Optoelectronics and Automation

Transcription

1 Optoelectronics and Automation October 4, 2001 Presented by: Jacques Coderre Product Manager, Advanced Semiconductor Assembly Division September 2001 Universal Instruments EP&P Magazine 1

2 Introduction Mark Robins Senior Technical Editor EP&P Universal Instruments EP&P Magazine 2

3 Presentation Jacques Coderre Product Manager, Advanced Semiconductor Assembly Division Universal Instruments Universal Instruments EP&P Magazine 3

4 Optoelectronics and Automation Agenda Introduction Market and technology Lasers Automation requirements Universal solutions What s in the future Universal Instruments EP&P Magazine 4

5 Introduction Drivers Bandwidth, Bandwidth, Bandwidth. Internet Explosion Insatiable need for more. Desire to bring the fiber to the home (FTTH). Wireless 3G drives a need for bigger pipes... $100B worldwide ( ) Combination of wired and wireless infrastructure Wired network has more capacity (bandwidth, speed) but capital intensive Manufacturing just can t do it manually any more Yield People Cost must come down to attack Metro Area Networks Universal Instruments EP&P Magazine 5

6 Moore s Law in Action Internet traffic growth Relative volume Recovery Soft landing Contraction Source: RHK Inc. Universal Instruments EP&P Magazine 6

7 Wired Communications Technologies Universal Instruments EP&P Magazine 7

8 Optoelectronics and Automation Agenda Introduction Market and technology Lasers Automation requirements Universal solutions What s in the future Universal Instruments EP&P Magazine 8

9 Market Info - Optical Components $ Billions DWDM optical components market revenues scenarios Source: RHK Inc. Recovery Soft landing Contraction Universal Instruments EP&P Magazine 9

10 Some facts. Transporting bits through optical fiber (O) provides more bandwidth and more speed than electronics-based systems (E). In present systems, (O) must be brought back to (E), then back to (O). O-E-O transfers are at the heart of long haul systems Transmission, Regeneration/Amplification and Receiving are (O) Multiplexing, De-multiplexing, Switching, Add/Drop are (E) today Universal Instruments EP&P Magazine 10

11 Optoelectronics Modules Optical components required for optical link - Laser Diode/LED: Emits photons - Photo Diode: Detects photons Photo Diode Optical Link Laser Diode Electronic components required for optical link - Laser Driver: Controls laser diode - Amplifier: Amplifies weak incoming signal - Multiplexer: Combines multiple slow signals to one fast signal - Demultiplexer: Divides one fast signal into multiple slow signals Amp Driver 1G Ethernet 10G SONET 1 x 1 Gbps 1 x 10Gbps The packaging approach is determined by: - Performance: Ethernet less demanding than SONET - Data Rate: 25Mbps 1Gbps 2.5Gbps 10Gbps - Form Factor: Increasing port density - User: Experience with optics/high speed design - Cost Targets: LAN vs. WAN 8 x 155Mbps Demux Mux 16 x 622Mbps Higher Level ASICs Universal Instruments EP&P Magazine 11

12 mvc Optoelectronics Assembly Requirements Board Level Odd component placement Selective (spot) soldering Fiber management Fiber splicing Optical and functional tests Component Level: Electronics Odd component placement Flip chip, wirebonding, ribbon bonding 10µm placement accuracy RF tests Component Level: Optical Odd Component placement Bare die placement Fiber handling Passive and active alignment <1µm placement accuracy Polymer/solder dispense Optical tests Electronics and optics merging into hybrid optoelectronic modules Reference: Prismark Universal Instruments EP&P Magazine 12

