Wafer Level Packaging & Bumping A view from a European Service Provider
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1 9 th International IEEE CPMT Symposium on High Density Design, Packaging and Microsystem Integration (HDP 07) 26 th -28 th June 2007 Shanghai, China Wafer Level Packaging & Bumping A view from a European Service Provider Thomas Oppert VP Marketing & Sales oppert@pactech.de
2 Content Overview on Semiconductor Markets 1970 to 2010 Applications and usage/implementation of eless NiAu ENIG UBM History & Now The early days of eless NiAu Licenses & worldwide wafer bumping capacity Pac Tech and eless NiAu now Equipment for eless NiAu Soldering Paste Printing Single Ball Placement Gang (Micro) Ball Placement Summary
3 Overview on Semiconductor Markets
4 Evolution Semiconductor Market Consumer/Wireless Internet Enterprise Military/ Aerospace Government Source: SIA
5 Semiconductor Market 2006 Cell Phone/ mobil 17,00% PC/ Computer 43,70% Wired Comm 7,00% Industrial/ Military 7,30% Consummer 17,20% Automotive 8,70%
6 Products using electroless Ni/Au First for products under very high price pressure (RFID) Meanwhile wide range of applications - ASIC (Sensors) - LCD Drivers - PowerMOS (Automotive) - Protection devices (Passives) CSP s, WLCSP s - Memories and memory modules - Consumer electronics - Mobile Phone - Medical (Ear phone)
7 Worldwide use of Pac Tech eless Ni & solder printing Medical; 10,00% LCD Driver/ ASIC; 5,00% Memory; 5,00% RFID; 20,00% Mobile Phone; 40,00% MOSFET; 20,00%
8 Electroless NiAu History & Now
9 Electroless Ni/Au for Semiconductor Devices A Crazy Idea? 1990 Technically impossible Wrong concept Not reliable No infrastructure Economically not feasible hard to control dangerous / critical Will be never accepted by customer Sounds familiar?
10 Remember: A Crazy Idea? 1886 Technically impossible Wrong concept Not reliable No infrastructure Economically not feasible hard to control dangerous / critical Will be never accepted by customer
11 History of electroless Pac Tech Basic studies & publications in 1985 First active electroless bumped wafer in 1989 Formation of Pac Tech in 1995 Further developments of the eless Ni UBM Pilot production line in 1997 Start of customer qualification & production in Pac Tech Wafer Bumping facilities in Germany, USA, Japan, Malaysia 10x Pac Tech eless NiAu Bumping process licensed and equipment installed worldwide
12 1st Ni Bumps 1990
13
14 more electroless Ni/Au ENIG NOT only for Al, also for Cu pads ENIG UBM for FC and Wire Bonding Eless Ni/Pd/Au for Wire Bond of Power Devices
15 Business Development Installed Equipment for ENIG UBM & Technology Transfer/Licenses of Pac Tech France Germany Telecom. 300 mm Malaysia Q3/ mm Taiwan Q4/ mm Japan Nagase 300 mm Telecom. Growth Japan (ABT) Subcon Korea (STW) LCD-Driver USA Memory 300 mm USA (PacTech) SubCon 300 mm Philippines Telecom. 300 mm USA Power Dev. France Q2/ Year
16 Pac Pac Tech Group Worldwide Wafer Bumping Capacity 2006 Pac Tech GmbH Pac Tech USA ABT ("Pac Tech Japan") <4-8" Wafer> 600k 600k 450k <12" Wafer> 100k 150k Pac Tech GmbH Pac Tech USA ABT ("Pac Tech Japan") Pac Tech Asia <4-8" Wafer> 600k 600k 600k 300k <12" Wafer> 100k 150k - 100k 2008 Pac Tech GmbH Pac Tech USA ABT ("Pac Tech Japan") Pac Tech Asia <4-8" Wafer> 600k 600k 600k 600k <12" Wafer> 100k 150k 150k 150k
17 Wafer Level UBM Electroless NiAu
18 Process Flow - Electroless Ni/Au Bumping Al Pad Cu Pad Zinkating Pd Seed Ni Plating Flash Au Pd Barrier Flash Au Flash Au Thick Au FCB Wire Bonding Wire Bonding
19 Under Bump Metal Process Electroless Plating of Ni/Au Bumps on Al pad 1/2 Backside Coating Pad Cleaning Pad Activation Electroless Nickel Flash Gold Coating Removal
20 Under Bump Metal Process Electroless Plating of Ni/Au Bumps on Al pad 2/2 Backside Coating Aluminum Cleaning Zincate Pretreatment Electroless Nickel Immersion Gold Coating Removal
21 Electroless Ni/Au on Copper Pad Backside Coating Pad Cleaning Pd Treatment Electroless Nickel 300 mm Capability! Flash Gold Coating Removal
