Space Parts Working Group Cobham Semiconductor Solutions (formerly Aeroflex Microelectronic Solutions)

Transcription

1 The most important thing we build is trust ADVANCED ELECTRONIC SOLUTIONS AVIATION SERVICES COMMUNICATIONS AND CONNECTIVITY MISSION SYSTEMS Space Parts Working Group Cobham Semiconductor Solutions (formerly Aeroflex Microelectronic Solutions) Presenter Anton Quiroz

2 Agenda Cobham Overview Rad & EMS Services Standard Products Update ASIC/ASSP Update Power Distribution Modules 1

3 Cobham Sectors Serving Diverse & Dynamic Markets Advanced Electronic Solutions Offering critical solutions for communication on land, sea, air and space, by moving data through off-the-shelf and customized products including: radio frequency, microwave, high-rel microelectronics, antenna subsystems and motion control solutions. AESA Radar Data Link Systems Electronic Warfare Systems High-reliability Microelectronics Integrated Circuit Design and Assembly Radiation Test Services RF & Microwave Technologies, Satellite Waveguide Military Standard Electronics Motion Control Communications & Connectivity Supplier of robust, high performance equipment and solutions that enable reliable connectivity in the most demanding environments. Our solutions provide a competitive edge in aerospace, avionics, satellite and radio, wireless and mobile connectivity markets. Antenna Systems for Communication, Navigation, Electronic Warfare and Radar Cockpit and Cabin Communications Public Safety and Cellular Wireless Communications for Infrastructure Satcom Equipment for Aerospace, Land and Maritime Wireless and Radio Test Solutions Aviation Services Outsourced aviation services for military and civil customers worldwide through military training, special mission flight operations, outsourced commercial aviation and aircraft engineering Air Traffic Display Systems Electronic Warfare Training Fly-In Fly-Out Services for the Natural Resource Industry Helicopter Services Maritime Surveillance and Border Protection Regional Airline Services for Qantas Mission Systems Leading supplier of critical control solutions, we help customers to increase the safety and mission capabilities of their personnel and equipment in extreme environments. Advanced Restraint and Release Systems Aerospace Oxygen Systems Air-to-Air Refuelling Systems Emergency and Missile Actuation Systems Fuel Tank Inerting Systems Space Life Support and Propulsion Systems Thermal Management Unmanned Systems Weapons Carriage and Release 2

4 CAES Sector Overview Three Business Units Integrated Electronic Solutions Microelectronic Solutions Semiconductor Solutions Antenna Solutions for Airborne Communications, Navigation & Identification (CNI), Ground Mobile, Launch Vehicles & Missiles/Munitions, Motion Control Product & Systems Electronic Warfare, Electronic Support Measures, Direction Finding, Radar Warning Multi-function Assemblies Precision Gimbals and Gimbal Systems RF Transmission: High Performance RF Cables and Waveguide Flat Plate Antennas Rotary Joints/Rotating Subsystems Actuators/DC Motors Stabilized Platforms High Power, Solid State Transmitters Microwave and RF Components, Modules and Subsystems, including: Integrated Microwave Assemblies (IMA) Line Replaceable Units Signal Source, Synthesizers and Frequency Converters Switches and Switching Subsystems Passive and Active Control Components AESA panels Digital Receiver Exciters Applications include: Electronic Warfare, Electronic Support Measures and Precision Guided Weapons Radar (Land, Sea, Air) Tactical Missile Systems Space (Launch, Bus, Payload) Data Links Standard HiRel ICs SPO: µprocessor, Memory, Interconnect & Power, SBCs ASICs - IAD (Industrial, Space & Defense) ASICs - SMP (Security & Medical Products) Electronic Manufacturing Services (EMS): Build-To-Print (BTP) CCA & MCM, Supply Chain, Radiation Services & Trusted Power, Hybrid Microcircuits and RF modules and subsystems Product Brands: Cobham Gaisler Cobham RAD 3

