Product Selection Guide Optoelectronics & Photonics

Transcription

1 OptoBrochure_031416_final_r1_Layout 1 3/14/16 12:29 PM Page 1 Product Selection Guide Optoelectronics & Photonics

2 MACOM Optoelectronics Products to meet the growing demand for data capacity MACOM supports a large portfolio of electronic components, lasers, and photodiodes for optical communications from long haul core networks to FTTx access networks. The portfolio addresses the high performance analog interfaces between electrical and optical domains, and provides solutions to meet the demanding size, power and signal integrity requirements of today s high speed networks which are expanding to meet the continuously growing demand for data capacity. These products include high performance modulator drivers, transimpedance amplifiers, clock/data recovery circuits, APD, PIN photodiodes, and FP and DFB lasers, ROSAs and TOSAs for enterprise and telecom optical systems operating up to 100 Gbps and beyond. For FTTx, MACOM has the broadest portfolio of lasers, laser drivers, limiting amplifiers, APD, PIN photodiodes, and s covering systems from GPON, EPON to XG-PON. TX/RX EML Driver Laser Diode DML Driver 10G PIN Photodiode Limiting MZ Driver (Linear/ Limiting) MZ Driver (Linear/ Limiting) 10G PIN Photodiode Linear GPPO Module Surface Mount Die 100G Client Side 100G Line Side

3 MACOM Optoelectronics Industry-leading optical portfolio drives the future of FTTx, 10G & 100G Networking Markets > 100G DWDM > 100G Ethernet > 10G/40G/100G Datacom and Telecom > PON/FTTH > Wireless Backhaul > Beyond 100G: 200G and 400G Technologies: > Gallium Arsenide (GaAs) > Silicon Germanium (SiGe) > Indium Phosphide (InP) > CMOS > Silicon Photonics (SiPh) Product Lines: > Modulator Drivers > Laser Drivers > Transimpedance Amplifiers > s > Limiting Amplifiers > Lasers > Crosspoint Switches > Silicon Photonic PIC > ROSAs and TOSAs (Optical Sub Assemblies) LONG HAUL 1000s Km >>> >>> METRO s Km >>> >>> DATACENTER <100m-10 Km APD & PIN Diodes Limiting Laser Diode Burst Mode Driver + Limiting Amplifier Burst Mode Laser Driver Burst Mode Post Amplifier Limiting/Linear Laser Diode Laser Driver + Limiting Amplifier EML Driver + Limiting Amplifier Laser Driver + Dual s EML Driver + Dual s Die Die QFN Package QFN Package PON ONU Side PON OLT Side For 100 Mbps to 12 Gbps SFP+/XFP and SFP/CSFP/QSFP+

4 MACOM Silicon Photonics Technology Photonic chipset solutions for optimized power, size and cost Photonic Integrated Circuits (PICs) is an emerging technology that uses crystalline semiconductor wafers as the platform for the integration of active and passive photonic circuits along with electronic components on a single micro-chip. With the necessary expertise, the technology enables innovative solutions utilizing silicon optical circuits and micro-optics, while allowing the optimal integration of control electronics and system packaging. MACOM is focused on integrated silicon microphotonics which uses fine line lithography to realize high density functionality. These technologies combine high performance, low power optical devices with maximum functionality and high packing density. Silicon microphotonics, in particular, brings the benefits of high-density, low-cost and performance scalability, similar to silicon CMOS chip manufacturing. Key Advantages > High functionality covering a variety of devices, including switches, modulators, integrated photodetectors, couplers, biosensors, wavelength combiners and splitters, control and various optical couplers for I/O > Monolithic integration using commercial semiconductor chip foundries enables repeatable, low cost products at scalable volumes > High index contrast for compact optical circuitry > Strong low power optical modulation due to the efficient plasma dispersion effect > High-speed (>50 Gbps) modulation due to speed of carrier transport in silicon diodes > Nanophotonic components - ring resonators, filters > Integrated photodetectors using monolithic germanium integration > Operates in important datacom and telecom wavelengths (O- and C-Bands at 1310 and 1550 nm) Key Applications > 100G/400G Datacom: datacenters and campus applications (to 10 km) > Telecom: metro and long-haul applications (to 100 and 400 km) > Ultra short reach optical interconnects and switches within routers, computers, HPC > Functional passive optical elements including AWGs, optical filters, couplers, and splitters > Radio over fiber transport and backhaul > Transceiver products including embedded optical modules, transmitters/receivers, and active optical cables (AOCs) > Optical signal processing with high performance active elements including VOAs and phase, amplitude and frequency modulators for advanced modulation formats > Military/aerospace/scientific sensor, control, and interconnect application > Optical switch fabrics for communications and testing > Metrology and sensors > Medical applications like DNA, glucose, molecular and cellular analysis sensors > Optical engines combining optics and electronics > Emerging products like 3DICs/integrated optoelectronic chips > Consumer: easy-to-use compact cabling for desktop PC, peripherals, home media servers and networked HDTVs > Professional video, digital signage, digital cinemas, and video recording 4

