Company and Products Presentation at IAS

Transcription

1 Company and Products Presentation at IAS Strategies, Capabilities and Product Overview March 6 th 2008

2 Company Overview Initiatives and Strategies Operations and Quality Systems Custom Product Specialties

3 Company Overview

4 Company Profile Fabless Mixed-Signal Standard and Custom IC Manufacturer >20% Annual Growth for Past 7 Years 14 Design Engineers Rapidly Growing Infrastructure Operations, Marketing, Sales, Design and Applications Avg 20+ New Designs/Yr Since Custom ASICs in Production 30+ Standard Products in Production by Q3 08 ISO9001:2000 Certified, ITAR Registered Expanding Customer Base, 30+ Different Mil/Aerospace, Automotive, Industrial and Medical Customers Pierre Irissou President/CEO

5 Process Technologies Multiple Processes Offered as Best Fits a Customer s Needs 30V Bipolar 80V Modular CMOS (0.35 μm, 0.6 μm, 0.8 μm) 6V BiCMOS (06 μm) 40V Complementary Dielectrically Isolated (DI) Bipolar 300V and 600V Dielectrically Isolated (DI) CMOS Special Options: Opto Windows, EEPROM, High-Temperature, Special Packaging Requirements

6 Historical Market Coverage Medical 5% Industrial 25% Mil/Aero 32% Power Management 8% Automotive 15% Telecom 15%

7 Process Technologies Flexibility and Versatility We Work to Meet Your Needs Full Custom Concepts, Schematics Specification 2nd Sourcing Replace ASIC, Obsolete Parts COTS Replacement Mil Temperature Range RAD-Hard Processes Mil Std 883 Qualification Conversion or Consolidation FPGA to ASIC Hybrid and Multi-Component Integration Semi-Customization, Standard Product Modification AAI Design Methods Allow for Rapid, Efficient Changes

8 Operations and Quality Systems

9 Foundry, Assembly, Specialty Testing Multiple Foundry Partnerships Globally Distributed Small Wafer Runs to Very High Volume Capability 55 thousand 6 wafers/month High Reliability/Capability Partners MIL-PRF-38535, ISO/TS 16949, VDA61, ISO9001:2000, ISO14001:1996, DSCC-VQ, ITAR Assembly and Test Low and High Volume SEA Partners SEA Sources High Quality Suppliers ISO9002, QS9000, ISO/TS Domestic Hermetic Assembly and Qualification High Reliability/Capability Partner DSCC-VQ, ISO9001:2000, ITAR Domestic Radiation Hardness Testing CO60 TID Testing SEU Testing

10 Packaging and Test Capabilities Onsite Capabilities (Probe, Test, Package) Speed Deliveries and Development Activities 5 KLA Probers 7 Credence ASL-1000 Testers 2 Credence Diamond D10 Testers Multiple Handler Capability (SOIC, TSOP, TSSOP, TO-53) 3 Thermonics Temperature Forcing Unit Burn-in Ovens for Qualification and Life Testing Clean Room Environment Notes: Onsite Test Capacity: 50+ Million Pcs/Year Duplicate Setups at Manufacturing Partners for Disaster Recovery

11 Onsite Test Area

12 QA Overview AAIs Quality Mgt System Complies With ISO 9001:2000 QA Manual Available on Request Proprietary Procedures/Instructions Auditable On Site Subcontractors (Fab, Assbly, Test) are ISO/TS 16949:2002 Qualification per AEC-Q100 Available Notes: AAI has Aided Customers With Production Part Approval Process (PPAP) Development

