HPC/Advanced Cooling Track. Rolf Brink/CEO/Asperitas
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2 HPC/Advanced Cooling Track Advanced Cooling Optimising for immersion Rolf Brink/CEO/Asperitas
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4 IMMERSED COMPUTING : AIC24 100% Removal of heat from the IT Tier 3-4 focus - fully redundant 22/36 kw or kw/m 2 (free cooling/chiller) No airflow, Passive liquid circulation Intelligence system (demo at booth) Management control and insight Automatic hydraulic optimisation Optimised for high density cloud/hpc nodes Varying servers Flexible IT hardware Feed: C, up to 55 C / ΔT 2-16 C
5 PLUG AND PLAY RAPID DEPLOYMENT 1 hour deployment Integrated power Integrated rack-level switchgear Single/Dual feed Integrated PDU s with fully managed & switchable outlets EMC compliant Direct connect to facility water circuit (no CDU s) Integrated management/monitoring DCIM integration Autonomous safety systems No liquid cost
6 ENCLOSED IMMERSION TECHNOLOGY Self Sustained by Convection drives Driven by gravity Self regulating Reliable No moving parts No oxygen High heat capacity Reduced thermal shock Efficient IT energy reduction No chiller requirements No circulation pumps Specialised servers Optimised for liquid Liquid certified Brand agnostic
7 ASPERITAS INTELLIGENCE OVERVIEW AIC24 INTEGRATED SAFETY SENSORS CONTROL FAILSAFE Cloud/HPC POWER Input total per outlet On Off On/off WATER Temperature in/out Flow & Pressure Electric Valves Open/close OIL Temperature Level
8 SERVER MANAGEMENT INTEGRATION Server mainboards Built-in Temperature sensors Mapped X/Y coordinates Temperature map template Data extraction with IPMI Y Management integration Cassette location awareness Z-coordinate 3D location of sensors X
9 REAL-TIME 3D THERMAL ANALYSIS sensors Integrated temperature IT temperature readings Temperature logging Trend analysis Fault analysis Optimisation water circuit Real-time IT health Water input control
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11 ACS- IMMERSION OCP ENGAGEMENT AIR VS LIQUID DESIGN ASPECTS THERMAL DESIGN GUIDELINES MATERIAL COMPATIBILITY CHIP DESIGN ASPECTS ASPERITAS CERTIFICATION
12 AIR VS LIQUID DESIGN Air based Open Cloud servers 1 kw/u Liquid optimised servers (passive) Upto 1,5 kw/u
13 AIR DESIGN VS LIQUID DESIGN Chassis design for stability, strength and closed structure Design for forced airflow High flowrate, large pressure drop Preventing thermal shadow Thermal shock managed by fans Reliance on continuous cooling Temp sensors for component health Chassis design for low resistance and open structure Design for natural flow (most effective for any circulation) Low flowrate, minimal pressure drop (high flow may damage components) Using thermal shadow Thermal shock dampened by liquid Design for thermal buffer Temp sensors for thermal environment
14 CASSETTE CONSIDERATIONS Vertical orientation!!! Fixation in rack (prevent movement/floatation) Gravity Serviceability, dry interfaces Extraction Chassis dimensions 19 sub-optimal (fluid dynamics/density combo) Narrow(er) form factor for dual-board Unobstructed liquid flow Sideways outflow on surface Cooled liquid distribution/levelling on bottom
15 THERMAL DESIGN GUIDELINES Cooling input at bottom (coolest liquid) Cooling output on top (hottest liquid) Component placement considerations 1. Thermal tolerance 2. Thermal load (rate of heating) 3. Thermal buffering 4. Fluid dynamics
16 IMMERSION READY ACTIVE OPTICAL CABLES Inspired by ASPERITAS - developed by LEONI LEONI group, employees in 31 countries Development partnership with ASPERITAS for Immersed Computing cables Together we develop immersion ready Active Optical Cables QSFP+/28 interface for 40G and 100G transmission Long-term oil/immersion resistant cable and components Hermetical protection of the optics Mechanical prototype for display at the ASPERITAS booth Functional samples by November 2018
17 CHIP DESIGN FOR LIQUID Heatsink Current chip designs 2-dimensional problem approach Chip packaging poor thermal properties Electrical insulation= thermal insulation Chip insulation TIM (ceramic) T case, +/- 80 C Chip Chip Liquid optimisation Could dielectric liquid insulate internal electric circuits? Cooling rear-side of chips? Cooling interior of chips directly? 3D open chip design? Chip interior C Result: Higher (valuable!) temperatures accessible => Reusable heat
18 ASPERITAS CERTIFICATION Asperitas is NOT manufacturer/(re)seller Focused on oil immersion (limited chemical) Asperitas OPEN certification process Focus on material compatibility R&D Driven by CFD analysis Aimed at long term risk assessment Potentially destructive 3 certification levels Level 1, feasibility Level 2, prototyping & benchmark test Level 3, 10-week duration and operation test Level 4, 24 systems production for 3 months
19 JOIN THE IMMERSION ACS TRACK Send to wer/advanced_cooling_solutions Looking for manufacturers and (future) end-users
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+31 88 96 000 00 www.asperitas.com ASPERITAS COMPANY Privately owned and funded Rolf Brink/Markus Mandemaker History Aecorsis BV founded in 2014 Modernising the marine industry Micro datacentre for marine
Rolf Brink Founder/CEO
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