5 MACOM Evaluation Modules and Reference Design Kits Enhance new product development, reduce costs and optimize time-to-market In addition to the support of our world-class application team, MACOM offers a number of custom reference design kits, evaluation modules (EVM) and design guides which enhance the development of new products, reduce costs and optimize time-to-market. MACOM evaluation modules provide customers with a vehicle to test product features, measure product performance, and help design the product into their application. From backplanes to line cards and optical modules, MACOM reference design kits and EVMs are built to ease the evaluation of our latest solutions into the application environments of our customers and partners. We package these offerings with our extensive GUI support as well. In addition to the EVM module and the required software and user guide schematics of circuit boards and modules, and supporting documents are provided. From low-speed solutions to those operating at 100G and above, MACOM offers hardware expertise and design support to enable innovative, next-generation optical products in a wide variety of markets. Contact the MACOM Sales team to learn more. 5

6 Optoelectronics Datacenter: QSFP28 TOSA: FBT4821AG Driver Driver TOSA: Lasers 127D-25C-LCT11 127D-25C-LCT11 131D-25C-LCT D-25C-LCT11 Drivers MAOM MAOM M37049 ROSA: FBR4102PB Driver Driver Optical MUX Electrical Optical DEMUX Electrical Driver Driver ROSA: Lasers 127D-25C-LCT11 127D-25C-LCT11 131D-25C-LCT D-25C-LCT11 M03102 M37049 Driver Driver Long Haul Metro MATA Coherent Receiver Laser X Y I Q I Q Dual Polarization Polarization Controller 90% Optical Hybrid Quad Channel Drivers MAOM MAOM MAOM MAOM MAOM MAOM MAOM MAOM MAOM MAOM-03404A MAOM-03409B MAOM-03409D MAOM MAOM MAOM-03417B M37040 M37046 DAC DAC DAC DAC ADC ADC ADC ADC DSP Engine Coherent ASIC 6

7 Optoelectronics Fiber Fronthaul CPRI DML Laser 131D-25C-LCT Laser Driver Chipset (Laser Driver + Post Amplifier + DDMI) M02193 Fiber Backhaul SFP28 Long Reach DML Laser 131D-25C-LCT MAOM Driver Optical Laser PD Request more information M02131 DDMI Post Amp Electrical Optical Laser PD Request more information M03002 Tx and Rx Electrical Tx and Rx MASC MASC BOSA-on-Board for PON/FTTx ROSA TOSA GPON Combo Chip GPON Combo Chip M02098 M02099 M02100 M02015 M02016 M02027 M02029 Lasers 131D-02E-VT5TB D-02E-VT5TB D-02E-VT5MB D-02E-VT5TB A-021-AT4GR P-021-ST4GP 131F-021-LT5SB Optical Bidirectional Crosspoints Backplane/Midplane Line Card Switch Card s, Signal Conditioners & Backplane Drivers 6.5 Gbps # Channels M M M M M M M Gbps M M Gbps MAXP SFP SFP+ XFP QSFP+ SFP28 QSFP28 CFP24 CXP NPU/ ASIC NPU/ ASIC Crosspoints 6.5 Gbps # Channels M M M M Gbps M M M M M M Gbps MAXP