13 Qualification and Production AAI QA System Complies with the Requirements of: MIL-STD-883 & MIL-PRF ISO 9001: 2000 Screening Backlapping Wafer Test Wafer Lot Assembly Fabrication Method Final Electrical Test (per AAI spec.) (per device spec.) Acceptance & Marking Screening Cold, hot, room temp (per AAI spec.) (Note 1) (per device spec.) Commercial Plastic N/A N/A N/A Room Temp. Commercial Room Temp. Ceramic N/A Fine/Gross leak 1014 Hot, cold (optional) Basic Fine/Gross leak 1014 Room Temp. Military N/A External visual 2009 Hot, cold Screening Burn-in test (optional) Wafer Fab Fine/Gross leak 1014 Serialization (optional) Room Temp. Military External visual 2009 Hot, cold Class B N/A Group A tests 5005 External visual 2009 Burn-in test 1015 Delivery Fine/Gross leak 1014 Military Method 5007 Serialization spec. Room Temp. Class S Method 2018 External visual 2009 Hot, cold Group A tests 5005 External visual 2009 Burn-in test 1015 (Note 1) Incoming Inspection & Outgoing Procedure Steps not displayed (ask AAI for details)

14 Design Cycle Overview FAB Wafer Plastic Assembly Off-shore Final 14 Designers Mixed Signal Expertise & Methodologies, Lab Resources Libraries of Macro-Functions 6 and 8 8 wafers Electroglass 6 & 8 high-speed manual & auto align KLA cassette to cassette auto-align Mixed signal Pragmatic testers for existing products State of the art Credence mixed signal testers Credence digital tester for high digital contents ASICs Hot rail handlers & temp forcing systems

15 Custom Product Specialties Approaches and Considerations

16 Approaches and Considerations Communications and Flexibility, the Keys to Successful Development Access to Project Managers and Designers Design Team Works Closely With Our Customer In Design Partition Consider All Requirements Technical, Cost, Timing Continually Seek to Improve Product Through Life - Yields, Sustainability, Cost Provide Rapid Response During Emergencies

17 Process Considerations Standard Processes Used by AAI for Other Products, Equally Important in Mil/Aerospace/Rad-Hard Products Known, Reliable Design and Process Models Stable and Consistent Processes Familiarity Has Significant Benefits: Fast Development Schedule Quick Delivery on Functional Samples Efficient Design for Lowest Cost

18 Custom Design Expertise Analog and Mixed-Signal Designs Digital: Up to 200k Gates, Including DFT, Scan Insertion, JTAG, etc. Analog: Numerous Precision Analog Blocks, Including Low-Offset Amp s, A/D, D/A, Regulators, References, Converters, etc. Cost effective OTP Available Blocks Available With Higher Voltage Capability (20V, 40V, 60V) Typical Design: 5-10 Analog Functions, 5k-30k Digital Gates, Duration 6 Man-Months of Engineering

19 Custom Design Options ASIC Design Flow Schematic Entry Simulation Layout Post-layout Simulation Bonding Diagram Forms of Integration Gate Arrays Tile Arrays Standard Cells Full Custom Multi-Projects Array Example for Automotive Products Quick Fab (3 Wks for Proto) Quick Prod Ramp (5 weeks) Aggressive Low Volume (200k/yr) Minimal Tooling Costs Highly Customizable Up to 28 I/Os, High V to 40V, High Precision Analog, 2k Digital Gates, High I Drivers

20 Custom Product Specialties General Market Expertise

21 Special System Expertise Battery System Expertise (Airborne, Automotive, Portable Systems) Power Reversal Spike and Transient Power Surges Over-Voltage Survival Minimum Operating Voltage Operation (Cold Start, Other) High-Voltage: Mixed Signal ICs up to 50V DC Bipolar Interfaces up to 120V DC IGBT/MOSFET High-Side Drivers up to 1000V DC Differential Photo Sensors With Up to 1500V RMS isolation Solid State Relays Up to 400V Switching Power Supply Controllers Up to 50V Integrated Off-Line Products Up to 600V

