High Value Manufacturing for Low Cost Electronics

Size: px
Start display at page:

Download "High Value Manufacturing for Low Cost Electronics"

Transcription

1 High Value Manufacturing for Low Cost Electronics Cambridge Integrated Knowledge Centre 18 December 2012

2 Low Cost Printing? Myth Printing is cheap Functional inks enable printing of electronics Additive processes minimise usage of expensive functional materials Digital printing allows designs to be changed easily High speed roll-to-roll printing provides economies of scale Conventional printing companies can easily move into printed electronics Reality Improving printing sufficiently for electronics makes it expensive Controlling quality & consistency of functional inks is very challenging Subtractive processes can use lower cost materials; smaller feature sizes enable much lower material usage Electronic reliability requires standard designs (or at least standard building blocks) so benefit is limited Starting and stopping a roll-to-roll process wastes material Electronics requires expertise in functional testing & yield management

3 Manufacture in Far East? Myth Printed electronics requires a large fab similar to conventional electronics Far East labour rates will make production more cost effective there Far East companies are generally better at manufacturing in high volume on razor-thin margins Reality Simplified processes allow smaller scale manufacture and modularity of production Printed electronics production can be largely automated, hence maximising utilisation of capital equipment is often a more significant cost driver Many printed electronics applications are driven by value not merely price (thin, flexible, transparent, robust, ) so decent margins can be maintained

4 PragmatIC Printing enables printed logic circuits that introduce intelligence and interactivity into a wide range of novel product form factors: thin, flexible, transparent, robust, disposable,

5 PragmatIC Printed Electronics Ultra small feature size enabling dense logic in a small footprint Minimises material usage Maximises capital equipment utilisation High volume production with low throughput processes High Value Manufacturing for Low Cost Electronics

6 Imprinted Electronic Logic Thin, flexible, transparent, robust, disposable,

7 Electronics via Imprint The oldest form of printing! Clay imprints from stone stamps ~4000BC Cylinder seals in recorded use ~2000BC Mesopotamian cylinder seal & impression Industrial use for high volume, low cost replication Optical microstructures (e.g. holography for security / decoration) Optical disc manufacturing (CD, DVD, BluRay) Nano-imprint proven down to feature size ~10nm PragmatIC imprinted electronics feature size 50nm 5µm Planar Nano Diode array via imprint

8 Novel Device Architectures Conventional Thin Film Transistor (TFT) PragmatIC Planar Nano-Transistor (PNT) Insulating Trench Gate Gate Contact Dielectric (Insulator) Semiconductor Semiconductor Contact Gate Contact Substrate Substrate Complex 3D structure Multiple patterning steps needing precise alignment Challenging to print Can improve by using self-registered structures Simple planar 2D structure Single patterning step entirely within semiconductor layer Requires sub-µm features Nano-imprint enables ultra-small devices

9 PragmatIC Business Model Imprinted Logic Manufacturers Integrators & Converters Application End-Users Commercial Licensing Prototype/Pilot Supply Technology transfer with joint industrial process development System integration to demonstrate functionality and form factor Pilot Production Facility Scale-up of lab process using off-the-shelf equipment Intellectual Property Platform for Imprinted Logic Proven & patented transistor, diode and circuit architectures optimised for imprint

10 PragmatIC Pilot Production Printable Electronics Technology Centre (part of Centre for Process Innovation) in Sedgefield, U.K. 600m2 cleanroom plus 100m2 test & inspection lab Suitable for projects with 10k 1M unit quantities Centre for Process Innovation

11 Production Scale-up Example Optical disc production model Self contained cleanroom Thin film vacuum material deposition (up to 7 layers) Nano-scale imprint patterning (to 50nm) In-line test and inspection Origin Azul Blu-ray Disk production equipment Throughput 5s/disk: >10Bn circuits per year Cost $1/disk: <0.1c per logic circuit

12 Summary Unique platform for printed logic Patented device architectures using proven imprint process Higher density and performance than other printed electronics Simplified, scalable, ultra low cost manufacturing Compelling market opportunity Potential in multiple billion dollar market segments Growing revenue from end customers validates initial applications Licensing technology for industrial process scale-up Also partnering to solve system integration challenges Pilot-scale production for early commercial deployment

13 PragmatIC Printing Ltd St John s Innovation Centre Cowley Road, Cambridge CB4 0WS United Kingdom

High Value Manufacturing for Low Cost Electronics

High Value Manufacturing for Low Cost Electronics High Value Manufacturing for Low Cost Electronics 10th Anniversary High Value Manufacturing Conference 2012 14 November 2012 Cambridge www.cir-strategy.com/events/ PragmatIC Printing enables printed logic

More information

FlexLogIC Manufacturing innovation by PragmatIC

FlexLogIC Manufacturing innovation by PragmatIC FlexLogIC Manufacturing innovation by PragmatIC Introductory presentation www.flexlogic.systems The FlexLogIC programme has received funding from the European Union s Horizon 2020 SME Instrument (grant

More information

NANOMETRIC LAB PRINTER. Plug & Play Solution for ultra-precise printing of conductive lines in nano-scale

NANOMETRIC LAB PRINTER. Plug & Play Solution for ultra-precise printing of conductive lines in nano-scale NANOMETRIC LAB PRINTER Plug & Play Solution for ultra-precise printing of conductive lines in nano-scale WHO ARE WE? WHAT IS OUR SOLUTION? XTPL S.A. is a company operating in the nanotechnology segment.

