Memjet ML Printhead from the RapidX1 Color Label Printer

Transcription

1 ML Printhead from the RapidX1 Color Label Printer MEMS Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel:

2 MEMS Process Review Some of the information in this report may be covered by patents, mask, and/or copyright protection. This report should not be taken as an inducement to infringe on these rights Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. MPR JMRK Revision 1.0 Published: May 26, 2011 Revision 2.0 Published: November 16, 2015

3 MEMS Process Review Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Process Summary 2 Device Overview 2.1 Inkjet Label Printer, Cartridge, and Printhead Die Overview 2.2 Printhead Package Cross-Sectional Analysis 3 Printhead Die Features 3.1 Printhead Die Plan-View Analysis 3.2 Printhead Die Cross-Sectional Analysis 4 Process Analysis 4.1 General Device Structure 4.2 Dielectrics 4.3 Metallization 4.4 Vias and Contacts 4.5 Transistors and Poly 4.6 Isolation 4.7 Wells and Substrate 5 Critical Dimensions 6 References 7 Statement of Measurement Uncertainty and Scope Variation

4 Overview Overview 1.1 List of Figures 2 Device Overview Rapid X1 Color Inkjet Label Printer Front Rapid X1 Color Inkjet Label Printer Back Rapid X1 Color Inkjet Label Printer Side View Rapid X1 Color Inkjet Label Printer Print Engine Top View Cartridge in a Sealed Package Cartridge Sealed Package Identification Label Print Cartridge Tilt View Print Cartridge Top Cartridge Bottom Cartridge Front Cartridge Back Cartridge Side Cartridge Side Identification Markings Identification Markings Identification Markings Identification Markings Cartridge Ink Inlet (Outlet) Tubes Cartridge Ink Inlet (Outlet) Tubes and Channels Printhead Cartridge Top View Printhead Cartridge Bottom View Printhead Right Edge Top View Printhead Left Edge in Detail Top View Printhead Left Edge Top View Printhead Right Edge in Detail Top View Printhead Left Edge in Detail Bottom View Printhead Right Edge in Detail Bottom View Printhead Right Edge X-Ray Plan View Printhead LCP Base Ink Supply Structure Bottom Printhead LCP Base Ink Supply Structure Middle Printhead LCP Base Ink Supply Structure Top Printhead LCP Base Transition Between Ink Supply Structure and Printhead Die Flexible PWB Contact Pad Type A Flexible PWB Contact Pad Type B Flexible PWB Contact Pad Type C Separation Between Flexible PWB Contact Pads Printhead IC Package Cross Section Plan View Package Cross Section Tilt View Printhead Die Attach to LCP Body Detail Ink Supply Path Overview

5 Overview Ink Supply Path at the Left Edge of Printhead Detail Ink Supply Path at the Right Edge of Printhead Detail Ink Supply to Printhead Die through Gaps in Polymer Sealing Film Printhead Die Over Polymer Sealing Film Transition Between Flexible PWB and Polymer Sealing Film in Package Flexible PWB in Package 3 Printhead Die Features Printhead Die Corner Minimum Pitch Bond Pad Optical Plan View Bond Pad SEM Tilt View Printhead IC Nozzle Layout Overview Optical Plan View Printhead IC Nozzle Layout Overview SEM Tilt View Nozzle Array Layout at the Drop Triangle Boundary Printhead IC Joint Near the Top Printhead IC Joint Near the Middle Nozzle Array Unit Cell Overview Active Ink Nozzle Overview Optical Plan View Active Ink Nozzle Overview SEM Tilt View Active Odd and Even Rows of Active Nozzles Overview Pair of Active Nozzle Rows Overview Nozzles Within a Row Optical View Nozzles Within a Row SEM View A Single Nozzle Optical Plan View Nozzle Viewed Along the Heater Line SEM Tilt View Nozzle Viewed Across the Heater Line SEM Tilt View Nozzle Plate Side Wall SEM Tilt View Dummy Nozzle Array Overview Single Dummy Nozzle Single Dummy Ink Nozzles Near Drop Triangle Boundary SEM Tilt View Ink Channel Trenches On the Back of the Die Ink Channel Trench Detail Ink Hole Array Within Ink Trench Ink Hole Top Location in the Nozzle Chamber Single Ink Hole Top Detail Single Ink Hole Bottom Single Ink Hole Sidewall SEM Tilt View Analysis Sites Printhead Die Overview (Parallel to the Ink Channel Width) Die Edge (Parallel to the Ink Channel Width) Ink Channels Optical View (Parallel to the Ink Channel Widths) Ink Channels SEM View (Parallel to the Ink Channel Widths) Ink Channel Top and Ink Channel Hole Optical View (Parallel to the Ink Channel Widths)