13 Laser Diode Packaging Hermetic Butterfly Package Kovar, AIN with glass metal seat Cu, CuW, Si, SiC Baseplate Heatsink Attached to package with Ag epoxy Diamond, AIN, Cu, BeO Submounts Spread heat laterally, match CTE of LD Attached to baseplate with SnPb solder Semiconductor Laser Diode Attached to submount with AuSn, AuGe solder Fiber attached to pedestal with adhesive and solder Si grooves for passive alignment Hermetic Fiber feedthrough with adhesive or low temperature solder Optical components attached with adhesive Critical Requirements Stable optical coupling Hermetic enclosure Efficient thermal path No Outgassing Preferably passive alignment Package may also have Monitor diode Lens Thermistor Peltier Cooler Optical Isolator Reference: Prismark Universal Instruments EP&P Magazine 13

14 Edge Emitting Laser Universal Instruments EP&P Magazine 14

15 Vertical Cavity Surface Emitting Laser (VCSEL) Today Gallium Arsenide (GaAs) 850 nm Transmits light vertically upwards or downwards (flip chip) Ethernet applications (short distances) Most volumes today are single mode with one transmitter (VCSEL) and one receiver (Diode) Placement repeatability ~2-3 microns Emerging Parallel optical links (VCSEL Array) Higher wavelength for longer distances Single VCSEL Downwards VCSEL Array Single VCSEL Upwards Universal Instruments EP&P Magazine 15

16 VCSEL Products Small Form Factor Pluggable transceiver 850 nm VCSEL Distances up to 500m Source : Universal Instruments EP&P Magazine 16

17 Optical Amplifiers Subsystems that amplify one or more optical signals. Erbium-doped Fiber Amplifier (EDFA) Erbium-doped Waveguide Amplifiers Raman Amplifiers Semiconductor Optical Amplifiers EDFA Construction Erbium-doped section of fiber spliced into a network silica fiber Pump laser (with heatsink) Photodiodes, multiplexers, filters, couplers, input/output connectors Estimated 85,000 units made in 2000 with ASP of $35,000. Unit growth will be near 35% per year 10.5 Output Connector Input Connector Photodiode Tap- Coupler Erbium-Doped Fiber Tap- Coupler Photodiode 6.3 Filter Multiplexer Pump Laser Reference: Prismark Heat Sink Splice Universal Instruments EP&P Magazine 17

18 Optoelectronics and Automation Agenda Introduction Market and technology Lasers Automation requirements Universal solutions What s in the future Universal Instruments EP&P Magazine 18

19 Laser Market Lasers (B$) (?) Non Diode Diode Telecom Non-Telecom Reference: Laser Focus World Marketplace 2001 Strategies Unlimited (January 2001) Universal Instruments EP&P Magazine 19

20 Non-Diode Lasers B$ Units(K) B$ Units(K) Materials Processing Metals (welding, cutting) Semiconductors (Lithography) Marking Medical Others 0.1 NA 0.1 NA (?) Laser Types Solid State Lamps, ND: YAG, Excimer, CO2 Reference: Strategies Unlimited (January 2001) Universal Instruments EP&P Magazine 20

21 Diode Lasers B$ Non-Telecom 2000 <700 nm, visible 0.3 DVD, Bar Code, Pointer nm, < 100 MW 1.2 CD, Printers Telecom nm, 100 MW - 10 W 1.0 EDFA Pumps, VCSELS nm 4.1 Raman pumps, Transmitters 6.6 Reference: Strategies Unlimited (January 2001) Universal Instruments EP&P Magazine 21

22 Diode Lasers Units(M) Non-Telecom 2000 Optical Storage (DVD, CD) 350 Others (printers, pointers) 65 Telecom Transmitters 4 Pumps 1 Total 420 Reference: Strategies Unlimited (January 2001) Universal Instruments EP&P Magazine 22

23 Telecom Lasers Transmitters B$ Units(M) B$ Units(M) Edge Emitting, 1550 nm VCSEL, 850 nm 0.2 NA 0.3 NA (?) Pumps EDFA, 980 nm Raman, 14xx nm Reference: Strategies Unlimited (January 2001) Universal Instruments EP&P Magazine 23