More information

Problem 2 If the cost of a 12 inch wafer (actually 300mm) is $3500, what is the cost/die for the circuit in Problem 1.

Problem 2 If the cost of a 12 inch wafer (actually 300mm) is $3500, what is the cost/die for the circuit in Problem 1. EE 330 Homework 1 Fall 2016 Due Friday Aug 26 Problem 1 Assume a simple circuit requires 1,000 MOS transistors on a die and that all transistors are minimum sized. If the transistors are fabricated in

More information

Subodh Kulkarni Executive Director, R&D

Subodh Kulkarni Executive Director, R&D Subodh Kulkarni Executive Director, R&D Imation Magnetic and Optical Technologies November 15, 2005 Imation Participates in All Four Pillars of Storage Magnetic Tape Cartridges Recordable CD/DVD Advanced

More information

PRODUCING TESTING Super Audio CD (SACD)

PRODUCING TESTING Super Audio CD (SACD) PRODUCING TESTING Super Audio CD (SACD) by DaTARIUS Technologies GmbH SACD Hybrid Disc Developed by Sony and Philips, the Super Audio CD or SACD is the next generation music format that provides ultra-high

More information

Flexible Organic LCD: From lab to fab to the next wave of products

Flexible Organic LCD: From lab to fab to the next wave of products IoT Wearables Flexible Organic LCD: From lab to fab to the next wave of products Dr Paul Cain Strategy Director, FlexEnable 3 November 2017 Cambridge, UK Sensors Displays Conference www.cir-strategy.com/events

More information

Bringing a new flexible display technology into mass production. Chuck Milligan CEO, FlexEnable

Bringing a new flexible display technology into mass production. Chuck Milligan CEO, FlexEnable Bringing a new flexible display technology into mass production Chuck Milligan CEO, FlexEnable Years of development and investment have made FlexEnable the clear leader in Plastic Large-area Electronics

More information

Flexible Organic Electronics: From Lab to Fab to the Next Wave of Products. Mike Banach, Technical Director

Flexible Organic Electronics: From Lab to Fab to the Next Wave of Products. Mike Banach, Technical Director Flexible Organic Electronics: From Lab to Fab to the Next Wave of Products Mike Banach, Technical Director FlexEnable at a glance Headquarters Cambridge, UK World s most experienced team of plastic electronics

More information

The leading supplier of industrial printheads. Liquid Engineering. Steve Temple, Technical Director

The leading supplier of industrial printheads. Liquid Engineering. Steve Temple, Technical Director Liquid Engineering Steve Temple, Technical Director Introduction to Xaar Core patents filed 1987 by Cambridge Consulting Ltd Xaar formed to exploit IPR in 1990 11 Licenses signed from 1991 2001 IPO to

More information

TABLE OF CONTENTS III. Section 1. Executive Summary

TABLE OF CONTENTS III. Section 1. Executive Summary Section 1. Executive Summary... 1-1 Section 2. Global IC Industry Outlook and Cycles... 2-1 IC Insights' Forecast Methodology... 2-1 Overview... 2-1 Worldwide GDP... 2-1 Electronic System Sales... 2-2

More information

Manufacturing Challenges for Lithography in the Textured Disc Paradigm. September 18 th, 2008 Babak Heidari

Manufacturing Challenges for Lithography in the Textured Disc Paradigm. September 18 th, 2008 Babak Heidari Manufacturing Challenges for Lithography in the Textured Disc Paradigm September 18 th, 2008 Babak Heidari Longitudinal Perpendicular Pattern media + HAMR 6,25 T/in 2 TDK: DTR 602 Gb/in 2 1 T/in 2 150

More information

Nex t MADE IN JAPAN. Copyright 2003 Hitachi Global Storage Technologies

Nex t MADE IN JAPAN. Copyright 2003 Hitachi Global Storage Technologies Nex t MADE IN JAPAN. 1 HDD Business Strategy Toward The No.1 HDD Supplier In The World Jun Naruse Chief Executive Officer Hitachi Global Storage Technologies June 12, 2003 Contents 1 2 3 4 5 Market Trends

More information

Lockheed Martin Nanosystems

Lockheed Martin Nanosystems Lockheed Martin Nanosystems National Nanotechnology Initiative at Ten: Nanotechnology Innovation Summit December 2010 Dr. Brent M. Segal Director & Chief Technologist, LM Nanosystems brent.m.segal@lmco.com

More information

Kevin Fitzgibbon (CEO) Richard Linger (Executive Chairman)

Kevin Fitzgibbon (CEO) Richard Linger (Executive Chairman) Kevin Fitzgibbon (CEO) Richard Linger (Executive Chairman) Gaia House, Cloghphilip, Tower, Co. Cork, T23 EC61, Ireland info@predictivecontrolsystems.com +353 (0)21 4335095 Predictive Control Systems Next