8 Optoelectronic & Photonic Applications Drivers, s, and Retimers for Short Reach VCSEL for Datacenter Interconnect Part Max Data Rate Channels Optical Reach Input/Output Package Type Number Description (Gbps) (#) Interface Type (m) Interface and Size (mm) MATA Quad 4 x 28G and 28 4 GS 300 / Die 2 x 3 MATA Quad 4 x 28G and 28 4 GS 300 / Die 2 x 3 MATA Quad 4 x 28G and 28 4 GSG 300 / Die 2 x 3 MALD Quad 4 x 28G VCSEL Driver and 28 4 GS 300 / Die 2 x 3 MALD Quad 4 x 28G VCSEL Driver and 28 4 GS 300 / Die 2 x 3 Drivers and Retimers for Long Reach DML/EML Datacenter Interconnect Data Rate Max Output Max Input/Output Package Type Part Max Channels Voltage Small Signal Interface and Size Number Description (Gbps) (#) (Vpp) Gain (db) (mm) MAOM Linear EML Driver / SMT 4 x 4 x 1.3 MAOM Quad Channel Linear EML Driver / SMT 14 x 9.1 x 2.3 MAOM Linear MZ Modulator Driver / SMT 4 x 4 x 1.3 MAOM Linear MZ Modulator Driver / SMT 4 x 4 x 1.3 MAOM Quad Channel Linear EML Driver / SMT 6 x 9.1 x 1.33 M37047 Four Channel 25G / 28G with EML Driver / CSP 4 x 4.5 M37040 Quad 4 x 28G / LFGA M37046 Quad 4 x 28G / CSP MAOM-37051A Quad channel 25/28 Gbps / SMT 11 x 7 x 1.4 with EML Driver s and Retimers for Long Haul, Metro, and Datacenter Interconnect Data Rate Input/Output Package Type Part Max Channels Transimpedance Bandwidth Interface and Size Number Description (Gbps) (#) (kω) (GHx) (mm) MATA Dual channel linear differential / Die x x MATA Linear SIngle-ended/ Die 1.14 x 1.47 x MO SIngle-ended/ Die 1.52 x 2.22 MO SIngle-ended/ Die 1.57 x 2.66 MO SIngle-ended/ Die 1.57 x 3.41 M37041 Quad 4 x 28G Transmit / LFGA MASC Quad 4 x 28G Transmit / CSP 8 M37049 Quad 4 x 28G Transmit / CSP