5 AIN0 AIN1 AIN2 AIN3 AIN30 AIN31 Current MUX Analog MUX 32 PGA Reference System Anti-Alias LP Filter Power-On-Reset Programmable Current Source Control ADC 12-bit 100ksps Sigma-Delta Modulator External or Internal Clock/Oscillator Clk Digital Filter (COI3 or Sinc 3 ) Data Avg, Storage, Alarm Monitoring Primary & Redundant IO CAN CAN SPI SPI I2C I2C GPIO Cobham Semiconductor Solutions Product and Services Business Overview Products Solutions Products and Services Key Customers Monolithic Integrated Circuits Cobham (Formerly Aeroflex) High Reliability Standard Products, Custom and Application Specific Integrated Circuits for Space, Medical Imaging, Digital Processing, and Industrial & Commercial Applications Monolithic, Multi-chip, 2.5D packaging High Reliability Test and Qualification Rad-Hard by Design and Quantified Commercial Integrated Circuits µprocessor, Microcontroller, Memory, Clocks, Interconnect, Power Standard Products 2x CAN Controller Control Registers 32 Channel Data Storage Registers Alarm Threshold Registers Alarms and Interrupt Controller Power Cobham (Formerly Aeroflex) Power Management Hybrid Modules Custom Power Solutions Battery Electronics Units Electronic Manufacturing Services Cobham (Formerly Aeroflex) Built-To-Print, Low Volume/High Mix Circuit Card Assembly: ANSI-J-STD-001 including DS/ES and NASA 8739 Supply Chain Management Processors & Peripherals Cobham Gaisler Intellectual Property LEON Fault Tolerance Processors Computing IP for ASICs and FPGAs Software, Hardware, and Components Radiation Test Services Cobham RAD Solutions Radiation testing method to both MIL-STD-750 and MIL-STD-883 Transforming commercial technologies for harsh environment applications 4

6 5 RAD AND EMS SERVICES

7 Cobham RAD Solutions Full In-House Radiation Test Services, Device Up Screening Program Description Cobham RAD Solutions has obtained Lab Suitability by DLA (Defense Logistics Agency) for all radiation testing method to both MIL-STD-750 and MIL-STD- 883 and own and operate a full suite of radiation and electrical test equipment. Cobham Services Total Ionizing Dose TID RLAT (50 to 300 rads/sec) MIL-STD-883 TM 1019, Cond. A TID ELDRS (10 to 100 mrads/sec) MIL-STD-883 TM 1019, Cond. D, ESA/SCC22900 Prompt Dose / Flash X-Ray Tests MIL-STD-883 TM 1020 and 1021 Neutron Displacement Damage Testing Heavy Ion SEE Testing: SEL, SET, SEGR, SEU, SEB, SEFIs Proton SEE and Displacement Damage Tests Cryogenic FPA testing (25 K) Certified radiation testing with full suite of radiation and electrical test equipment 6 Transforming Commercial Technologies for Harsh Environment Applications

8 Electronic Manufacturing Services Circuit Card Assembly Cobham Services Build-To-Print (BTP) to include Circuit Card Assembly (CCA), hybrids & modules Can build to ANSI-J-STD-001 Low Volume/High Mix Production Supply Chain / Component Management Complete or complimentary life cycle for customer programs 7 Transforming Commercial Technologies for Harsh Environment Applications

9 STANDARD PRODUCT UPDATES 8

10 Rad Tolerant CAN XCVR Product Overview UT64CAN333x Features, Offerings, Availability Key Specifications and Features Max Power: <200mW 5V Tolerant Digital I/O Baud Rate: 10Kbps to 8Mbps CAN-FD Flexible Data Rate Supply Voltage: Single 3.3V Bus Fault Protection: ±16V Common Mode Range: {-7, 12V} Differential Input Capacitance: 25pF CAN Bus Output Drive: Up to 100mA Compatible with ISO & Cold Spare of digital I/O Supports up to 120 nodes Class 3A ESD for CAN bus pins (4000V) Packaging: 8-lead ceramic flat pack Superior, guaranteed radiation performance TID: 100 krad(si) Latch-up Immune to LET 117 MeVcm2/mg No SEGR Supports electric propulsion satellites CAN XCVR SEE report available upon request

11 CAN XCVR System Integration UT64CAN333x GR712, GR740 and UT699E/UT700 Microprocessors Integrated CAN 2.0 bus interface ARM M0 Microcontroller Available in 2017 CAN Primary and Redundant Controller Interfaces ARM M0+ Processor with Powerful Set of Development and Debug Tools Integrated Mission Read/Write Flash Memory and SRAM Comprehensive Analog Front End Internal Power Management Unit Small Footprint and Low Power Minimal Number of External Components