More information

EXPLORING THE OPPORTUNITIES FOR PEEK IN 3D PRINTING

EXPLORING THE OPPORTUNITIES FOR PEEK IN 3D PRINTING EXPLORING THE OPPORTUNITIES FOR PEEK IN 3D PRINTING Martin Court Managing Director, Medical & Emerging Businesses Victrex plc 11 December 2017 N+1 Singer 290m+ sales 23% ROCE (10 year average) Operating

More information

The World. Connected. OVERVIEW

The World. Connected. OVERVIEW The World. Connected. OVERVIEW THE WORLD. CONNECTED. www.fibrefab.com CONTENTS 04 ABOUT US 06 OUR HISTORY 07 08 OUR FAMILY SHARING OUR CORE VALUES 10 OUR CAPABILITIES 12 OUR PRODUCTS 14 OUR SOLUTIONS 16

More information

Maximizing Cost Efficiencies and Productivity for AMOLED Backplane Manufacturing. Elvino da Silveira

Maximizing Cost Efficiencies and Productivity for AMOLED Backplane Manufacturing. Elvino da Silveira Maximizing Cost Efficiencies and Productivity for AMOLED Backplane Manufacturing Elvino da Silveira Agenda Introductions & Trends Consumer products driving AMOLED Adoption! Lithography Challenges Devices

More information

Keeping the lid on storage

Keeping the lid on storage Keeping the lid on storage Drive significant cost savings through innovation and efficiency Publication date: December 2011 Optimising storage performance & costs through innovation As the compute power

More information

Chapter 1 Introduction

Chapter 1 Introduction Chapter 1 Introduction 1.1 MOTIVATION 1.1.1 LCD Industry and LTPS Technology [1], [2] The liquid-crystal display (LCD) industry has shown rapid growth in five market areas, namely, notebook computers,

More information

SIMETAL CIS Gimbal Top. An Automated Blast Furnace Charging System for Infinite Flexibility in Burden Profiles. Metals Technologies

SIMETAL CIS Gimbal Top. An Automated Blast Furnace Charging System for Infinite Flexibility in Burden Profiles. Metals Technologies SIMETAL CIS Gimbal Top An Automated Blast Furnace Charging System for Infinite Flexibility in Burden Profiles Metals Technologies Maximising Charging Flexibility at Minimal Investment Cost The challenge

More information

FACTFILE: GCE DIGITAL TECHNOLOGY

FACTFILE: GCE DIGITAL TECHNOLOGY FACTFILE: GCE DIGITAL TECHNOLOGY AS2: FUNDAMENTALS OF DIGITAL TECHNOLOGY Hardware and Software Architecture 2 Learning Outcomes Students should be able to: explain the need for secondary storage; describe

More information

Technology & Manufacturing. Laurent Bosson Executive Vice President Front End Technology & Manufacturing

Technology & Manufacturing. Laurent Bosson Executive Vice President Front End Technology & Manufacturing Technology & Manufacturing Laurent Bosson Executive Vice President Front End Technology & Manufacturing Manufacturing and Technology Strategy LEADING EDGE TECHNOLOGY + SHAREHOLDER VALUE TIME TO MARKET

More information

Memjet ML Printhead from the RapidX1 Color Label Printer

Memjet ML Printhead from the RapidX1 Color Label Printer ML210700 Printhead from the RapidX1 Color Label Printer MEMS Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com MEMS Process Review Some of the

More information

GLOBAL MARKETS FOR ROLL-TO-ROLL TECHNOLOGIES FOR FLEXIBLE DEVICES

GLOBAL MARKETS FOR ROLL-TO-ROLL TECHNOLOGIES FOR FLEXIBLE DEVICES GLOBAL MARKETS FOR ROLL-TO-ROLL TECHNOLOGIES FOR FLEXIBLE DEVICES SMC082B January 2016 Margareth Gagliardi Project Analyst ISBN: 1-62296-209-5 BCC Research 49 Walnut Park, Building 2 Wellesley, MA 02481

More information

The Platform for High-Quality Blu-ray Discs

The Platform for High-Quality Blu-ray Discs BLULINE II The Platform for High-Quality Blu-ray Discs BLULINE II Reliable Replication System for Single Layer Discs with 25 GB as well as Dual Layer Discs with 50 GB and with 66 GB Storage Capcity The

More information

New Zealand Government IbM Infrastructure as a service

New Zealand Government IbM Infrastructure as a service New Zealand Government IbM Infrastructure as a service Global leverage / local experts World-class Scalable Agile Flexible Fast Secure What are we offering? IBM New Zealand Government Infrastructure as

More information

Setting the Test Standard for Tomorrow. Nasdaq: AEHR

Setting the Test Standard for Tomorrow. Nasdaq: AEHR Setting the Test Standard for Tomorrow Nasdaq: AEHR Forward Looking Statements This presentation contains forward-looking statements that involve risks and uncertainties relating to projections regarding

More information

Maximizing Cost Efficiencies and Productivity for AMOLED Backplane Manufacturing. Elvino da Silveira

Maximizing Cost Efficiencies and Productivity for AMOLED Backplane Manufacturing. Elvino da Silveira Maximizing Cost Efficiencies and Productivity for AMOLED Backplane Manufacturing Elvino da Silveira Agenda Introductions & Trends Consumer products driving AMOLED Adoption! Lithography Challenges Devices