9 Optoelectronic & Photonic Applications Client Side and Datacenter DML Drivers and Retimers (LR4, CWDM, PSM4) Data Rate Bias Input/Output Package Type Part Max Channels Transconductance Current Interface and Size Number Description (Gbps) (#) (ms) (ma) (mm) MAOM Quad channel 28 Gbps DML Driver / Die x x 0.1 MAOM Gbps DML Driver / Die x x 0.1 MAOM Gbps Linear DML Driver / Die x x 0.1 M37040 Quad 4 x 28G / LFGA M37046 Quad 4 x 28G / CSP Datacenter: 40G QSFP Part Max Data Rate Wavelength Temp Options Number Description (Gbps) (nm) ( ) Package Type 127D-10G-LCT11-S Die, laser, 10G DFB, nm / +2.5nm, chip on tape Die 129D-10G-LCT11-S Die, laser, 10G DFB, nm / +2.5nm, chip on tape to 85 Die 131D-10G-LCT11-S Die, laser, 10G DFB, nm / +2.5nm, chip on tape Die 133D-10G-LCT11-S Die, laser, 10G DFB, nm / +2.5nm, chip on tape Die Datacenter: 100G QSFP 127D-25C-LCT11 Die, laser, 25G DFB, nm / +2.5 nm, chip on tape to 70 Die 129D-25C-LCT11 Die, laser, 25G DFB, nm / +2.5 nm, chip on tape to 70 Die 131D-25C-LCT11 Die, laser, 25G DFB, nm / +2.5 nm, chip on tape to 70 Die 133D-25C-LCT11 Die, laser, 25G DFB, nm / +2.5 nm, chip on tape to 70 Die B-LCT11 Die, laser, 25G DFB, ±1 nm, chip on tape Die B-LCT11 Die, laser, 25G DFB, ±1 nm, chip on tape Die B-LCT11 Die, laser, 25G DFB, ±1 nm, chip on tape Die B-LCT11 Die, laser, 25G DFB, ±1 nm, chip on tape Die Datacenter: PSM4 40G, 2 km 131F-10I-LCT11-S Die, laser, 10G FP, chip on tape to 85 Die Datacenter: PSM4 40G, 10 km 131D-10G-LCT Die, laser, 10G DFB, WL=±10nm, chip on tape to 85 Die Datacenter: PSM4 100G 131D-25C-LCT Die, laser, 25G DFB, WL=± 10 nm, chip on tape to 70 Die Datacenter: Silicon Photonics 127D-00G-LCT11-20 Die, laser, CW DFB, 20 mw, chip on tape to 85 Die 129D-00G-LCT11-20 Die, laser, CW DFB, 20 mw, chip on tape to 85 Die 131D-00G-LCT11-20 Die, laser, CW DFB, 20 mw, chip on tape to 85 Die 133D-00G-LCT11-20 Die, laser, CW DFB, 20 mw, chip on tape to 85 Die Client Side and Datacenter TOSAs Part Max Data Rate Channels Reach Input/Output Number Description (Gbps) (#) Configuration (km) Interface Package Type FBT4821AG 100G-BASE LR4 TOSA DML + Driver 10 Flex/LC Hermetic FBT4401NH 100G-BASE LR4, OTU EML 10 Flex/LC Hermetic Client Side and Datacenter ROSAs FBT4401NH 100G-BASE LR4, OTU4 ROSA 28 4 PIN + 10 Flex/LC Hermetic 9

10 Optoelectronic & Photonic Applications Drivers for Long Haul Data Rate Max Output Max Input/Output Package Type Part Max Channels Voltage Small Signal Interface and Size Number Description (Gbps) (#) (Vpp) Gain (db) (mm) MAOM Quad Channel 46 Gbps Linear MZ Modulator Driver / SMT 13 x 19 x 2.46 MAOM Quad Channel 46 Gbps Linear MZ Modulator Driver / SMT/GPPO 41 x 29 x 6.4 MAOM Quad Channel 32 Gbps Limiting MZ Modulator Driver / SMT 13 x 19 x 2.46 MAOM Quad Channel 32 Gbps Linear MZ Modulator Driver / SMT 13 x 19 x 2.46 MAOM Quad Channel 32 Gbps Linear MZ Modulator Driver / SMT/GPPO 41 x 29 x 6.4 MAOM Dual Channel 32 Gbps Limiting MZ Modulator Driver / SMT 16.1 x 10.6 x 3.42 MAOM Dual Channel 32 Gbps Limiting MZ Modulator Driver / SMT 10 x 10 x 2.3 MAOM Gbps Limiting MZ Modulator Driver / SMT 14.4 x 7 x 2.3 MAOM Gbps Limiting MZ Modulator Driver / SMT 11.4 x 8.9 x 1.4 Drivers for Metro (CFP, CFP2) MAOM-03404A Quad Channel 32 Gbps Limiting / SMT 14 x 9.1 x 2.3 MZ Modulator Driver MAOM-03409B Quad Channel 32 Gbps Linear / SMT 14 x 9.1 x 2.3 MZ Modulator Driver MAOM-03409D Quad Channel 32 Gbps Linear / SMT 14 x 9.1 x 2.3 MZ Modulator Driver MAOM Quad Channel 32 Gbps Limiting MZ Modulator Driver / SMT 14 x 9.1 x 2.8 MAOM Quad Channel 32 Gbps Linear MZ Modulator Driver / SMT 13 x 9.1 x 2.3 MAOM-03417B Quad Channel 32 Gbps Linear MZ Modulator Driver / SMT 13 x 9.1 x 2.8 M37040 Quad 4 x 28G / LFGA M37046 Quad 4 x 28G / CSP Client Side EML Drivers and Retimers (LR4, ER4) MAOM-37051A Quad channel 25/28 Gbps / SMT 11 x 7 x 1.4 with EML Driver M37047 Four Channel 25G / 28G with EML Driver / CSP 4 x 4.5 MAOM Quad channel 28 Gbps EML Driver / SMT 10 x 10 x 1.4 MAOM Gbps EML Driver / SMT 4 x 4 x2.3 MAOM Gbps EML Driver / SMT 4 x 4 x 1.45 M37040 Quad 4 x 28G / LFGA M37046 Quad 4 x 28G / CSP 10

