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1 More Course Information Labs and lectures are both important Labs: cover more on hands-on design/tool/flow issues Lectures: important in terms of basic concepts and fundamentals Do well in labs Do well in exams Like all ways: you do NOT see the same HW problems in the exams! Other information: read syllabus and visit course website ECEN 454
2 ECEN 454 Digital Integrated Circuit Design Lecture 1 Introduction (Materials excerpted from the Kang and Leblebici s companion slides) Peng Li ECEN 454
3 Some History Invention of the transistor (BJT) 1947 Shockley, Bardeen, Brattain Bell Labs Single-transistor integrated circuit 1958 Jack Kilby Texas Instruments Invention of CMOS logic gates 1963 Wanlass & Sah Fairchild Semiconductor First microprocessor (Intel 4004) ,300 MOS transistors, 740 khz clock frequency Very Large Scale Integration 1978 Chips with more than ~20,000 devices 2 CMOS Digital Integrated Circuits 3 rd Edition
4 More Recently Ultra Large Scale Integration System on Chip (SoC) 20 ~ 30 million transistors in 2002 The chip complexity has increased by a factor of 1000 since its first introduction, but the term VLSI remained virtually universal to denote digital integrated systems with high complexity. 3 CMOS Digital Integrated Circuits 3 rd Edition
5 Economic Impact As a result of the continuously increasing integration density and decreasing unit costs, the semiconductor industry has been one of the fastest growing sectors in the worldwide economy. 4 CMOS Digital Integrated Circuits 3 rd Edition
6 Industry Trends Large Centralized Expensive Small / Portable Distributed Inexpensive 5 CMOS Digital Integrated Circuits 3 rd Edition
7 Industry Trends High performance Low power dissipation Wireless capability etc More portable, wearable, and more powerful devices for ubiquitous and pervasive computing 6 CMOS Digital Integrated Circuits 3 rd Edition
8 Some Leading-Edge Examples 7 CMOS Digital Integrated Circuits 3 rd Edition
9 Some Leading-Edge Examples IBM S/390 Microprocessor 0.13 µm CMOS process 7 layers Cu interconnect 47 million transistors 1 GHz clock 180 mm 2 8 CMOS Digital Integrated Circuits 3 rd Edition
10 Evolution of Minimum Feature Size 9 CMOS Digital Integrated Circuits 3 rd Edition
11 Evolution of Minimum Feature Size 2002: 130 nm 2003: 90 nm 2010: 35 nm (?) 10 CMOS Digital Integrated Circuits 3 rd Edition
12 Moore s Law 11 CMOS Digital Integrated Circuits 3 rd Edition
13 Evolution of Memory Capacity 12 CMOS Digital Integrated Circuits 3 rd Edition
14 ITRS - International Technology Roadmap for Semiconductors YEAR TECHNOLOGY 130 nm 100 nm 70 nm 50 nm 35 nm CHIP SIZE 400 mm mm mm mm mm 2 NUMBER OF TRANSISTORS (LOGIC) DRAM CAPACITY MAXIMUM CLOCK FREQUENCY MINIMUM SUPPLY VOLTAGE MAXIMUM POWER DISSIPATION MAXIMUM NUMBER OF I/O PINS 400 M 1 Billion 3 Billion 6 Billion 16 Billion 2 Gbits 10 Gbits 25 Gbits 70 Gbits 200 Gbits 1.6 GHz 2.0 GHz 2.5 GHz 3.0 GHz 3.5 GHz 1.5 V 1.2 V 0.9 V 0.6 V 0.6 V 130 W 160 W 170 W 175 W 180 W Predictions of the worldwide semiconductor / IC industry about its own future prospects CMOS Digital Integrated Circuits 3 rd Edition
15 Shrinking Device Dimensions YEAR TECHNOLOGY 130 nm 100 nm 70 nm 50 nm 35 nm CHIP SIZE 400 mm mm mm mm mm 2 NUMBER OF TRANSISTORS (LOGIC) DRAM CAPACITY MAXIMUM CLOCK FREQUENCY MINIMUM SUPPLY VOLTAGE MAXIMUM POWER DISSIPATION MAXIMUM NUMBER OF I/O PINS 400 M 1 Billion 3 Billion 6 Billion 16 Billion 2 Gbits 10 Gbits 25 Gbits 70 Gbits 200 Gbits 1.6 GHz 2.0 GHz 2.5 GHz 3.0 GHz 3.5 GHz 1.5 V 1.2 V 0.9 V 0.6 V 0.6 V 130 W 160 W 170 W 175 W 180 W CMOS Digital Integrated Circuits 3 rd Edition