More information

Integrated circuits and fabrication

Integrated circuits and fabrication Integrated circuits and fabrication Motivation So far we have discussed about the various devices that are the heartbeat of core electronics. This modules aims at giving an overview of how these solid

More information

IBM iseries Models 800 and 810 for small to medium enterprises

IBM iseries Models 800 and 810 for small to medium enterprises Multi-platform management, exceptional price performance IBM iseries Models 800 and 810 for small to medium enterprises Highlights Simple, centralised Simple Windows ** Integration for management of multiple

More information

Beyond Chip Stacking---Quilt Packaging Enabled 3D Systems

Beyond Chip Stacking---Quilt Packaging Enabled 3D Systems Beyond Chip Stacking---Quilt Packaging Enabled 3D Systems Jason Kulick, President & Co-Founder jason.kulick@indianaic.com 574-217-4612 (South Bend, IN) May 3, 2016 2016 New England IMAPS Symposium Presentation

More information

ML TM Technology: The Future of Optical Disc Recording

ML TM Technology: The Future of Optical Disc Recording ML TM Technology: The Future of Optical Disc Recording Tom Burke Calimetrics, Inc. 815 Atlantic Avenue, Suite 105, Alameda, CA 94501 Phone:+1-510-864-4100 x106 FAX: +1-510-864-4188 E-mail: trburke@calimetrics.com

More information

SOITEC REPORTS SECOND QUARTER FY 17 REVENUES OF 56.7 M, UP 4% COMPARED WITH THE SECOND QUARTER OF FY 16 AT CONSTANT EXCHANGE RATES

SOITEC REPORTS SECOND QUARTER FY 17 REVENUES OF 56.7 M, UP 4% COMPARED WITH THE SECOND QUARTER OF FY 16 AT CONSTANT EXCHANGE RATES SOITEC REPORTS SECOND QUARTER FY 17 REVENUES OF 56.7 M, UP 4% COMPARED WITH THE SECOND QUARTER OF FY 16 AT CONSTANT EXCHANGE RATES Continued sustainable growth in Communication & Power 200-mm wafer sales

More information

Transform your bottom line: 5G Fixed Wireless Access

Transform your bottom line: 5G Fixed Wireless Access Transform your bottom line: 5G Fixed Wireless Access Transform Your Bottom Line: 5G Fixed Wireless Access 1 Seizing the opportunity of 5G with Fixed Wireless Access To get a sense of the future of broadband,

More information

The World. Connected. OVERVIEW

The World. Connected. OVERVIEW The World. Connected. OVERVIEW THE WORLD. CONNECTED. www.fibrefab.com CONTENTS 04 ABOUT US 06 OUR HISTORY 07 08 OUR FAMILY SHARING OUR CORE VALUES 10 OUR CAPABILITIES 12 OUR PRODUCTS 14 OUR SOLUTIONS 16

More information

Spectra7 at a Glance. Spectra7 Product Illustration. Blue-Chip End Users

Spectra7 at a Glance. Spectra7 Product Illustration. Blue-Chip End Users Ticker: SEV Spectra7 at a Glance Company Overview What We Do San Jose, CA Corporate HQ Spectra7 manufactures high performance analog chips with patented advanced signal processing technology The Company

More information

Information & Telecommunication Systems

Information & Telecommunication Systems Review of Operations Information & Telecommunication Systems This segment recorded a 4% year-on-year increase in revenues, to 2,360.9 billion (U.S.$20,179 million), the result of growth in disk array subsystems,

More information

COMPUTACENTER AND CITRIX TOGETHER

COMPUTACENTER AND CITRIX TOGETHER COMPUTACENTER AND CITRIX TOGETHER COMPUTACENTER S CORE CITRIX CREDENTIALS Computacenter is a Citrix Platinum Partner and the largest UK partner by revenue We have helped in excess of 500 customers take

More information

3D systems-on-chip. A clever partitioning of circuits to improve area, cost, power and performance. The 3D technology landscape

3D systems-on-chip. A clever partitioning of circuits to improve area, cost, power and performance. The 3D technology landscape Edition April 2017 Semiconductor technology & processing 3D systems-on-chip A clever partitioning of circuits to improve area, cost, power and performance. In recent years, the technology of 3D integration

More information

Advanced microprocessor systems

Advanced microprocessor systems Advanced microprocessor systems Microprocessor Evolution First Transistor Discrete Transistors Bipolar FET Planar Transistors BJT FET 1971 1972 10,000 nm 10,000 nm 1978 1985 8086 29000 transistors 3000

More information

Turning partnership into success

Turning partnership into success Turning partnership into success Into the future with intelligent solutions IT infrastructure: Flexible. Standardised. A perfect fit. Why Rittal? As a global leader in the supply of IT infrastructure,

More information

4net Technologies. Fixed Voice and Data Services V

4net Technologies. Fixed Voice and Data Services V 4net Technologies Fixed Voice and Data Services V1.02-1115 Fixed Voice and Data Services Every business needs network services. However, they can be a considerable overhead, often poorly managed by providers