11 Optoelectronic & Photonic Applications GPON s and Drivers Part Max Data Rate Supply Channels Max Output Number Description (Gbps) Voltage (V) (#) Mod Current (ma) Package M02067 Laser Driver mm QFN M02066 Laser Driver mm BCC+24L M02090 Burst Mode Laser Driver/Limiting Amplifier mm QFN M02098 Burst Mode Laser Driver/Limiting Amplifier mm QFN M02099 Burst Mode Laser Driver/Limiting Amplifier mm QFN + DDMI controller & APD DC-DC Controller M02100 Burst Mode Laser Driver/Limiting Amplifier mm QFN + DDMI controller & EEPROM Data Rate Small Signal Input Input Optical Optical Part Max Transimpedance Bandwidth Overload Referred Noise Sensitivity Sensitivity Number Description (Gbps) Gain (kohm) (GHz) Current (ma) (IRN, RMS na) with PIN (dbm) with APD (dbm) M02027 Multirate CMOS with AGC CONTACT MACOM M02014 AGC Pre-Amplifier M02015 AGC Pre-Amplifier M02024 AGC Pre-Amplifier M02035 Burst Mode OLT M02013 AGC Pre-Amplifier M02025 CMOS with AGC M02129 CMOS with AGC M02036 Burst Mode GPON OLT GPON Part Max Data Rate Wavelength Temp Options Number Description (Gbps) (nm) ( ) Package Type 131D-02E-VCT11-50x Die, laser, 2.5G DFB NFF, small size, chip on tape to 85 Die 131D-02E-VT5TB-50x TO, laser, 2.5G DFB NFF, 2 mm ball lens (6.6mm FL), pinout type B to 85 TO-Can 131D-02E-VT5MB-502 TO, laser, 2.5G DFB NFF, 2 mm ball lens (6.7mm FL), pinout type B to 85 TO-Can 131D-02E-LCT11-50x Die, laser, 2.5G Std DFB, chip on tape to 85 Die 131A-02I-ACT11 Die, APD, 2.5G, chip on tape Die 131A-02I-AT4GR TO, 2.5G APD+ TO to 85 TO P-10I-SCT11 Die, PIN for S, chip on tape to 85 Die 131P-02I-ST4GP TO, PIN+S, 2.5G 2.5 TO-Can EPON Part Max Data Rate Wavelength Temp Options Number Description (Gbps) (nm) ( ) Package Type 131F-02I-KCT11 Die, laser, 2.5G FP NFF, chip on tape to 85 Die 131F-02I-KT5SB TO, laser, 2.5G FP NFF, 1.5 mm ball lens (6.6 mm FL), pinout type B to 85 TO-46 11