22 Electroless Ni/Pd/Au Bumping on Al Backside Coating Aluminum Cleaning Zincate Pretreatment Electroless Nickel Electroless Palladium Immersion Gold Coating Removal
23 Flip Chip Modules for contactless Smart Cards Interconnection: Electroless NiAu with ACF
24 Pacline A mm 10 Plating Systems in the Field
25 Pacline A50 - Capability for parallel processing of 3 carriers with 50 wafers 8 or 3 carriers with 26 wafers 12 - UPH: max. 150 Wafers 8"/hour or max. 78 wafers 12 /hour (5µm Ni/Au UBM) - Thick Au ability for wire bonding reliability - Ni bath control with ConPac 2.0 (bath conditioner) and ConPac control set - Central Computer Control Unit (CCCU) - PLC with Profi Bus system - Additional security tanks for each module and pump system - Design will be adapted to customer s facility - SECS GEM Interfacing - The system fulfils the fire safety standard FM 4910
26 Wafer Level Solder Printing
27 Comparison of Solder Bumping Technologies Evaporated Solder Bump Sputtered UBM + Plating Sputtered UBM + Print (FCT) Electroless UBM (+) (+) Print or Ball Attach C4 Solder Solder Solder Solder Au Ni/Au
28 Stencil Solder Printing Process Flow SnPb37, Lead-free: SnAgCu Electroless Ni/Au Bumping PbSn Solder Paste Printing Reflow Wafer Cleaning Wafer Inspection Pack & Ship
29 Applications for mobile phone GSM Phone: Battery Control Wafer: Si-Ge Technology Protection Devices
30 Solder Printing on 300mm Wafer I/O per Wafer 680 I/O per Chip 225µm pitch 100µm pad size 70µm solder ball height
31 Solder Ball Placement & Laser Reflow
32 Laser Soldering SB 2 -Jet
33 Semiautomatic SB²-SM SB 2 Equipment SB²-Jet LF with R2R Machines sold > 200 pcs SB²-Jet LF Automatic SB²-Jet 300 mm ESD version of SB²-Jet For HGA & HSA Assembly
34 SB 2 -Jet Advantages No tooling Solder ball diameters from 80(60)µm - 760µm Solder alloys: SnPb, SnAg, SnAgCu, AuSn No flux No mechanical stress/contact No thermal stress No additional reflow No cleaning of flux residues Fine pitch applications (110µm/100µm)
35 SB 2 -Applications Wafer Bumping BGA/ CSP Bumping Wafer Level CSP Bumping Rework/ Repair Optoelectronic Packaging SAW, BAW MEMS & 3-D Packaging Hard Disk Drive (HGA, HSA) Camera Modules
36 3D Assembly Design Considerations A B C
37 Fluxless 3D-Ball Placement & Laser Reflow on Flex Suspension for HDD (HGA) Source: Seagate
38 Fluxless 3D-Ball Placement & Laser Reflow on Flex Suspension for HDD (HGA) Silicon stator (non-moving, attached to suspension) Silicon rotor (moving, holds magnet and slider Magnet/ buttom keeper Narrow beam flexure (connects rotor to stator) Read / write transducer Electrical connections to read / write slider Electrical connections to drive coil Suspension Dateiname.ppt 369
39 Gang (Micro) Ball Placement
40 Automatic Gang Ball Placer for Micro Ball Placement 1/2 Cassette to Cassette robot handling f. wafer up to 12 Integrated rework capability 100% yield 2x optical inspection 1st after ball transfer 2nd after repair min ball size 100µm pre- fluxing by printing/spraying UPH 5min/Wafer (8 ) 300 mm Capability! 1st fully auto machine already installed in Japan
41 Gang Ball Placer for Micro Ball Placement 2/2 8 Wafer Pitch 200µm I/O S 100µm solder balls SnAgCu
42 Wafer Level CSP Application eutectic SnPb or lead-free pitches: 180µm 1mm wafer sizes: 4 8 solder ball diameter: µm
43 Solder Ball Transfer by GBP - Ball Pickup Vacuum Solder Ball Bond Tool Mask 1 Vibration
44 Solder Ball Transfer by GBP Ball Placement Solder Ball Bond Tool Mask 2 Flux Wafer UBM 3
45 Ball Drop vs. Ball Transfer Placement Force Gravity only Ball Drop Process Weak solder bump adhesion to UBM due to insufficient flux wetting of solder ball Ball Escape out of dispense unit possible Ball Transfer Process much better fluxing process due to application of additional placement force Ball Escape not possible
46 Summary Overview on Semiconductor Markets Electroless NiAu UBM History & Now Eless NiAu for Al and Cu Eless NiPdAu Soldering Processes Paste Printing Single Ball Placement Gang (Micro) Ball Placement
47 Questions?
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