Next Generation Transceivers: The Roadmap Component Driver Contributions from Roadmap team. Dominic O Brien Mike Schabel

Transcription

1 Next Generation Transceivers: The Roadmap Component Driver Contributions from Roadmap team Dominic O Brien Mike Schabel

2 Outline New markets Key challenges Potential evolution Recommendations

3 Fibre to the Home (FTTH) Two approaches PON Switched Ethernet Large builds in Korea/Japan Strong government initiatives US starting to grow rapidly Largely private initiative PON architecture Switched architecture

4 FTTH Transceiver Three wavelengths To/from subscriber, Cable TV to subscriber Offers High volume Shorter replacement cycle than telecommunications But ~7 standards ~28 possible transceivers Unique transceiver design Typical triplexer Andjelka Kelic: System Dynamics Modeling of Fiber-to-the-Home, MIT Roadmap project >42 piece parts 3 hermetic packages 4 Active Alignments

5 Consumer Interconnect Applications Digital Home Automotive Ethernet data communications Plastic optical fibre Distance-bandwidth product from 10MHz km to 300MHz km Further developments Low cost transceivers Resonant Cavity LEDs, VCSELs Silicon CMOS receivers Potential for New materials platforms Modest optoelectronic performance Low cost integration CMOS receiver

6 Server Interconnect Most challenging application 4Tb/s 2010, x10 every 5 years Electronic connectors 2Gb/s/mm 2 Optical interconnect Prototype 0.5Tb/s Production 0.05Tb/s Problems Reliability Electrical I/O scaleability Cost (Target 1$/Gb/s) Parallel optics transceiver

7 Emerging Markets Volume Cost requirements Optoelectronic performance Comment FTTH High Low Modest Significant market for telecoms transceiver manufacturers Very complex component 'Digital home' interconnect High Very low Low Possible opportunity for new integrated platforms Automotive High Very low Low High reliability required at low cost Server interconnect High Low Very High Rapidly growing market Extremely difficult technical requirements

8 Generic Challenges: Hybrid vs. monolithic integration MIT modelling Integration lowers manufacturing costs at all volumes (not including R & D costs) Highest performance will likely be Optoelectronics die Electronics IC Hybrid integration Lower performance Monolithic transceiver Hybridised source

9 Generic Challenges: Manufacture Assembly, packaging, and test are key drivers 80 90% of costs Assembly Many different high-quality techniques No standard tools and infrastructure Testing Burn-in and qualification costly Functional test vary widely with standards Packaging Hermetic packaging expensive Local hermetic sealing

10 Generic Challenges: Proliferation M. J. Speerschneider, "Technology and Policy Drivers for Standardization: Consequences for the Optical Components Industry," MS Thesis in Materials Science and Engineering. Boston: MIT, 2004.

11 Solutions to Proliferation Universal transceiver Multi standard device Requires Volume production offsets cost of excess capacity Electrical interface Silicon optoelectronic platform Tx Electronics InP Laser chipset Optical interface RX Electronics

12 Solutions to Proliferation More strict standardisation of optical layer FTTH 28 transceivers to two common o/e e/o blocks Meet link budget/data rate/sensitivity Silicon model of production Set of opto-fabs Process rather than functional standards allow proliferation MSA package E/E Custom electronics O/E E/O Possible standardisation of optical layer

13 Evolution of Transceiver Manufacturing Near term Consensus and some convergence Economies of scale Development of opto-fabs Longer term Proliferation possible as common processes delivered by opto-fabs Fabless opto start-ups, rich applications

14 Conclusions and Recommendations Convergence at all levels required Requires common view of best practice Number of excellent technical options Decisions are largely economic Develop tools and processes to study available options for manufacture given different volumes Input from industrial members Output from neutral 3 rd party Allows best practice to be determined Limits number of processes Standardisation of infrastructure