CMOS Microcamera for Space Applications 3D PLUS
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1 CMOS Microcamera for Space Applications 3D PLUS Charles SELLIER, Didier GAMBART October 2016, 20 th ICSO 2016, Biarritz / France All Rights Reserved 3D PLUS 2015 MNT
2 Agenda 3D PLUS company Micro Camera Context & Overview FPGA Sensor Detailed Architecture Current limiters Power supplies 3D design Characterization Conclusion All Rights Reserved 3D PLUS 2016 MNT
3 3D PLUS company profile / Organization French Company founded in 1995, privately owned (HEICO) Locations : Headquarters BUC, France People : 170 employees / Turn Over = 35 M Tech. Center US Fremont, CA, USA ISO-9001 certified Design of Space Radiation Hardened electronics ESA and CNES qualified manufacturing line for Space Applications Largest Space Qualified MCM Manufacturer located in Europe ITAR free products supported by a sales and customer support network for a worldwide delivery guarantee Flight proven with more than modules in space beginning of 2016 All Rights Reserved 3D PLUS 2016 MNT
4 Agenda 3D PLUS company Micro Camera Context & Overview FPGA Sensor Detailed Architecture Current limiters Power supplies 3D design Characterization Conclusion All Rights Reserved 3D PLUS 2016 MNT
5 Context Wide range of scientific applications Planetology Star tracker Platform Monitoring Launcher Monitoring All Rights Reserved 3D PLUS 2016 MNT
6 Overview Micro Camera features: 4M Pixel sensor 12 diff. links for data Spacewire Ethernet Other 13 single ended I/Os JTAG for FPGA programming Only one power supply Active Pixel Area Storage FPGA 12*2 13 LVCMOS33 JTAG LVDS LVCMOS25 Power & Protections VDD 4,5V à 9V All Rights Reserved 3D PLUS 2016 MNT
7 FPGA Manufacturer à Microsemi Reference à ProASIC 3 Size à 3 Millions gates Package à PQ-208 Power à 400mW All Rights Reserved 3D PLUS 2016 MNT
8 Sensor Manufacturer à CMOSIS Reference à CMV4000 Resolution à 4 Millions pixels Package à µpga95 Pixel Size à 5µm Optical dimension à 1 Dark Noise à 13 e - Power (typical) à 600mW All Rights Reserved 3D PLUS 2016 MNT
9 Sensor architecture Matrix 2048 X 2048 SPI link Used for configuration Output interface 2 to 16 LVDS pairs up to 480 Mbps each Clock Internal PLL Temperature Internal sensor All Rights Reserved 3D PLUS 2016 MNT
10 Detailed Architecture Micro Camera Architecture: 1 FPGA 4 Mega Pixel Sensor 2 x 512Mb SDRAM 8 Gb NAND FLASH 4 Power supplies 2 current limiters POL RESET POL 2V1 PWRESET LCL 0,5A SENSOR 325mA 2V1 LCL 0,4A 2V1 SENSOR 240mA POL 2V5 2V5 2V5 OCD_ PWR_SENSOR OCD_2V0 FPGA PRO ASIC3 LVDS 22 CLK OUT Registrer 6 4 SPI interface VDD20 VDDPIX VDD33 Vres_h CAPTEUR CMOS4000 POL 1V5 1V5 1V5 2 2 GND Oscillator 64 MHz DATA(15:0) 2 x SDRAM 512 Mb DATA(7:0) FLASH NAND 8Go GND 6 GND VREF REF_ADC SG_ADC VRAMP1 VRAMP2 CMD_P_INV Vpch_h Vtf_l2 Col_load CMD_P CMD_N Alimentations Connecteur PGA JTAG Space Wire LVDS OUT RST GPIO OUT SPI OUT Regsiter Out 5V à 8V All Rights Reserved 3D PLUS 2016 MNT
11 LCL CMV4000 is sensitive to SEU/SET/SEL Current sensor on each CMV4000 power supply Switch on each CMV4000 power supply Switch command sent by the FPGA High impedance mode on LVDS link High impedance mode on all CMV4000 I/Os Switch off of the two power supplies VIN Current Comparator SWITCH V SENSOR Switch Cde PWR SENS REF OCD OCD2V5 To FPGA LCL All Rights Reserved 3D PLUS 2015 MNT
12 Power supplies 4 independent power supplies Integrated Input Filter & Output Filter Switching frequency at 340kHz Protection Current control mode Internal UVD 4,5 à 9V VIN D/C Converter 1V5 D/C Converter 2V5 D/C Converter D/C Converter 2V1 Oscillator LCL LCL 2V1 1V5 FPGA 2V5 NV Memory Volatile Memory VDDPIX VDD33 Vres_h CMV4000 VDD20 All Rights Reserved 3D PLUS 2015 MNT
13 Bread board Design a 2D Bread Board All components on the board Optical adaptation FPGA test code development All Rights Reserved 3D PLUS 2016 MNT
14 Characterization On 2D module: Sensor measurement SpaceWire validation Memory buffer validation Power supplies characterization On 3D module: Input current measurement LCL characterization Product qualification on-going for MARS2020 mission (NASA) All Rights Reserved 3D PLUS 2015 MNT
15 Input Voltage range from 4.5V to 9V Power = 2W typical 4M pixels sensor CHARLI4M main characteristics PGA 55 (Matrix 8 x 7) Weight = 64 g TID > 40kRad SET Immune > 60 MeV.cm²/mg Dimensions = 35mm x 35mm x 25mm Temperature range -40 C / +70 C All Rights Reserved 3D PLUS 2015 MNT
16 Conclusion Very high density Camera for Space application High reliability for space environment High precision sensor positioning Mechanical support for lens Only one power supply Demonstration on 3D PLUS stand ITAR FREE All Rights Reserved 3D PLUS 2015 MNT
17 Thanks for your attention! Today s Technology for Tomorrow s Electronics I 3D PLUS I 408 rue Helene Boucher I Buc, FRANCE I (+33) I 3D PLUS USA Inc. Tech Center I Christy Street I Fremont, CA, I (510) I 3D PLUS USA Inc. Sales Center I 6401 W Eldorado Parkway, suite #238 I McKinney, TX, I (214) All Rights Reserved 3D PLUS 2015 MNT
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