24 Automation Driven by the need for Accuracy Types of Multiplexing devices Laser sub-assemblies Lenses, Lasers Assemblies Clocks, Amplifiers Photodiodes Amplifiers Laser sub-assemblies Sub-mounts Final Assembly Processes Eutectic die attach Eutectic die attach Eutectic die attach Epoxy die attach Alignment to laser Active Laser alignment in-situ UV curing Passive alignment In-Situ UV Cure Flip Chip Flip chip laser diodes Speed Components/hr Components/hr Components/day 10 Microns 5 Microns <1 Micron Universal Instruments EP&P Magazine 24

25 Less than 1 micron - Fiber Alignment Wire Bonds Systematic Search Pattern Metallic Fiber Ferrule Laser Diode Divergent Laser Beam Cylindrical Lensed Optical Fiber Reference: Newport Universal Instruments EP&P Magazine 25

26 Fiber Sleeve Attachment by Laser Welding Active alignment ( laser hammering ) Weld to seal? Laser Beam Laser Beam Fiber Metal Sleeve Reference: Newport Universal Instruments EP&P Magazine 26

27 Optical Fiber (SM) Someone has to Cut fiber, strip coatings, cleave fiber Attach ferrule/sleeve/connector? Splice? Universal Instruments EP&P Magazine 27

28 VCSEL Inside VCSEL Assembly 12 mils x 12 mils device Align with respect to die feature (top-side) Place in center of header Gel-Pak feeding 25 3 sigma Universal Instruments EP&P Magazine 28

29 Optoelectronics and Automation Agenda Introduction Market and technology Lasers Automation requirements Universal solutions What s in the future Universal Instruments EP&P Magazine 29

30 Automation Requirements Accuracy Speed Vision of devices prior to pick Placement relative to previous component Low Force placement Versatile handling system Traceability Universal Instruments EP&P Magazine 30

31 Optoelectronics and Automation Agenda Introduction Market and technology Lasers Automation requirements Universal solutions What s in the future Universal Instruments EP&P Magazine 31

32 GSMxs Linear Motor Platform Patented, VRM (Variable Reluctance Motor) advanced technological design provides exceptional high speed moves with short settle times to achieve highly accurate fine pitch placement Flip chip capable Bare die capable Class 1000 clean room compatible Specifications are 18 +/- 6s. Typical results are 12 +/- 6 s Supports all standard GSM heads, feeders and fluxing units 10 x 13 board area 48 feeders Universal Instruments EP&P Magazine 32

33 Product Roadmap Cassette Single Wafer VRM Linear Motor New Motor Positioning System Feeder Tape Waffle Pack Gel Pack 300 mm 0.2mil/Pixel DLC 0.5mil/Pixel ULC Cameras Board Handling Heated Brd Support Thick Brd Support Precision Brd Lifter 0.2mil/Pixel MV ULC ESD FlexJet High Force Force Control Heads GSMxs Nozzles Low Force Precision Under Development UV Eutectic Die Attach In-Situ Heating Software Look Before Pick Flip Chip Scrub Low Force Place & Hold Programmable Component Offset Universal Instruments EP&P Magazine 33

34 Downward Looking Camera Comparison Field Of View (mm) Mil/Px (5ì pp) 0.5 Mil/Px (13ì pp) Minimum Feature Size (mm) 0.8 Mil/Px (20ì pp) 1.0 Mil/Px (25ì pp) Universal Instruments EP&P Magazine 34

35 Upward Looking Camera Capability Megaview Cameras 0.8 mpp (20ì pp) Single FOV Die Size (mm) mpp (5ì pp) (RFQ) 0.4 mpp (10ì pp) (RFQ) 0.5mpp Analog (13ì pp) Feature Size (mm) 1.3mpp Analog (33ì pp) Universal Instruments EP&P Magazine 35

