CSP: HIGH PERFORMANCE RELIABLE COMPUTING FOR SMALLSATS
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1 CSP: HIGH PERFORMANCE RELIABLE COMPUTING FOR SMALLSATS Katherine Conway, Bert Vermeire, Jordan Healea, David Strobel Space Micro Inc. CubeSat Developers Workshop 2017 Cal Poly San Luis Obispo April 26-28, 2017 CubeSat Developers' Workshop
2 Hybrid Product Design Philosophy Combines industrial and space grade parts Superior performance and reliability are achieved while staying within typical CubeSat program cost constraints Radiation tolerant devices monitor and manage COTS devices Fault tolerant computing (Hardware, software, information, networking, and time redundancy) Customized parts selection is applied to achieve configurations for different reliability requirements and radiation environments (up to 100 krad) CSP Radiation Testing CubeSat Developers' Workshop
3 CubeSat Space Processor Overview CubeSat Space Processor (CSP) single board computer Hybrid Product Design Strategy Designed to meet space environments Vibe, Shock, Conduction cooled Parts selected for TID resilience Embedded soft error mitigation Powered by Xilinx Zynq-7020 Dual ARM cores 7-series FPGA fabric DDR3 SDRAM Flash Memory Extensive Software Options Modularity Heritage Currently flying on ISS Selected for five Space Missions CubeSat Developers' Workshop
4 CSP Key Attributes Processor FPGA Programmable Logic Total IO Operating Systems Supported Interfaces Memory Connector Power Consumption Xilinx Zynq DMIPS/MHz per CPU CPU frequency: Up to 667 MHz (-1) Up to 866 MHz (-3) 33 MHz or 100 MHz Clock 24 differential pairs, 12 single ended Kb Block RAM (4.9 Mb) Programmable I/O Blocks Supports LVCMOS, LVDS, and SSTL, with 1.2~3.3 V I/O 12 bit ADCs up to One Million Samples per Second 24 LVDS and 38 Single-ended Wumbo GNU/Linux, RTEMS, VxWorks, ThreadX 8 Channels DMA SpaceWire 10/100 Ethernet USB 2.0 OTG CAN 2.0B (1 Mb/s) SPI (3 chip selects) JTAG 8 Gbit NAND Flash (EM) RadTolerant 32 Gbit NAND Flash (FM) Two 1 Gbit DDR3 SDRAM I2C (external 3.3 V pull-ups required) UART (Max baudrate of bps) Hardware & Software Watchdog timer Camera Link Samtec SEAF-RA-RA 4 x40 Designed to be Connected to a Samtec SEAM 4 x 40 Backplane Watts CSP Temperature Rating CSP-EM: 70 CSP-FM: -40 to +85 Thermal Mechanical Size Mass Conduction cooled Designed in a 1U CubeSat form factor (8.8 cm x 8.9 cm) Thickness: 1.65 cm (tallest component) 60 grams CubeSat Developers' Workshop
5 CSP Development Kit Solution for Interface and Software Testing Development Kit Contents: CSP Engineering Model CSP Evaluation Board JTAG programming support 10/100 Ethernet MIO and EMIO breakout 3 SpaceWire breakouts Cameralink breakout USB to UART Board USB to UART Converter (1.8, 2.5, 3.3V logic supported) Software Access to CSP software and firmware repository CubeSat Developers' Workshop
6 CSP Software Operating Systems Wumbo GNU/Linux, RTEMS, VxWorks, ThreadX Interfaces 8 Channels DMA SpaceWire 10/100 Ethernet USB 2.0 OTG CAN 2.0B (1 Mb/s) SPI (3 chip selects) JTAG I2C (external 3.3V pull-ups required) UART (Max baudrate of bps) Hardware & Software Watchdog timer Camera Link Applications Multiple open source and third party IP Core Flight Executive/Core Flight System CubeSat Developers' Workshop
7 Modularity and Expansion Backplane Dense, high-speed 160-pin backplane connector 24 LVDS and 38 Single-ended IO Examples Multiple CSPs (e.g. Super-CSP) Modem Board CubeSat Developers' Workshop