12 Optoelectronic & Photonic Applications EPON s and Drivers Part Max Data Rate Supply Channels Max Output Number Description (Gbps) Voltage (V) (#) Mod Current (ma) Package M02067 Laser Driver mm QFN M02066 Laser Driver mm BCC+24L M02090 Burst Mode Laser Driver/Limiting Amplifier mm QFN M02098 Burst Mode Laser Driver/Limiting Amplifier mm QFN M02099 Burst Mode Laser Driver/Limiting Amplifier mm QFN + DDMI controller & APD DC-DC Controller M02100 Burst Mode Laser Driver/Limiting Amplifier mm QFN + DDMI controller & EEPROM Data Rate Small Signal Input Input Optical Optical Part Max Transimpedance Bandwidth Overload Referred Noise Sensitivity Sensitivity Number Description (Gbps) Gain (kohm) (GHz) Current (ma) (IRN, RMS na) with PIN (dbm) with APD (dbm) M02016 AGC Pre-Amplifier l M02026 CMOS with AGC M02028 CMOS with AGC M02038 Burst Mode GEPON OLT G-PON Laser Drivers and s Part Max Data Rate Supply Channels Max Output Number Description (Gbps) Voltage (V) (#) Mod Current (ma) Package M02180 Burst Mode Laser Driver/Limiting Amplifier 12.5 CONTACT MACOM + Rx + DDMI Controller + APD DC-DC Controller & EEPROM M02172 EML Driver mm QFN Data Rate Small Signal Input Input Optical Optical Part Max Transimpedance Bandwidth Overload Referred Noise Sensitivity Sensitivity Number Description (Gbps) Gain (kohm) (GHz) Current (ma) (IRN, RMS na) with PIN (dbm) with APD (dbm) M02139 with AGC Laser Drivers, Post Amplifiers, and s for SFF/SFP/SFP+ Modules (Wireless Mobile, Ethernet, FibreChannel, SONET) Part Max Data Rate Supply Channels Max Output Number Description (Gbps) Voltage (V) (#) Mod Current (ma) Package M02097 LED Driver/Limiting Amplifier , mm QFN M Mbps, Laser Driver mm BCC+24L M02094 VCSEL/FP Laser Driver 2 3.3, mm QFN M02067 Laser Driver mm QFN M02066 Laser Driver mm BCC+24L M02077 Laser Driver/Limiting Amplifier mm QFN M02076 Laser Driver/Limiting Amplifier mm QFN + DDMI controller & APD DC-DC Controller M02170 Laser Driver mm QFN M02171 Dual Loop VCSEL Driver mm QFN M02172 EML Driver mm QFN M02190 DML Laser Driver/Limiting Amplifier , mm QFN with Integrated Tx/Rx M02193 DDMI Controller + EEPROM , mm QFN & APD DC-DC Controller M Gbps, 3.3/5 V Laser Driver/Limiting Amplifier , mm QFN M Gbps, 3.3/5 V Laser Driver/Limiting Amplifier , mm QFN 12

13 Optoelectronic & Photonic Applications Laser Drivers, Post Amplifiers, and s for SFF/SFP/SFP+ Modules (Wireless Mobile, Ethernet, FibreChannel, SONET) cont d Data Rate Small Signal Input Input Optical Optical Part Max Transimpedance Bandwidth Overload Referred Noise Sensitivity Sensitivity Number Description (Gbps) Gain (kohm) (GHz) Current (ma) (IRN, RMS na) with PIN (dbm) with APD (dbm) M02006 AGC Pre-Amplifier M02007 AGC Pre-Amplifier M02009 AGC Pre-Amplifier M02011 AGC Pre-Amplifier M02016 AGC Pre-Amplifier l M02026 CMOS with AGC M02028 CMOS with AGC M02036 Burst Mode GPON OLT M02038 Burst Mode GEPON OLT M02014 AGC Pre-Amplifier M02015 AGC Pre-Amplifier M02024 AGC Pre-Amplifier M02035 Burst Mode OLT M02013 AGC Pre-Amplifier M02025 CMOS with AGC M02020 CMOS with AGC M02139 with AGC M02129 with AGC M02027 Multirate CMOS with AGC CONTACT MACOM Laser Drivers and s for SFP28 (Wireless Mobile, Ethernet, and FibreChannel) Part Max Data Rate Supply Channels Max Output Number Description (Gbps) Voltage (V) (#) Mod Current (ma) Package MASC Dual 28G with integrated laser driver (24G to 26.5G) / m LGA MASC Dual 28G with integrated laser driver (25.5G to 28.1G) / m LGA Data Rate Small Signal Input Input Optical Optical Part Max Transimpedance Bandwidth Overload Referred Noise Sensitivity Sensitivity Number Description (Gbps) Gain (kohm) (GHz) Current (ma) (IRN, RMS na) with PIN (dbm) with APD (dbm) M Gbps 28 CONTACT MACOM 21 CONTACT MACOM 1.4 CONTACT MACOM Mobile (4G-LTE) Part Max Data Rate Wavelength Temp Options Number Description (Gbps) (nm) ( ) Package Type 131F-10I-LCT11-S Die, laser, 10G FP, chip on tape to 85 Die 131F-10I-LCT Die, laser, 10G FP, chip on tape to 85 Die 131F-10I-LT5HC-50x(1) TO, laser, 10G FP, 1.5 mm ball lens with offset, pinout type C to 85 TO D-10I-LT5AC-501 TO, laser, 10G DFB, 1270±10 nm, Asph lens, pinout type C to 85 TO D-10I-LT5AC-501 TO, laser, 10G DFB, 1330±10 nm, Asph, lens, pinout type C to 85 TO-56 13