More information

REDUCING THE COST OF METRO FIBRE ACCESS A SOLUTION GUIDE FOR SERVICE PROVIDERS

REDUCING THE COST OF METRO FIBRE ACCESS A SOLUTION GUIDE FOR SERVICE PROVIDERS REDUCING THE COST OF METRO FIBRE ACCESS A SOLUTION GUIDE FOR SERVICE PROVIDERS THE FIBRE CHALLENGE FIBRE: PLENTIFUL COMMODITY OR SCARE & EXPENSIVE RESOURCE? For those Carriers able to lay their own fibre,

More information

Challenges in Manufacturing of optical and EUV Photomasks Martin Sczyrba

Challenges in Manufacturing of optical and EUV Photomasks Martin Sczyrba Challenges in Manufacturing of optical and EUV Photomasks Martin Sczyrba Advanced Mask Technology Center Dresden, Germany Senior Member of Technical Staff Advanced Mask Technology Center Dresden Key Facts

More information

Frank Russomanno Executive Vice President and Chief Operating Officer

Frank Russomanno Executive Vice President and Chief Operating Officer November 2005 Frank Russomanno Executive Vice President and Chief Operating Officer 2005 Operations Review and Highlights November 15, 2005 Agenda Product Strategy Four Pillars of Storage Regional Market

More information

Sprue Recycling. Optimize production by saving polycarbonate

Sprue Recycling. Optimize production by saving polycarbonate Page 1 of 8 Sprue Recycling Optimize production by saving polycarbonate Introduction A recent trend in optical media manufacturing is the escalating price of polycarbonate. Traditionally, sprues generated

More information

External Memory. Computer Architecture. Magnetic Disk. Outline. Data Organization and Formatting. Write and Read Mechanisms

External Memory. Computer Architecture. Magnetic Disk. Outline. Data Organization and Formatting. Write and Read Mechanisms Computer Architecture Prof. Dr. Nizamettin AYDIN naydin@yildiz.edu.tr nizamettinaydin@gmail.com External Memory http://www.yildiz.edu.tr/~naydin 1 2 Outline Types of External Memory Magnetic Disk Magnetic

More information

More Course Information

More Course Information More Course Information Labs and lectures are both important Labs: cover more on hands-on design/tool/flow issues Lectures: important in terms of basic concepts and fundamentals Do well in labs Do well

More information

FULLY ORGANIC INTEGRATED ARRAYS ON FLEXIBLE SUBSTRATES FOR X-RAY IMAGING

FULLY ORGANIC INTEGRATED ARRAYS ON FLEXIBLE SUBSTRATES FOR X-RAY IMAGING Pawel E. Malinowski FULLY ORGANIC INTEGRATED ARRAYS ON FLEXIBLE SUBSTRATES FOR X-RAY IMAGING IISW Snowbird, 13 th June 2013 FLEXIBLE ORGANIC IMAGERS: MOTIVATION light-weight flexible robust compatible

More information

Computer Aided Engineering (CAE)

Computer Aided Engineering (CAE) 1 Computer Aided Engineering (CAE) in Nuclear Generation and Decommissioning Darren Grears CAE Development Lead, Energy UK & Europe darren.grears@atkinsglobal.com +44 (0) 1946 521869 28 April 2017 2 Agenda

More information

Cost of Ownership: CDMA 2000 Competitive Advantage. Paul Edwards Chairman Starcomms, Nigeria

Cost of Ownership: CDMA 2000 Competitive Advantage. Paul Edwards Chairman Starcomms, Nigeria Cost of Ownership: CDMA 2000 Competitive Advantage Paul Edwards Chairman Starcomms, Nigeria Teledensity Facts & Figures > Teledensity & Internet Penetration has a direct positive impact on levels of economic

More information

Specialised Server Technology for HD Surveillance

Specialised Server Technology for HD Surveillance Specialised Server Technology for HD Surveillance With our entry level server technology starting with double the throughput of commercially available IP CCTV standards, Secure Logiq servers have been

More information

DECLOUT S 1H 2014 REVENUE UP 65% TO $45.6 MILLION ON STRONG PERFORMANCE BY IT INFRASTRUCTURE SERVICES SEGMENT

DECLOUT S 1H 2014 REVENUE UP 65% TO $45.6 MILLION ON STRONG PERFORMANCE BY IT INFRASTRUCTURE SERVICES SEGMENT NEWS RELEASE DECLOUT S 1H 2014 REVENUE UP 65% TO $45.6 MILLION ON STRONG PERFORMANCE BY IT INFRASTRUCTURE SERVICES SEGMENT Revenue contribution from overseas operations grew four-fold to $21.7 million

More information

Common Platform Ecosystem Enablement

Common Platform Ecosystem Enablement Joe Abler Common Platform Ecosystem Enablement IBM provides a complete Foundry solution Innovative technology Leadership road map with advanced SiGe & RF offerings Leading-edge CMOS process development

More information

COPPER STRUCTURED CABLING SOLUTIONS

COPPER STRUCTURED CABLING SOLUTIONS COPPER STRUCTURED CABLING SOLUTIONS 2 UPDATE TO A COPPER IMAGE The World. Connected. Communication is changing and the ways in which we can connect are evolving. People, homes, businesses, venues, and