16 Increasing Function Density YEAR TECHNOLOGY 130 nm 100 nm 70 nm 50 nm 35 nm CHIP SIZE 400 mm mm mm mm mm 2 NUMBER OF TRANSISTORS (LOGIC) 400 M 1 Billion 3 Billion 6 Billion 16 Billion DRAM CAPACITY 2 Gbits 10 Gbits 25 Gbits 70 Gbits 200 Gbits MAXIMUM CLOCK FREQUENCY MINIMUM SUPPLY VOLTAGE MAXIMUM POWER DISSIPATION MAXIMUM NUMBER OF I/O PINS 1.6 GHz 2.0 GHz 2.5 GHz 3.0 GHz 3.5 GHz 1.5 V 1.2 V 0.9 V 0.6 V 0.6 V 130 W 160 W 170 W 175 W 180 W CMOS Digital Integrated Circuits 3 rd Edition
17 Increasing Clock Frequency YEAR TECHNOLOGY 130 nm 100 nm 70 nm 50 nm 35 nm CHIP SIZE 400 mm mm mm mm mm 2 NUMBER OF TRANSISTORS (LOGIC) DRAM CAPACITY MAXIMUM CLOCK FREQUENCY MINIMUM SUPPLY VOLTAGE MAXIMUM POWER DISSIPATION MAXIMUM NUMBER OF I/O PINS 400 M 1 Billion 3 Billion 6 Billion 16 Billion 2 Gbits 10 Gbits 25 Gbits 70 Gbits 200 Gbits 1.6 GHz 2.0 GHz 2.5 GHz 3.0 GHz 3.5 GHz 1.5 V 1.2 V 0.9 V 0.6 V 0.6 V 130 W 160 W 170 W 175 W 180 W CMOS Digital Integrated Circuits 3 rd Edition
18 Decreasing Supply Voltage YEAR TECHNOLOGY 130 nm 100 nm 70 nm 50 nm 35 nm CHIP SIZE 400 mm mm mm mm mm 2 NUMBER OF TRANSISTORS (LOGIC) DRAM CAPACITY MAXIMUM CLOCK FREQUENCY MINIMUM SUPPLY VOLTAGE MAXIMUM POWER DISSIPATION MAXIMUM NUMBER OF I/O PINS 400 M 1 Billion 3 Billion 6 Billion 16 Billion 2 Gbits 10 Gbits 25 Gbits 70 Gbits 200 Gbits 1.6 GHz 2.0 GHz 2.5 GHz 3.0 GHz 3.5 GHz 1.5 V 1.2 V 0.9 V 0.6 V 0.6 V 130 W 160 W 170 W 175 W 180 W CMOS Digital Integrated Circuits 3 rd Edition
19 18 CMOS Digital Integrated Circuits 3 rd Edition
20 19 CMOS Digital Integrated Circuits 3 rd Edition
21 5-layer cross-section of chip 20 CMOS Digital Integrated Circuits 3 rd Edition
22 21 CMOS Digital Integrated Circuits 3 rd Edition
23 System-on-Chip Integrating all or most of the components of a hybrid system on a single substrate (silicon or MCM), rather than building a conventional printed circuit board. 1. More compact system realization 2. Higher speed / performance Better reliability Less expensive! 22 CMOS Digital Integrated Circuits 3 rd Edition
24 23 CMOS Digital Integrated Circuits 3 rd Edition
25 New Direction: System-on-Chip (SoC) ASIC Core Memory Analog Functions Sensor Interface Communication Embedded Processor Core 24 CMOS Digital Integrated Circuits 3 rd Edition
26 25 CMOS Digital Integrated Circuits 3 rd Edition
27 Products have a shorter life-cycle! 26 CMOS Digital Integrated Circuits 3 rd Edition
28 27 CMOS Digital Integrated Circuits 3 rd Edition
29 Better strategy 28 CMOS Digital Integrated Circuits 3 rd Edition
30 The Y-Chart Notice: There is a need for structured design methodologies to handle the high level of complexity! 29 CMOS Digital Integrated Circuits 3 rd Edition
31 Simplified VLSI Design Flow Top-down Bottom-up 30 CMOS Digital Integrated Circuits 3 rd Edition
32 Structured Design Principles Hierarchy: Regularity: Modularity: Locality: Divide and conquer technique involves dividing a module into submodules and then repeating this operation on the sub-modules until the complexity of the smaller parts becomes manageable. The hierarchical decomposition of a large system should result in not only simple, but also similar blocks, as much as possible. Regularity usually reduces the number of different modules that need to be designed and verified, at all levels of abstraction. The various functional blocks which make up the larger system must have well-defined functions and interfaces. Internal details remain at the local level. The concept of locality also ensures that connections are mostly between neighboring modules, avoiding long-distance connections as much as possible. 31 CMOS Digital Integrated Circuits 3 rd Edition