12 Cobham Gaisler Processor Solutions Complete System and IP Offerings Synthesizable IP Core Library Simulators, Debuggers, Operating Systems, Compilers FT FPGA Processors FT LEON3/LEON4 Processor Parts Development Boards System Testbeds 11 Transforming Commercial Technologies for Harsh Environment Applications

13 NEW: GR740 Quad Core LEON 4FT Product Highlights Quad-core LEON 4FT rad-tolerant SoC device 4x LEON 4FT with dedicated FPU and MMU 128 KiB L1 caches connected to 128-bit bus 2 MiB L2 cache, 256-bit cache line, 4-ways 64-bit SDRAM memory I/F (+32 check bits) 8-port SpaceWire router with +4 internal ports 32-bit 33 MHz PCI interface 2x 10/100/1000 Mbit Ethernet Debug links: Ethernet, JTAG, SpaceWire MIL-STD-1553B, CAN 2.0B, 2 x UART SPI master/slave, GPIO, Timers & Watchdog 625 CLGA Ceramic Package, wirebond, ~30 mm x 30mm Supply Voltage Core: 1.2V & I/O: 2.5V/3.3V Supported OS: RTEMs, VxWorks, Linux Prototype Devices & Development Board Available Now Documentation and Tools Available Now Preliminary Validation/Radiation Test Results Available

14 GR740 Quad Core LEON 4FT Advantages and Highlights on Performance / Functional Validation Advantages: More Processing power with Higher integration, addressing Size Weight and Power Low power Software reuse from prior LEON designs Supported by GRMON2 debugger and GRSIM Worst-case frequency of 250 MHz in production tests, over full temp range (-40 to +125 o C) >380 MHz operation over temperature range tested Benchmarking Results (~1000 MIPS, 1700 DMIPS) Shows approaching 4X performance with quad core vs single core Power consumption (including some I/O) at 25 C: 4x CPU: 1.85 W Various Radiation Testing Validation Targets: TID > 300 krad (Si), Single-Event Latch-Up Immunity (SEL) to LET TH 60 MeVcm 2 /mg Schedule/Availability: Prototype Devices & Development Board Available with documentation and tools: Available Now Production (QML) Product: 2H 2018

15 Gen 6 LEON 3FT Single Board Computer 3U cpci Form Factor Flexible Architecture UT699, UT699E, UT700 64MB of SRAM Instruction Memory 4 of Cobham s 160Mb SRAMs 32MB of NV Memory 5 of Cobham s 64Mb MRAMs IPC-6012 Class 3A Compliance Two front panel SpaceWire (SpW) interface connectors CAN, 1553* and SPI* interfaces to the cpci backplane (*UT700 version only) Full suite of analyses Proto and Flight Boards available now! 14

16 High Speed Serial Cross Point Switch UT65CML8X8FD - 8 x Gb/s Lanes 8 x 8 Individual Lanes or Two 4 x Gb/s Ports Each Lane of the 4 Lane Port Can Be A/B Path Switched (i.e. Primary vs Redundant) Each Lane Can Be Switched Independently and Powered Down Individually Lanes Can Be Cold Spared Continuous Serial Rates From DC to Gb/s CML-to-CML I/O Interfaces with Input Equalization Low Jitter Insertion Protocol Transparent Small Foot Print: 14.5 x 14.5 mm Power 1.3 Full Rate, All Lanes 1.2V Core, 1.8V CML, 2.5V SPI Port Radiation Performance - TID: 100 krads(si), SEL Immune, SEU Immune (SPI Port) -55C to 125 o C Applications Serial Communications Cross Strap Redundancy Space VPX 4 x Gb/s 4 x Gb/s 4 x Gb/s 4 x Gb/s XAUI CML I/O XAUI CML I/O CML Cross Point Supporting Up To Gbps SPI Control Register Interface SPI Control Port XAUI CML I/O XAUI CML I/O 4 x Gb/s 4 x Gb/s 4 x Gb/s 4 x Gb/s