8 digital backplane Cntr/Status I/O SDR Modem Expansion Card Radiation tolerant Software Defined Modem in 1U form factor Supports IF frequencies up to 150 MHz Occupied bandwidth up to 25 MHz Typical configuration is 5-10 MHz occupied bandwidth at 70 MHz IF Transmit data, Receive data, control & status (to SBC) Reconfigurable MicroSemi FPGA ADC DAC SMA SMA Receive IF Transmit IF Digital control, analog status, analog control (to RF module) ADC DAC SMA Synthesizer Reference CubeSat Developers' Workshop
9 Industry Standard Design Practices Configuration Management Design Analyses Structural, Mechanical & Thermal analysis Reliability, Part Stress & Worst Case analysis Radiation (destructive events, TID, SEE, SEU, SEFI) Standard space products typically targeted to 30 or 100 krads(si) Use many parts databases Routinely conduct radiation testing Shielding can be provided for extra TID margin Parts, Materials and Processes Traceability with MRP and travelers Counterfeit (CF) parts avoidance No pure tin Capable of working to NASA Level 1/Class S or TOR (Level 2 & Commercial Space are most common) In-house parts screening capability Regular participation in various industry groups (SPWG) CubeSat Developers' Workshop
10 Industry Standard Manufacturing Practices Parts Procurement Strong relationship with manufacturers and distributers of parts Purchase from authorized distributers or OEM s Quality clauses Ability to purchase larger quantities of long lead parts Manufacturing and Test Sub-tier Management Acceptance Testing Documentation End Item Data Package (EIDP) Certificate of Conformance CubeSat Developers' Workshop
11 Mission Assurance We are an ISO 9001 registered house since 2008 Undergone two re-certification audits Last was October 2014 Quality Policy Space Micro Inc. is committed to customer satisfaction by producing defect-free products that conform to customer requirements and expectations, through systematic and controlled operations, on-time deliveries, and a culture of continuous process improvement. Quality Manual Standard Operating Procedures address Space Micro processes Workmanship Standards CubeSat Developers' Workshop
12 Quality & Supply Chain Management Purchased Parts and Materials MAM reviews Purchase Requests & Inserts Appropriate Quality Clauses Quality clauses also adapted from customer flow downs Applicable command media (SCDs, MI s, Drawings) accompanies Purchase Order Purchased Items are verified at Source and/or Receiving Inspection Contracted Supplier Processes MAM reviews Purchase Requests & Inserts Appropriate Quality Clauses Applicable command media (SCDs, MI s, Drawings) accompanies Purchase Order Source Inspection: PCB Assembly House: Placement, orientation, workmanship Conformal Coat/Staking House: Workmanship Internal Processes Applicable command media (Travelers, BOM s, MI s, Drawings) accompany kitted/built up assemblies In-Process inspection verifies command media and workmanship Space Micro Standard Operating Procedures (SOPs) apply Non-Conformance Management CubeSat Developers' Workshop
13 Quality Assurance Participation Perform Inspections to Ensure Compliance to Workmanship Requirements IPC-A-610 Acceptability of Electronic Assemblies J-STD-001 Requirements of Soldered Electrical and Electronic Assemblies J-STD-001 Space Addendum NASA-STD-8739 workmanship standards Ensure Facilities Compliance Equipment Calibration Facilities Cleanliness ESD Safeguards Audit Manufacturing Documentation Proper Revisions, Approvals, Sign-offs, Stamps Operations Completed Correctly and Signed-Off Oversight/Review Contract Manufacturing Workmanship and Documentation End-Item Data Package (e.g. Test Data, Travelers, Photos/X-Rays, etc.) Provide Certificate of Conformance CubeSat Developers' Workshop
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