 1.4 mm 01XY B E 0.90 mm F 1.90 mm : Device Code X: Date Code Y: Control Code PGE 3 OF 5
4 H Dimensions: PGE 4 OF 5
5 Specification for release I Tape: Feeding Direction ØD E F Pin 1 K I J G 2.25 REF mm B 4.00 ± 0.10 mm C 8.00 ± 0.20 mm D 1.55 ± 0.05 mm E 4.00 ± 0.10 mm F 2.00 ± 0.05 mm G 1.75 ± 0.10 mm H 3.50 ± 0.05 mm I 2.4 REF mm J 1.2 REF mm K 0.30 ± 0.02 mm H C B J Reel: a ± 2.0 mm b 13.0 ± 0.8 mm c 10.0 ± 1.5 mm d 12.5 ± 2.0 mm b a 165 to 180 c d Quantity per Reel: 3000 General Release: Customer... Date... Signature Würth Elektronik Checked pproved JB ersion Name Modification Date This electronic component has been designed and developed for usage in general electronic equipment. Before incorporating this component into any equipment where higher safety and reliability is especially required or if there is the possibility of direct damage or injury to human body, for example in the range of aerospace, aviation, nuclear control, submarine, transportation, (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc, Würth Elektronik eisos GmbH must be informed before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. PGE 5 OF 5
Specification for release
Description: Package: SOT23-5L Specification for release Features: B Schematic and Pin Configuration: ESD Protection for 2 high-speed I/O channels and DD Provide ESD protection for each channel to IEC
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Description: TS Diode rray WE-TS Specification for release Features: B Schematic and Pin Configuration: ESD Protection for 2 high-speed I/O channels and DD Provide ESD protection for each channel to IEC
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