33 Hierarchy of a 4-bit Carry Ripple Adder 32 CMOS Digital Integrated Circuits 3 rd Edition
34 Hierarchy of a 16-bit Manchester Adder 33 CMOS Digital Integrated Circuits 3 rd Edition
35 Hierarchy of a 16-bit Manchester Adder 34 CMOS Digital Integrated Circuits 3 rd Edition
36 Hierarchy of a 16-bit Manchester Adder 35 CMOS Digital Integrated Circuits 3 rd Edition
37 Hierarchy of a 16-bit Manchester Adder 36 CMOS Digital Integrated Circuits 3 rd Edition
38 Regularity 2-input MUX DFF 37 CMOS Digital Integrated Circuits 3 rd Edition
39 VLSI Design Styles FPGA 38 CMOS Digital Integrated Circuits 3 rd Edition
40 Full Custom Design Following the partitioning, the transistor level design of the building block is generated and simulated. The example shows a 1-bit full-adder schematic and its SPICE simulation results. 39 CMOS Digital Integrated Circuits 3 rd Edition
41 Full Custom Design The main objective of full custom design is to ensure fine-grained regularity and modularity. 40 CMOS Digital Integrated Circuits 3 rd Edition
42 Full Custom Design A carefully crafted full custom block can be placed both along the X and Y axis to form an interconnected two-dimensional array. Example: Data-path cells 41 CMOS Digital Integrated Circuits 3 rd Edition
43 Full Custom SRAM Cell Design 42 CMOS Digital Integrated Circuits 3 rd Edition
44 Mapping the Design into Layout Manual full-custom design can be very challenging and time consuming, especially if the low level regularity is not well defined! 43 CMOS Digital Integrated Circuits 3 rd Edition
45 VLSI Design Styles FPGA 44 CMOS Digital Integrated Circuits 3 rd Edition
46 HDL-Based Design 1980 s Hardware Description Languages (HDL) were conceived to facilitate the information exchange between design groups s The increasing computation power led to the introduction of logic synthesizers that can translate the description in HDL into a synthesized gate-level net-list of the design s Modern synthesis algorithms can optimize a digital design and explore different alternatives to identify the design that best meets the requirements. 45 CMOS Digital Integrated Circuits 3 rd Edition
47 HDL-Based Design The design is synthesized and mapped into the target technology. The logic gates have one-to-one equivalents as standard cells in the target technology. 46 CMOS Digital Integrated Circuits 3 rd Edition
48 Standard Cells AND DFF INV XOR 47 CMOS Digital Integrated Circuits 3 rd Edition
49 Standard Cells 48 CMOS Digital Integrated Circuits 3 rd Edition
50 Standard Cells 49 CMOS Digital Integrated Circuits 3 rd Edition
51 Standard Cells Rows of standard cells with routing channels between them Memory array 50 CMOS Digital Integrated Circuits 3 rd Edition
52 Standard Cells 51 CMOS Digital Integrated Circuits 3 rd Edition
53 VLSI Design Styles FPGA 52 CMOS Digital Integrated Circuits 3 rd Edition
54 Mask Gate Array 53 CMOS Digital Integrated Circuits 3 rd Edition
55 Mask Gate Array Before customization 54 CMOS Digital Integrated Circuits 3 rd Edition
56 VLSI Design Styles FPGA 55 CMOS Digital Integrated Circuits 3 rd Edition
57 Field Programmable Gate Array 56 CMOS Digital Integrated Circuits 3 rd Edition
58 Field Programmable Gate Array Internal structure of a CLB 57 CMOS Digital Integrated Circuits 3 rd Edition
59 Field Programmable Gate Array 58 CMOS Digital Integrated Circuits 3 rd Edition
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