14 Optoelectronic & Photonic Applications Single Channel 2.5G SFP Part Max Data Rate Wavelength Temp Options Number Description (Gbps) (nm) ( ) Package Type 131F-02I-LCT11 Die, laser, 2.5G FP, chip on tape to 85 Die 131F-02I-LT5LB TO, laser, 2.5G FP, 1.5 mm ball lens (6.35 mm FL), pinout type B to 85 TO F-02I-LT5KB TO, laser, 2.5G FP, 1.5 mm ball lens (5.8 mm FL), pinout type B to 85 TO-56 Single Channel 10G 10 km SFP 131D-10G-LT5RC-S TO, laser, 10G DFB, 2 mm ball lens, WL=±10 nm, pinout type C to 85 TO D-10I-LT5RC-S TO, laser, 10G DFB, 2 mm ball lens, WL=±10 nm, pinout type C to 85 TO-56 Single Channel SFP28 131D-25C-LCT Die, laser, 25G DFB, WL=±10 nm, chip on tape to 70 Die Line Cards Switch Max Data Rate Supply Channels Embedded Embedded Part Number Matrix Size (Gbps) Voltage (#) SerDes Package M x No No 6 mm 40-pin QFN M x No No 6 mm 40-pin QFN M x No No 6 mm 40-pin QFN M x No No 10 mm 72-pin QFN M x No No 12 mm 88-pin QFN M x No 23 mm 484-pin BGA M x No No 27 mm 676 pin BGA M x No No 35 mm 1156-pin FCBGA M x No No 35 mm 1936-pin FCBGA M x Yes Yes 12 mm 88-pin QFN M x Yes Yes 19 mm 324-pin BGA M x No No 3 mm 16-pin QFN M x No No 21 mm 396-pin BGA M x No No 23 mm 480-pin BGA M x No No 27 mm672-pin BGA M x No No 45 mm 1924-pin FCBGA M x No No 45 mm 1924-pin FCBGA M x No No 45 mm 1924-pin FCBGA MAXP x Yes No 15 mm 196-pin BGA 14

15 Package Guide Optoelectronics Crosspoint Switches 3 mm QFN 4 mm QFN 5 mm QFN 10 mm 72-pin QFN 3 mm QFN 4 mm 24-pin QFN 6 mm 10-pin QFN 10 mm 72-pin QFN 12 mm 88-pin QFN Surface Mount Devices (SMD) 17 mm 252-pin BGA 19 mm 324-pin BGA 21 mm 484-pin/1924-pin BGA 23 mm 484-pin/1924-pin BGA 23 mm 404-pin PBGA 27 mm 676-pin BGA 34 mm PBGA 35 mm 1156-pin BGA 35 mm 676-pin TEPBGA 35 mm 1936-pin FCBGA 50 mm 2389-pin BGA Modules Photonics Die TO-Can TO56, TO46 ROSA & TOSA (Optical Sub Assemblies) L PIC, PIC 15

16 Additional product information can be found on our website at Contact our worldwide sales offices, authorized representatives, and industry-leading distributors to request samples, test boards, and application support. All contacts are listed on our website at: M/A-COM Technology Solutions Inc. Lowell, Massachusetts North America Europe India China (Shanghai) MTS-L