36 Downward Looking Camera Matrix Camera Lighting Type Optics Outer Ring Inner Ring On Axis Telecentric Cross Polarizer Standard 1.0 Standard X X X 0.8 Standard X X X 0.8 Universal X X X X Light 0.5 Universal Light X X X X 0.5 OAL X X X 0.2 OAL* X X X *Under Development Universal Instruments EP&P Magazine 36

37 Lighting Types Lighting has several variables Geometry - The angle at which the light is incident on a subject Structure -Polarization - Linear Wavelength - Color Other Variable: Camera transfer function - Some cameras are more sensitive to certain wavelengths than others. Universal Instruments EP&P Magazine 37

38 Telecentric Camera Optics What is a Telecentric Lens? A Telecentric lens has the property of having its magnification independent of its object distance. This has distinct advantages: Part/Substrate Thickness is not critical - as long as it is in focus, all features will be spatially correct Z axis accuracy is not critical - The Z setup of a spindle will not change the appearance of a die over an Upward Looking Camera equipped with Telecentric Optics Universal Instruments EP&P Magazine 38

39 Illustration of Non-Telecentric Optics and Bump Imaging C4 Bumps In the Focal Plane C4 Bumps Out Of the Focal Plane Universal Instruments EP&P Magazine 39

40 Illustration of Telecentric Optics and Bump Imaging C4 Bumps In the Focal Plane C4 Bumps Out Of the Focal Plane Universal Instruments EP&P Magazine 40

41 Downward Looking Camera Lighting Structure / Geometry Universal Light, Outer Ring Wavelength (color) UV Blue Green Red IR HASL LBP Die Imaging BT Resin FCOF Universal Light, HASL Fids HASL Fids Inner Ring Universal Light, FCOC FCOC X-Polarized On Axis Light FCOG LBP Dice HASL Fids UV Nozzle UV Cured Material Universal Instruments EP&P Magazine 41

42 Look-Before-Pick: Picking Die From Large Pockets Look-before pick (LBP) capability: Locates small die in large pockets Picks die on-center Die centering is fine-tuned with an upward-looking camera 975-µm die in large pockets Array placed using LBP 50-µm die separation Universal Instruments EP&P Magazine 42

43 Look-Before-Pick Process Overview Locate die in the waffle pack with a 0.5-mil/pixel downwardlooking camera (rough find). Verify orientation (0 vs. 180 ) based on top-side features.» If the die is 180 out, leave the die in the pocket and move on.» If the die is at 0, orient a collet nozzle and pick the die. GSM image of the die Collet nozzle Inspect the die with a 0.5-mil/pixel upward-looking camera (ULC) for precise centering. Place the die with low force. ULC image of die Universal Instruments EP&P Magazine 43

44 Precision Slide Top Waffle Pack Feeders Precision Slide Top Matrix Tray Feeder designed to hold either; (12) 2 x 2 waffle packs (3) 4 x 4 waffle packs Feeder top plate slides out beneath the GSM cover line for easy tray replenishing. Occupies 6 feeder slots. 2x2 inch 12 position Precision Slide Top Matrix tray feeder 4x4 inch 3 position Precision Slide Top Matrix Tray Feeder Universal Instruments EP&P Magazine 44

45 Precision Lifter and Custom Top Plate Typical custom top plate (application specific board support) Provides precise registration of the substrate in the z axis Provides a common interface for custom board supports Has integral vacuum generator Applicable with AUER boat handling Precision Lifter Assembly Universal Instruments EP&P Magazine 45

46 Low Force Software and Nozzles Quick venting Replaceable tip Expands placement force range from 20 grams to 2500 grams Prototypes 10 grams Accommodates varying component thickness Universal Instruments EP&P Magazine 46

47 Laser Sub-Assembly Fluxless AuSn soldering Plated or preform Cover gas Heated nest Universal Instruments EP&P Magazine 47

48 Eutectic Die Attach Assembly Stage Preheating Stage Die Attach Station Components enter and are preheated Components are placed into die attach station Place and heat gold / tin preform Ramp up temperature Place and scrub GaAs die Approx 30 sec per placement process time Designed to maintain platform flexibility Universal Instruments EP&P Magazine 48