22 Custom Product Experience Telecom Headset ICs Telephone Chip Sets 2-4 Wire Conversion 70V Ringing SLIC Speakerphone Fast Charger for Cellular Phones Low-Voltage, Low-Current RF ASICs Industrial Pressure, Acceleration & Vibration Sensors Servo Controllers Circuit Breaker Controllers GFI ICs Up to 460V AC & 5mA Leakage Arc-less Solid State Relays & Circuit Breakers High-Temperature Circuits for Instrumentation /Oil Prospection Up to 200 C IGBT & Power MOSFET High-Side Drivers IR Sensors (Alarm, Proximity & Counting) Capacitive Pressure Transducers

23 Custom Product Experience Sensors Integrated Strain-Gauge (Pressure, Vibration) Integrated Current-Sensors With On-Chip Programmability Integrated Photo Sensors (Up to 50KHz) With Processing and Programming Integrated Temperature Sensors (-60 C to 175 C) Consumer: Toys & Gadgets ICs for Radio-Controlled Models DC Motor Controllers for Car Models Low Cost Off-Line Power Supply Controllers LED Lighting Controller and Interface

24 Custom Product Specialties Automotive Experience

25 Demonstrated Automotive Market Success Automotive is a Significant Part of Our Business Successfully Audited by Delphi, Siemens, Boeing, Rockwell and Others We Understand Automotive Business Requirements: Price / Performance tradeoff Rigorous Quality Requirements at All Levels of Design and Manufacturing Harsh Operating Environment

26 Automotive Experience DC Motor Controllers for Car Models Low Cost Off-Line Power Supply Controllers Keyless Entry/Alarm Controllers Ignition Controllers With Logic Manifold Pressure Sensors Rain/Fogging Sensors Ultrasonic Sensors LVDT IC for Pedal Position Sensing Optical Shaft Encoder for Car Seat Non-Contact Rotation Sensor for Drive by Wire

27 Specific Product Example for Automotive Market LPM controller for GM cars and trucks Project Started in 2001, Pre-Production in 2002 Full Production Started 2003, Over 8 Millions Parts Delivered Through 07 Mixed Signal High-Voltage BiCMOS ASIC Defect Density < 20 ppm AAI Designed Customer System

28 Specific Product Example for Automotive Market Optical Shaft Encoder for Car Seats Project Started in 2003 Currently in Qualification Analog CMOS ASIC Replacement ASIC Cost Reduction Performance Enhancement

29 Specific Product Example for Automotive Market Non-contact Rotation Sensor for Drive By Wire Project Started in 2004 Functional Engineering Samples Mixed-Signal BiCMOS 20k Digital Gates 4 Integrated Filters Integration of a Discrete System

30 Custom Product Specialties High Reliability Markets

31 Special Capabilities Key for High Reliability Programs Provision for Long Life Programs 10 Yr Minimum Process Availability Typical Die Bank Option for Longer Programs Radiation Tolerant Processes Proprietary Process Options and Design Techniques Achieve Radiation Hardness in Digital/Mixed-Signal ICs Radiation Hardness Assessed by Testing Total Ionizing Dose Testing, Some Devices Pass to 300kRad(Si) Single Event Effects Char. Under Proton/Neutron/Heavy Ion Beams Cross Cross Section Section (SEU/particle/cm2) (cm^2/bit) 1E-04 1E-05 1E-06 SEU Cross Section of AA630 flip-flops cross sec FFL FFRL FRL FRRL FRRSL 1E LET (MeV/mg/cm2) LET (MeV/mg*cm^2) Note: "cross section " is the average of all flip-flop types

32 Space and Aerospace Satellites: Radiation Hardened ICs (Total Dose & SEU) High-Side Relay Drivers Hardened Transceivers Hardened Interfaces up to 50V Transport Aircrafts: ARINC 429 RS 485 Transceivers Quad Single Supply Receivers With Self Test High-Side Relay Drivers LVDT Driver/Decoder ABS Hydraulic Valve Controller Switching Power Supplies

33 Military and Medical Military: MIL-STD Transceivers (US & European) MIL-STD Solid State Relays & Breakers Radiation-Hardened Switching Power Supplies Head-up Display Drivers RFID from 200 KHz to 25 GHz Medical: Pacemaker Implantable Defibrilator Ultrasonic Imaging Hospital Patient Thermometer Implantable Drug Monitoring and Delivery Components