17 Bus Switches Family Overview Interconnect Products Dual operating power supply (5V and 3V) Fast Switching (sub nsec delay) Low RON VDD = 3.3V offers 11Ω switch connection between ports VDD = 5.0V offers 5Ω switch connection between ports Low input/output capacitance (4.5 pf) Low power consumption Ultra low power CMOS technology 60mA continuous current per channel Small package options Operational environment: Total-dose: up to 300 krad(si) Latchup immune (LET < 100 MeV-cm2/mg) Supports Digital & Analog Applications Ideal for Bus Isolation applications Provides cold-sparing capability without the need for actual cold-sparing multiplexer inputs UT54BS bit Basic 8-bit block UT54BS bit Instantiate 2 8-bit blocks UT54BS bit Instantiate 2 10-bit blocks UT54BS bit Instantiate 4 8-bit blocks Product Pkg SMD # UT54BS bit 20 CFP UT54BS bit 48 CFP UT54BS bit 48 CFP UT54BS bit 96 CLGA 15241

18 Bus Switch Product Summary Value Proposition Optimized interconnect solution Fast switching speeds Low nano-second propagation delays Low RON resistance Low input/out capacitance Low Operating Power Electrically isolates load devices from active components or buses Supports cold-sparing and redundant architectures without speed penalties Supports Digital and Analog applications In voltage range: 3.0 to 3.6V or 4.5 to 5.5V Signal isolation: -60dB Bandwidth (3dB): 500 MHz Small package options Eliminates need for extra components, programming, and/or timing constraints

19 ASIC UPDATE 18

20 Integrated Circuit Development Services Flexible Engagement Model Full Turn-Key Customer provides performance specification Cobham does complete design, including ASIC specification development FPGA Conversion Either Cobham conversion or Customer conversion Co-Design Cobham designs analog, Customer provides Netlist Customer designs some analog, Cobham provides Netlist, etc. Netlist Handoff Gate-level netlist provided by Customer Cobham does physical design GDSII Handoff Cobham procures tooling Design for manufacturability, test program development, backend assembly Backend Assembly and Test Customer provides wafers/die Test Program Development 19 Transforming Commercial Technologies for Harsh Environment Applications

21 Integrated Circuit Development Services Core digital IC technology platforms Node Description Voltages 0.60 µm 3LM N-Well CMOS, Gate Array QML Q,V Trusted and Classified development flows 0.25 µm 4LM Substrate-Isolated CMOS, Cell Based QML Q, V Chain of custody and Classified development flows 130 nm 7LM Substrate-Isolated CMOS, Cell Based QML Q, Q+ Chain of custody and Classified development flows 90 nm 7LM Substrate-Isolated CMOS, Cell Bases QML Q, V, Y Trusted and Classified development flows Core: 3.3V, 5V Digital I/O: 3.3V, 5V Core: 3.3V, 5V Digital I/O: 3.3V, 5V Core: 1.2V Digital I/O: 1.3V, 2.5V, 3.3V Core: 1.0V Digital I/O: 1.8V, 2.5V Digital design capability across multiple technology platforms 20 Transforming Commercial Technologies for Harsh Environment Applications

22 Integrated Circuit Development Services Core Mixed Signal IC Technology platforms Node Description Voltages 0.60 µm 3LM N-Well CMOS, with NVM Core: 3.3V, 5V Digital I/O: 3.3V, 5V Analog: 5V 0.35 µm 4LM Substrate-Isolated CMOS 4LM Substrate-Isolated BiCMOS / CMOS / DMOS, with NVM QML Q/V Chain of custody and Classified development flows 180 nm 7LM Substrate-Isolated CMOS, with NVM 7LM Substrate-Isolated BCD, with NVM QML Q/V/Y Chain of custody and Classified development flows 130/110 nm 8LM Substrate-Isolated CMOS, with NVM QML Q/Q+ Chain of custody and Classified development flows 65/55 nm 8LM+ Substrate-Isolated CMOS, with NVM, RF Chain of custody and Classified development flows Core: 3.3V, 5V Digital I/O: 3.3V, 5V Analog: 5V, 6V to 65V Core: 1.8V, 3.3V, 5V Digital I/O: 1.8V, 3.3V Analog: 3.3V to 80V Core: 1.2V Digital I/O: 1.3V, 2.5V, 3.3V Analog: 3.3V Core: 0.9V to 1.2V Digital I/O: 1.8V, 2.5V, 3.3V Analog: 5V Mixed signal design capability across multiple technology platforms 21 Transforming Commercial Technologies for Harsh Environment Applications