More information

Investor Presentation October 2018

Investor Presentation October 2018 Investor Presentation October 2018 Safe Harbor This presentation contains forward-looking statements concerning Atomera Incorporated ( Atomera, the Company, we, us, and our ). The words believe, may, will,

More information

SINGULUS TECHNOLOGIES SINGULUS TECHNOLOGIES AG

SINGULUS TECHNOLOGIES SINGULUS TECHNOLOGIES AG SINGULUS TECHNOLOGIES September 2014 1851 History 09-2014 - 2 - Ernst Leybold started his business in Cologne Company building 1860 LEYBOLD HERAEUS Vacuum Technology, Metallurgy and Coating Foundation

More information

Matsushita MN2DS0015 System on a Chip for DVD Players 65 nm CMOS Process Structural Analysis

Matsushita MN2DS0015 System on a Chip for DVD Players 65 nm CMOS Process Structural Analysis June 12, 2006 Matsushita MN2DS0015 System on a Chip for DVD Players 65 nm CMOS Process Structural Analysis For comments, questions, or more information about this report, or for any additional technical

More information

Goal of APPOLO APPOLO Objectives Establish and coordinate connections between end-users application laboratories equipment manufacturers Facilitate

Goal of APPOLO APPOLO Objectives Establish and coordinate connections between end-users application laboratories equipment manufacturers Facilitate 1 Lasers have been approved as a tool for diverse material processing. New application ideas, come from universities and research institutions, are implemented by spin-offs, but effective and low-cost

More information

AltaSens A5262-4T 4.5 Megapixel CMOS Image Sensor 0.18 µm IBM Process

AltaSens A5262-4T 4.5 Megapixel CMOS Image Sensor 0.18 µm IBM Process AltaSens A5262-4T 4.5 Megapixel CMOS Image Sensor 0.18 µm IBM Process Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning

More information

Overcoming the Challenges of Server Virtualisation

Overcoming the Challenges of Server Virtualisation Overcoming the Challenges of Server Virtualisation Maximise the benefits by optimising power & cooling in the server room Server rooms are unknowingly missing a great portion of their benefit entitlement

More information

CLEAN ROOM TECHNOLOGY

CLEAN ROOM TECHNOLOGY CLEAN ROOM TECHNOLOGY Justin Mathew Applied Electronics and Instrumentation College Of Engineering, Trivandrum April 28, 2015 Justin Mathew (CET) Clean Room Technology April 28, 2015 1 / 18 Overview 1

More information

S P E C I F I C AT I O N S

S P E C I F I C AT I O N S 700SERIES Speedprint platforms are the result of years of meticulous materials, manufacturing and process control excellence. Sitting at the top of our product range, the SP700 Series is engineered to

More information

New Zealand Government IBM Infrastructure as a Service

New Zealand Government IBM Infrastructure as a Service New Zealand Government IBM Infrastructure as a Service A world class agile cloud infrastructure designed to provide quick access to a security-rich, enterprise-class virtual server environment. 2 New Zealand

More information

Optical Topography Measurement of Patterned Wafers

Optical Topography Measurement of Patterned Wafers Optical Topography Measurement of Patterned Wafers Xavier Colonna de Lega and Peter de Groot Zygo Corporation, Laurel Brook Road, Middlefield CT 6455, USA xcolonna@zygo.com Abstract. We model the measurement

More information

Printed and Flexible Devices for Smart Systems On Foils

Printed and Flexible Devices for Smart Systems On Foils Printed and Flexible Devices for Smart Systems On Foils M. Bedjaoui CEA/LITEN 5 OCTOBRE 2012 CEA 10 AVRIL 2012 PAGE 1 Table of content CEA/LITEN Energy storage solutions on foil Electrochromic devices

More information

TDK TECHNOFORUM Welcome!

TDK TECHNOFORUM Welcome! page. 1.2.3.4.5.6.7.8.9.10.11.12.13.14.15.16.17.18.19.20.21.22.23.24. TDK TECHNOFORUM 2000 Welcome! EVERY FIVE YEARS, TDK HOLDS A TECHNOFORUM AT ITS TECHNICAL CENTER IN SUBURBAN TOKYO. THE 2000 EVENT WAS

More information

Mission Statement & Company Overview

Mission Statement & Company Overview STP_SOLUTIONS_Services_Brochure 13/09/2011 14:22 Page 1 SPECIALISTS IN PROVIDING NATIONWIDE WORKSPACE SOLUTIONS OFFICE REFURBISHMENT DATA CENTRES / DISASTER RECOVERY SITES ELECTRICAL & MECHANICAL INSTALLATIONS

More information

Your Microelectronic Package Assembly Solution for MEMS Sensors. SMART Microsystems Ltd.