6 Overview Ink Hole SEM View (Parallel to the Ink Channel Widths) Ink Nozzle and Heater Resistor Overview (Parallel to the Ink Channel and Nozzle Widths) Ink Nozzle and Heater Resistor Detail (Parallel to the Ink Channel and Nozzle Widths) Ink Baffle (Parallel to the Ink Channel and Nozzle Widths) Ink Nozzle and Heater Resistor (Parallel to the Ink Channel and Nozzle Lengths) Heater Resistor SEM (Parallel to the Nozzle Length) Heater Resistor Detail SEM (Parallel to the Nozzle Length) Heater Resistor Detail TEM View TEM-EDS of TiAlN Heater Resistor (Ti 35 Al 35 N 30 ) TEM-EDS of TiAl Heater Resistor Seed Layer (Ti 50 Al 50 ) 4 Process Analysis General Structure (Parallel to the Printhead Width) Right Die Edge (Parallel to the Printhead Width) Left Die Edge (Parallel to the Printhead Width) Die Edge Detail (Parallel to the Printhead Width) Die Seal (Parallel to the Printhead Width) Ink Hole Seal (Parallel to the Printhead Width) Joint Between Nozzle Segments and Die Seal (Parallel to the Printhead Length) Al Wire Stitch Bond Overview Al Wire Stitch Bond Detail Right Bond Pad Edge Right Bond Pad Edge Detail Printhead Nozzle Array Dielectric Overview Printhead Die Seal and Nozzle Chamber Top Layers Detail Heater Passivation CMOS Circuitry Passivation IMD 3 and IMD IMD PMD Heater Resistor Layer Metal 4 Thickness Minimum Pitch Metal Minimum Pitch Metal Minimum Pitch Metal Metal 1 Barrier and Adhesion Layer TEM Minimum Pitch Via 3s Slot Via Minimum Pitch Via 2s Minimum Pitch Via 1s Minimum Pitch Contacts Contact Bottom TEM

7 Overview Transistor Gate SEM Transistor Gate TEM Poly Gate Edge TEM Image Gate Oxide TEM Image Minimum Contacted Gate Pitch Minimum Gate Length PMOS Transistor Minimum Gate Length NMOS Transistor Heater Resistor Drive Transistors (Gate Length) Heater Resistor Drive Transistors (Gate Length Detail) Heater Resistor Drive Transistors (Gate Width) Heater Resistor Drive Transistors Gate Contacts Minimum Width LOCOS Poly over LOCOS Well Structure Beneath Nozzle Si Etch (Perpendicular to Ink Channel Length) N-Well Detail Si Etch (Perpendicular to Ink Channel Length) Well Structure Beneath Nozzle SCM (Parallel to Ink Channel Length) N-Well Detail SCM

8 Overview List of Tables 1 Overview Device Identification Device Summary Die Process Summary 2 Device Overview Package and Die Dimensions 3 Printhead Die Features Printhead Die Horizontal Dimensions Printhead Die Parameters Nozzle Chamber and Ink Hole Vertical Dimensions 4 Process Analysis Dielectric Thicknesses Metallization Vertical Dimensions Minimum Metallization Horizontal Dimensions Via and Contact Dimensions Transistor and Poly Dimensions Isolation Critical Dimensions 5 Critical Dimensions Package and Die Dimensions Bond Pad Dimensions Nozzle, Ink Channel, and Ink Hole Horizontal Dimensions Printhead Die Heater Resistors Horizontal Dimensions Nozzle Chamber and Ink Hole Vertical Dimensions Dielectric Thicknesses Metallization Vertical Dimensions Minimum Metallization Horizontal Dimensions Via and Contact Dimensions Transistor and Poly Horizontal Dimensions Transistor and Poly Vertical Dimensions Isolation Critical Dimensions

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