23 IC Packaging and Assembly Technology Capabilities Current Package and Assembly Offerings QML ceramic packages from 12 to 1752 I/O; QFP, DFP, FP, LGA, CGA, PGA Commercial PBGA packages from 81 to 484 I/O; QFN packages from 12 to 64 I/O; PQFP packages from 40 to 208 I/O QML assembly to Class Q, V, and Y flows Advanced Packaging Offerings QML-qualified stacked die technology Class Y flip-chip assembly technology QML solder column attach QML passive attach and heat sink attach Future Package Development Efforts Flip-chip on organic package technology to accommodate increased speeds and decreased pitches Plastic package technology for Small Sat applications 2.5/3D package solutions for higher density and increased capacity Custom Plug & Sense SM packaging of sensor and read-out electronics 22 Transforming Commercial Technologies for Harsh Environment Applications

24 Cobham Semiconductor Solutions Sensing and Imaging Signal Chain Solutions ROIC s Embedded processors Data convertors Customer embedded IP Low power design Hi-Rel design Sensing Element Imaging Array Cobham Sensing/Imaging Solution Space Analog Interface ADC Signal Processing Digital Processing Connectivity FPA Bias, Gate Driver, Control Circuitry Timing Generation and Control Data Interface and Control Logic Power and Battery Management/Device Protection ** Customer collaboration and IP integration possible Collaborative ASIC, ASSP, and Standard Product Solutions Engagement Model Turn-key, semi-custom, design and layout services, development projects Merging Cobham, third-party, and customer IP High reliability qualification and manufacturing End-to-end supply chain management for Military/DOD/Hi-Rel components 23 Transforming Commercial Technologies for Harsh Environment Applications

25 POWER DISTRIBUTION MODULES 24

26 Power Distribution Modules (PDMs) Now Have Achieved TRL 9 on Multiple Missions 25

27 PDM Competitive Advantage 28V Bus, 1V Out Delivering 50A IBC/NiPOL Approach 1 IBC delivering 100W Area: 4.5 in 2 Efficiency: 80% 4 NiPOLs delivering 12A 1V Paralleling will add complexity NRE needed to complete power supply design Total Area 7.84 in 2 Efficiency: 71% Total Efficiency 57% Total Area in 2 Power Delivered 48W IRM/iPOL Approach IRM Efficiency: 92% 28V Bus, 40V Area: 2.16 in 2 ipol Efficiency: 89% 40Vin 1V 50A Area: 1.94 in 2 Total Efficiency 82% Total Area 4.10 in 2 Power Delivered 50W IBC/NiPOL Approach takes 210% more board area and requires more NRE 26

28 IRM Products available IRM Type Input Voltage Range Maximum Input Voltage UV and OV Voltages Output Power to 36V 60V 21.5V V 100W to 78V 125V 59V - 80V 75W to 105V 125V 90V - 106V 75W IRM All IRMs have the same output characteristics, use the same Ros and Rg resistor values, have the same PC, RAL, Sleep, and VC characteristics, have the same pin outs and the same footprint. 27

29 ipol Products available ipol 613xxx ipol 612xxx 28

30 Modular Method of Design To optimize designing with this modular approach, set the IRM output voltage to a voltage that can be used by multiple ipols Parallel ipols for increased current capability A single resistor sets the IRM output voltage Output V K factor Vib Supply I 1.0V 1/40, 1/32 40V, 32V 50A, 50A 1.8V 1/24, 1/ V, 28.8V 37.5A, 16.7A 2.5V 1/16, 1/12 40V, 30V 16.7A, 12.5A 3.3V 1/12, 1/8 39.6V, 26.4V 12.5A, 8.3A 5.0V 1/8, 1/6 40V, 30V 8.3A, 6.25A -5.0V 1/8, 1/6 40V, 30V 8.3A, 6.25A 12V ¼, 1/3 48V, 36V 4.16A, 3.13A 29

31 30 QUESTIONS?