34 Specific Radiation Hardened Product Examples Minuteman Level detector 6um V-Grooved DI Custom Process Omegasat High-Side Driver 3um Trenched DI Custom Process Passed All Requirements, Including Total Dose, SEL and SEU Not In Production Due to Program Cancellation

35 Specific Radiation Hardened Product Examples Globalstar High-side Driver 6um V-Grooved DI Custom Process 5000 Flight Unit Successfully Delivered 100krad(Si) Required, Passed 200krad(Si)

36 Specific Radiation Hardened Product Examples Delta Launcher 2 ASICS Pin-for-Pin Replacements of Sipex Parts Cost Reduced Solution Yield Enhanced HV 2um CMOS + Rad-Hard Zener HV 2um CMOS + Rad-Hard Analog Devices Reference Post Packaging Trimming

37 Specific Radiation Hardened Product Examples Serial System Interface ASIC Single Chip, 06um BiCMOS Mixed Signal ASIC 20k Digital Gates with Scan Chain (From FPGA) High Precision Analog 32 Analog Inputs 32 Bi-Level Inputs, 16 Bi-Level Outputs 32 Digital Pulse Outputs Regulator, Oscillator, 8-bit A/D, 05% Current Source With 64-1 Mux, Host Interface Cold-Sparing on All Pins Passes 200krad(Si) Total Dose

38 Specific Radiation Hardened Product Examples Actel RH1280 Replacement (15 ASIC Program) for Space Applications: ASIC Conversion to Address Reliability Issues of the RH1280 (Anti-Fuse Technology) Lower Cost than Existing Solution 3-4 weeks conversion time per ASIC Pin to Pin replacement of existing FPGA 1 to 1 Remapping from FPGA Gate Netlist 300 krad(si)total Dose Error Rate of 25E-10 Upset/Bit-Day

39 FPGA Conversion

40 General Considerations ASIC Advantage Offers Conversion of FPGAs to ASICs as Standalone Project or as Part of a Larger Integration Program Densities of Up to 200k Gates Most FPGA Vendors Supported (Xilinx, Actel, Altera, Lattice) Pinout and Package to Match Original Device if Required Different Pinout Also Possible Flexibility to Merge Several FPGAs 5V/3.3V Operating Voltage for Core and I/Os

41 Conversion Process Map FPGA Conversion Technology Dependent Gate Netlist (eg RH1280, XC4000, etc ) SDF File Functional Test Vectors RTL Conversion RTL Netlist (Verilog or VHDL) Timing Constraints Functional Test vectors AAI technology Mapping DFT- Scan/JTAG Insertion Static Timing Analysis Functional Vector Simulation Formal Equivalence Pre-Layout Customer Design Review Place and Route Static Timing Analysis ATPG Test Coverage Formal Equivalence Customer Design Review and Approval Release to Fabrication

42 Special Requirements ASIC Advantage Has Successfully Managed a Myriad of Unique Conversion Challenges Gate to Gate Remapping Available as Required, Noting No Netlist Optimization is Possible Typically Required to Preserve Redundancy, Other Design Specific Issues Design for Testability (DFT) JTAG, Scan-Chain Insertion ATPG to Improve Test Coverage Timing Matching Yields Optimum Compatibility With Original FPGA, I/O Setup/Hold/Propagation Delays

43 Requirements and Deliverables Start Well, End Well Needed for a Successful Program Start Technology Dependent Netlist (Edif, Verilog or VHDL) or RTL SDF Timing File From the FPGA Vendor s Design Tool and/or Timing Constraints Functional Test Bench to Save Conversion Time Deliverables With Program Completion Structural Netlist (Verilog or VHDL) and Timing Formal Equivalence Report Timing Report Test Coverage Report Layout Plot and Bonding Diagram Electrical Test Specification