49 Solder Ribbon Feeder Allows online presentation of solder pre-forms from ribbon solder Can be re-tooled for changes in lengths of preforms Universal Instruments EP&P Magazine 49

50 UV Curing Place and hold component Activate UV lighting while holding component 12 UV LED s built in special nozzle Universal Instruments EP&P Magazine 50

51 GSM Integrated Wafer Feeder Universal developed integrated wafer feeder with off line wafer processing and shuttle delivery of die to GSM for gang pick Release 1 Available NOW Features: Magazine input (up to 25 wafers) Random access to multiple p/n wafers Automatic tool change Pre-stretched wafers for fast wafer change Up to 200 mm wafers Wafer map input or ink dot identification Tact time of 1 die/sec Die size: 1mm - 15mm Bar code identification/tracking of wafers Small foot print (< 4 ft 2 ) Universal Instruments EP&P Magazine 51

52 Area Array Consortium - Optoelectronics Help move optoelectronics packaging from low volume, partially manual approach to the type of automation common in microelectronics packaging. This will require a combination of systems approach to manufacturing design for manufacturability and quality materials and equipment development package standardization process development As in microelectronics, process research will be aimed at physically and mechanistically based understanding Establish hands-on Prototyping for 1st - 3rd level assembly to develop in-depth understanding of requirements for volume manufacturing Universal Instruments EP&P Magazine 52

53 Optoelectronics and Automation Agenda Introduction Market and technology Lasers Automation requirements Universal solutions What s in the future Universal Instruments EP&P Magazine 53

54 Future Directions All Optical Networks Tunable Lasers 40 GBits/sec & 80 GBits/sec Universal Instruments EP&P Magazine 54

55 Optical MEMS Devices Data signals in Backbone are transmitted as photons, but switching is done electronically Requires slow and expensive opto-electronic conversion Great interest in MEMS for optical switches Nortel acquired XROS JDS Uniphase acquired Cronos Corning acquired Intellisense TI DMD used by Astarte Lucent Wavestar Lambda Router 256 x 256 optical fabric (shown) Array of 256 MEMS micromirrors on <1in device Mirrors are electromagnetically addressable Sub-millisecond switching speed Commercial shipments expected in 12/2000 MEMS currently used primarily for accelerometers, ink jet print heads, pressure sensors Design tools from Tanner/Cadence and Microcosm Foundry services from Intellisense, Cronos, Standard MEMS Reference: Prismark Universal Instruments EP&P Magazine 55

56 Opto Transmission System Products Universal Instruments EP&P Magazine 56

57 Summary Optoelectronic market is just beginning Universal s 2001 Consortium includes several optoelectronic activities and initiatives Universal has some immediate offerings and is developing other solutions Universal is committed to be a key solutions supplier in this market Universal Instruments EP&P Magazine 57

58 Contact Information Jacques Coderre Product Manager, Advanced Semiconductor Assembly Division Universal Instruments Corp. (607) Richard Boulanger Vice President, Advanced Semiconductor Assembly Division Universal Instruments Corp. (607) Universal Instruments EP&P Magazine 58

59 Question and Answer Session Access archived Webcasts from EP&P and Universal: 0201 Placement and Process (September 2000) Pin-in-Paste Process (March 2001) Flip Chip Assembly (June 2001) For more information on Technology Seminars sponsored by Universal Instruments, please visit our Web site: Universal Instruments EP&P Magazine 59

60 Advanced Process Training Workshop Series Developed for Process Engineers and Manufacturing Engineers, these workshops provide critical information needed to implement new assembly technologies into manufacturing. Topics Include: Optoelectronics Pin-in-paste 0201 Flip Chip Standard Surface Mount For more information about Universal Instruments Advanced Process Training Workshops, visit Universal Instruments EP&P Magazine 60