Your Microelectronic Package Assembly Solution for MEMS Sensors. SMART Microsystems Ltd. Your Microelectronic Package Assembly Solution for MEMS Sensors Why MEMS is Important Growing Industry Segments About SMART Microsystems What We Do How We Do It Working with SMART 2 Why MEMS is Important

More information

displays for extreme conditions

displays for extreme conditions displays for extreme conditions Continuing to make LEGENDS IN DISPLAY #1 in ALD thin film technology Proudly presenting Lumineq, our displays brand, the team behind the development and evolution of the

More information

ARM Holdings plc Morgan Stanley 7 th Annual TMT Conference 14 November Warren East Chief Executive Officer

ARM Holdings plc Morgan Stanley 7 th Annual TMT Conference 14 November Warren East Chief Executive Officer ARM Holdings plc Morgan Stanley 7 th Annual TMT Conference 14 November 2007 Warren East Chief Executive Officer 1 Background Semiconductor Market ARM is a secular growth story with a 25+ year time horizon

More information

IBM WebSphere Message Broker for z/os V6.1 delivers the enterprise service bus built for connectivity and transformation

IBM WebSphere Message Broker for z/os V6.1 delivers the enterprise service bus built for connectivity and transformation IBM Europe Announcement ZP07-0445, dated October 9, 2007 IBM WebSphere Message Broker for z/os V6.1 delivers the enterprise service bus built for connectivity and transformation Description...2 Product

More information

Company Presentation. September 2010

Company Presentation. September 2010 Company Presentation September 2010 2 Safe Harbor Notice E Ink Holdings statement of its current expectations are forward-looking statements subject to significant risks and uncertainties. Actual results

More information

Driving Semiconductor Industry Optimization From. Walden C. Rhines. CHAIRMAN & CEO Mentor Graphics Corporation

Driving Semiconductor Industry Optimization From. Walden C. Rhines. CHAIRMAN & CEO Mentor Graphics Corporation Driving Semiconductor Industry Optimization From U.S.-Taiwan-China Relationships Walden C. Rhines CHAIRMAN & CEO Mentor Graphics Corporation U.S.-Taiwan-China Semiconductor Optimization Growing the total

More information

Gallus RCS 430 A class of its own.

Gallus RCS 430 A class of its own. Success and Security for the Labelprinter. Gallus RCS 430 A class of its own. www.gallus-group.com Member of the Heidelberg Group Maximum versatility for label printing. The Gallus RCS 430 stands out thanks

More information

Early Foundation Learning. Amsterdam, 10 th October 2012

Early Foundation Learning. Amsterdam, 10 th October 2012 Early Foundation Learning Amsterdam, 10 th October 2012 Big Picture SMT Today Pilots Deployments DM: Distribution Mandatory DD: Distribution Discretionary SM: Supplier Mandatory 1M DD 200K SM 15K 3,7K

More information

Repeatable IT Hub Rooms

Repeatable IT Hub Rooms Repeatable IT Hub Rooms Repeatable IT Hub Rooms Catalogue Reducing the cost of NCPI through standardisation Data Centre Solutions Expertly Engineered Reducing the costs of NCPI through standardisation

More information

Stacked Silicon Interconnect Technology (SSIT)

Stacked Silicon Interconnect Technology (SSIT) Stacked Silicon Interconnect Technology (SSIT) Suresh Ramalingam Xilinx Inc. MEPTEC, January 12, 2011 Agenda Background and Motivation Stacked Silicon Interconnect Technology Summary Background and Motivation

More information

The Networked SocIety

The Networked SocIety ITEA2, 2013-12-04 The Networked SocIety Ulf Wahlberg VP Industry and Research Relations, Ericsson AB This is Ericsson We provide: > Communication networks > Services to network operators > Enablers to

More information

FLASH DATA RETENTION

FLASH DATA RETENTION FLASH DATA RETENTION Document #AN0011 Viking Rev. B Purpose of this Document This application note was prepared to help OEM system designers evaluate the performance of Viking solid state drive solutions

More information

Z-RAM Ultra-Dense Memory for 90nm and Below. Hot Chips David E. Fisch, Anant Singh, Greg Popov Innovative Silicon Inc.

Z-RAM Ultra-Dense Memory for 90nm and Below. Hot Chips David E. Fisch, Anant Singh, Greg Popov Innovative Silicon Inc. Z-RAM Ultra-Dense Memory for 90nm and Below Hot Chips 2006 David E. Fisch, Anant Singh, Greg Popov Innovative Silicon Inc. Outline Device Overview Operation Architecture Features Challenges Z-RAM Performance

More information

Corporate Presentation

Corporate Presentation Corporate Presentation Spectra7 Overview High performance analog semiconductor company targeting high value, high growth markets with patented advanced signal processing technology Headquartered in San

More information

Semiconductor Memory Types Microprocessor Design & Organisation HCA2102

Semiconductor Memory Types Microprocessor Design & Organisation HCA2102 Semiconductor Memory Types Microprocessor Design & Organisation HCA2102 Internal & External Memory Semiconductor Memory RAM Misnamed as all semiconductor memory is random access Read/Write Volatile Temporary

More information

Repeatable IT Hub Rooms

Repeatable IT Hub Rooms Repeatable IT Hub Rooms Repeatable IT Hub Rooms Catalogue Reducing the cost of NCPI through standardisation Reducing the costs of NCPI through standardisation The UK Government s plan for growth, published

More information

SPRAYTEC ACCURATE PARTICLE SIZING FOR AEROSOLS AND SPRAYS PARTICLE SIZE

SPRAYTEC ACCURATE PARTICLE SIZING FOR AEROSOLS AND SPRAYS PARTICLE SIZE PARTICLE SIZE SPRAYTEC ACCURATE PARTICLE SIZING FOR AEROSOLS AND SPRAYS INTRODUCING THE MALVERN SPRAYTEC Rapid, reliable particle size measurements made easy. Spray particle and droplet size measurements

