IBM 43E7488 POWER6 Microprocessor from the IBM System 8203-E4A Server

Transcription

1 43E7488 from the IBM System 8203-E4A Server Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:

2 Package Analysis Table of Contents 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Package and Die Summary 2 Device Identification 2.1 Server Motherboard and Heatsink 2.2 Package and Die 3 IBM POWER6 Package and Die Cross-Sectional Analysis 3.1 Package Structure 3.2 Package Lid (IHS) 3.3 Package Substrate Metal Layers and Vias 3.4 Solder Bumps 4 Materials Analysis 4.1 SEM-EDS Analysis of Package Materials 5 References 6 Statement of Measurement Uncertainty and Scope Variation About Chipworks

3 Overview List of Figures 2 Device Identification E4A Server Front View E4A Server Back View E4A Server Motherboard Top View Heatsink on Motherboard View A Heatsink on Motherboard View B Motherboard Solder Bumps Heatsink Bottom View Heatsink End A View Heatsink End B View Heatsink Side View Heatsink Top View Package Top View Package Edge View Package X-Ray Package X-Ray Detail Partial Die Photograph Die Solder Bump Pads 3 IBM POWER6 Package and Die Cross-Sectional Analysis Package Cross Section Overview Motherboard Solder Balls Package Edge Die Edge Cross Section Right-Hand Edge Die Edge Cross Section Left-Hand Edge SEM TIM 1 Cross Section Right-Hand Die Edge SEM TIM 1 Cross Section Left-Hand Die Edge SEM TIM 1 Cross Section Mid Right-Hand Die SEM TIM 1 Cross Section Center Die SEM TIM 1 Cross Section Mid Left-Hand Die SEM TIM 1 Detail Underfill Cross Section Right-Hand Edge Underfill Cross Section Left-Hand Edge Die Seal Left-Hand Edge Package IHS Die Island Thickness Left Package IHS Die Island Thickness Right Package IHS Edge IHS Attach Detail Package IHS Plating Thickness Organic PS General Structure Optical Organic PS Metal Through Hole Via and Metals 7 and Top of Through Hole Via SEM

4 Overview Organic PS Metals Minimum Observed Metal Stacked Vias Solder Bump Solder Bump SEM Solder Bump LHS Solder Bump Middle Solder Bump RHS Die UBM SEM Die UBM Detail SEM Solder Bump Organic PS Sn Land Detail SEM 4 Materials Analysis IHS (Lid) Plating IHS (Lid) Body IHS Attach TIM 1 Al Particles TIM 1 Between Al Particles Die Coat Solder Bump UBM TiW Solder Bump UBM Cr Solder Bump UBM Cu Solder Bump UBM Ni Body of Solder Bump A Body of Solder Bump B Organic PS Metal 14 Sn Land Organic PS Metal Interconnect Die Underfill Organic PS Solder Mask Organic PS Buildup Layer Dielectric Organic PS Fiberglass Core PS to PCB Solder Ball 1.2 List of Tables Device Summary Package Summary Observed Package Metal Dimensions Package Vertical Dimensions and Materials (Top to Bottom)

5 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at: Chipworks 3685 Richmond Rd. Suite 500 Ottawa, Ontario K2H 5B7 Canada T: F: Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com