More information

10-00 Welcome Paul Morantz Cranfield Dynamically controlling the position and distortion of transparent flexible film (to microns) Reel to

10-00 Welcome Paul Morantz Cranfield Dynamically controlling the position and distortion of transparent flexible film (to microns) Reel to Centre for innovative manufacturing in ultra precision Metrology Technologies to Enable Reel to Reel Processing of Emerging Products 20 th November 2013 National Physical Laboratory The EPSRC Centre for

More information

Sharp NC µm Pixel CCD Image Sensor

Sharp NC µm Pixel CCD Image Sensor Sharp NC9610 1.75 µm Pixel CCD Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology,

More information

SOITEC REPORTS FY 17 THIRD QUARTER REVENUES

SOITEC REPORTS FY 17 THIRD QUARTER REVENUES SOITEC REPORTS FY 17 THIRD QUARTER REVENUES Q3 17 revenues reached 63.1m, up 5% at constant ex rates compared with Q3 16 Continued growth in Communication & Power 200-mm wafer sales 300-mm wafer sales

More information

Research & Innovation

Research & Innovation Research & Innovation Dr. Jai Ganesh Principal Research Scientist Agenda Infosys overview Research @ Infosys Sample case study Evolution over the years Emerging models for R&D collaboration 2010 Infosys

More information

Contractor Alliancing Sean Mooney Programme Manager

Contractor Alliancing Sean Mooney Programme Manager 1 Contractor Alliancing Sean Mooney Programme Manager Today s Agenda Introduction Background Contractor Alliancing The Process Alliance Electricity Alliance North (EAN) Optimise Water (LLP) JV Benefits

More information

Lesson #8 Optical Storage Media. 8. Optical Storage Media - Copyright Denis Hamelin - Ryerson University

Lesson #8 Optical Storage Media. 8. Optical Storage Media - Copyright Denis Hamelin - Ryerson University Lesson #8 Optical Storage Media Optical Storage Media Offers high density storage at low cost. CD DVD BD History of Optical Storage Media 1982: CD (Philips/Sony) 1983: CD-ROM 1986: CD-I (Interactive) carries

More information

I N V E S T O R S P R E S E N T A T I O N

I N V E S T O R S P R E S E N T A T I O N I N V E S T O R S P R E S E N T A T I O N Rafi Amit, CEO Moshe Eisenberg, CFO November 2018 SAFE HARBOR The information presented today contains forward-looking statements that relate to anticipated future

More information

Data Centre Stockholm II, Sweden Flexible, advanced and efficient by design.

Data Centre Stockholm II, Sweden Flexible, advanced and efficient by design. Data Centre Stockholm II, Sweden Flexible, advanced and efficient by design. TelecityGroup Kvastvägen 25-29 128 62 Sköndal Stockholm Sweden Tel: +46 (0) 8 799 3800 se.info@telecity.com www.telecitygroup.se

More information

Enabling Rapid Multitenant Data Centre (MTDC) Connections

Enabling Rapid Multitenant Data Centre (MTDC) Connections Enabling Rapid Multitenant Data Centre (MTDC) Connections At Corning, we understand the challenges associated with outsourced facilities, whether you re an MTDC/ cloud provider or an enterprise client.

More information

Ultra-thin Capacitors for Enabling Miniaturized IoT Applications

Ultra-thin Capacitors for Enabling Miniaturized IoT Applications Ultra-thin Capacitors for Enabling Miniaturized IoT Applications Fraunhofer Demo Day, Oct 8 th, 2015 Konrad Seidel, Fraunhofer IPMS-CNT 10/15/2015 1 CONTENT Why we need thin passive devices? Integration

More information

Functional and Reactive Fluid Deposition Using Xaar Inkjet Simon Kirk Senior Product Manager Stand: A6 514

Functional and Reactive Fluid Deposition Using Xaar Inkjet Simon Kirk Senior Product Manager Stand: A6 514 InPrint 207 presentation - Simon Kirk - Xaar XA-0509-PU 08 Nov 207 Functional and Reactive Fluid Deposition Using Xaar Inkjet Simon Kirk Senior Product Manager Stand: A6 54 InPrint 207 presentation - Simon

More information

I.t Assignment by: Adnan pervez. 28 th of july Registration number: Submitted to: sir abrahim

I.t Assignment by: Adnan pervez. 28 th of july Registration number: Submitted to: sir abrahim I.t Assignment by: Adnan pervez 28 th of july 2012. Registration number: 1511212003 Submitted to: sir abrahim Definition: An optical disk is an electronic data storage medium that can be written to and

More information

OFF-SITE TAPE REPLICATION

OFF-SITE TAPE REPLICATION OFF-SITE TAPE REPLICATION Defining a new paradigm with WANrockIT EXECUTIVE SUMMARY For organisations that need to move large quantities of data onto tape storage and store it off-site, the prospect of

More information

Layout Analysis Embedded Memory

Layout Analysis Embedded Memory Sample Report For any additional technical needs concerning semiconductor and electronics technology, please call Sales at Chipworks. 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: 613.829.0414

More information