High Performance Analog Solutions for Digital World ESD & EMI Product Presentation

Transcription

1 ESD & EMI Product Presentation Union Semiconductor Inc.

2 UNION ESD Products

3 50nm ESD Protechtion Area Gate Oxide Thickness Trend: Chip size decreases to minimum Impact: 12.5nm 8nm Gate Oxide Thickness 4.15nm 3nm 1.6nm 1.5um 800nm 350nm 180nm 140nm 90nm 65nm Chip size Gate thickness and chip size (channel length) decreases Maximum gate voltage decreases (e.g. for CMOS090<1.5V static) New processes are optimized for area and performance, NOT for ESD performance! Very ESD sensitive ICs which burn at low clamping voltages IC Area Required IC area to achieve 2KV HBM ESD Protection Additional board level ESD protection for external interfaces becomes a must!

4 Why Use External ESD Protection Devices? Integrating simple protection on complex ICs is expensive and it is low level IC gate oxides are thinner and are more vulnerable to ESD events Protection circuits are most effective when placed farther from the major ICs and closer to the connectors Designing in ESD/EMI protection up front is cost effective.. Avoid re-designs after a failure during certification tests Avoid cost of returned product from end customers USB Protection I/O Line Protection T1/E1 Line Card Protection

5 TVS vs. MOV- ESD Pulse Input: 8KV ESD Pulse, IEC Output: 6.1V TVS Low clamping Voltage (7V) Output: Varistor, VA-C1005-5R5E Conclusion: TVS diodes clamp surges at a lower voltage than a MOV! High clamping Voltage (35V)

6 ESD/Surge Conclusions IC s must be protected because most of them can not withstand ESD conditions higher than 2 kv PCB lay-out is critical to improve TVS protection and reduce parasitic effects (V = L di/dt) Avalanche TVS diodes have several technical advantages over competitive TVS devices Low clamping voltage Low breakdown voltage No change in electrical characteristics after ESD/surge event

7 Standard Capacitance ESD Protectors High Performance Analog Solutions for Digital World P/N Configuration Application Channel 0v Capacitance Package Size (mm) UM5059 I/O Line 1 40 SOD882/FBP2/DFN2 1.0*0.6*0.5 UM5055 I/O Line 1 40 SOD523/SC79 1.6*0.8*0.65 UM5079/Q DC Plug 1 40 SOD882/FBP2/DFN2 1.0x0.6*0.5 UM5075 DC Plug 1 40 SOD523/SC79 1.6*0.8*0.65 SM05/G I/O Line 2 25 SOT *2.4*1.0 UESD54B I/O Line 4 40 SC70-5/SC88A/SOT *2.1*0.95 P0.65 UESD64B I/O Line 4 40 SC89-5/SOT553/SOT *1.6*0.55 P0.5 UESD55B I/O Line 4 40 SC89-6/SOT563/SOT *1.6*0.55 P0.5 UESD6V85CT36 I/O Line 5 40 SC70-6/SC88/SOT *2.1*0.95 P0.65 UESD56B I/O Line 5 40 SC89-6/SOT563/SOT *1.6*0.55 P0.5 UESD57B I/O Line 6 40 FBP1616P6 1.6*1.6*0.6 P0.5 UM5080 I/O Line 1 20 DFN2 1.0*0.6*0.5 P0.65

8 Low Capacitance ESD Protectors P/N Configuration Application Channel 0v Capacitance Package Size (mm) UESD6V8L1F High Speed Data Line 1 20 SOD882/FBP2/DFN2 1.0x0.6*0.5 UESD6V8L4A High Speed Data Line 4 20 SC70-5/SC88A/SOT *2.1*0.95 P0.65 UESD6V8L4B High Speed Data Line 4 20 SC89-5/SOT553/SOT *1.5*0.55 P0.5 UESD6V8L5A6 High Speed Data Line 5 20 SC70-6/SC88/SOT *2.1*0.95 P0.65 UESD6V8L5B High Speed Data Line 5 20 SC89-6/SOT563/SOT *1.5*0.55 P0.5

9 Ultra Low Capacitance ESD Protectors P/N Configuration Application Channel 0v Capacitance Package Size (mm) UM5204 High speed USB 4 2 SC70-6/SC88/SOT *2.1*0.95 P0.65 UM5204 High speed USB 4 2 SC89-6/SOT563/SOT *1.6*0.55 P0.5 UM5204 High speed USB 4 2 TSOP-6/SOT *2.8*1.1 P0.95 UM5304 SIM Card or USB SC70-6/SC88/SOT *2.1*0.95 P0.65 UM5304 SIM Card or USB SC89-6/SOT563/SOT *1.6*0.55 P0.5 UM5304 SIM Card or USB TSOP-6/SOT *2.8*1.1 P0.95

10 UNION EMI Products

11 Filter with Parasitic Inductance R C Z S esr Z 0 L p The effect of parasitic inductance L P becomes noticeable when Z Lp approaches Z C i.e. when 2*[π]*f* L P = 1/(2*[π]*f*C) If C = 50pF, and say L P = 1nH, f C = 500MHz Or for CSP, 2 bumps = 100pH, f C = 5GHz Attenuation will decrease back up to 10dB (ie 3:1) when 3*2*[π]*f* L P = R If R = 33 ohm, this will occur when f C = 1.5GHz -40 Network attenuation db -20 Self-resonance Undsirable response (esr of C is approx R/100) Adequate response f C Frequency

12 Importance of the parasitic inductance Discrete capacitor Leaded package Flip chip BGA DFN S21 (db) DFN package is designed to provide BEST IN CLASS Parasitic inductance enabling better filter performances. Equivalent circuit of discrete capacitor PH 500 PH 100 ph 50 ph Flip Chip DFN 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 Frequency (Hz) C = 33 pf Rs = 0.4 W R S C L S

13 EMI Filters with ESD Protectors P/N Configuration Application Channel Capacitance 0v Package Size (mm) Features UM1002 Audio Line 2 57 SC70-6/SC88/SOT *2.1*0.95 P0.65 UM1002 Audio Line 2 57 TSOP-6/SOT *2.8*1.1 P0.95 UM1002L Audio Line 2 60 SC70-6/SC88/SOT *2.1*0.95 P0.65 UM1002L Audio Line 2 60 TSOP-6/SOT *2.8*1.1 P0.95 UM4411 Data Line Color LCD 4 20 DFN8 1.7*1.3*0.5 P0.4 UM6411 Data Line Color LCD 6 20 DFN12 2.5*1.3*0.4 P0.4 UM8411 Data Line Color LCD 8 20 DFN16 3.3*1.3*0.5 P0.4 UM4401 Data Line Color LCD 4 20 DFN8 2.1x1.6*0.575 P0.5 UM6401 Data Line Color LCD 6 20 DFN12 3x1.6*0.575 P0.5 UM8401 Color LCD Data Line 8 20 DFN16 4x1.6*0.575 P0.5

14 Applications

15 Where is ESD Protection Needed in Handset? Memory Card Display IO Connector Battery Interface USB Interface Keypad Speaker

16 Typical application of bidirectional ESD protection In compliant with IEC level 4 with UESD55B: 8kv(Contact discharge) High Performance Analog Solutions for Digital World Cost Effective Audio ESD Protection 15kv(air discharge) & UESD55B used as 2 lines Bi-direcional Protection N/C N/C /4 W

17 Function : - 2 lines uni directional protection against ESD Benefits : - Easy orientation detection. - Unidirectinal device provide lowest negative breakdown voltage. - IEC level 4 compliant - Smallest semiconductor package on the market - Replace varistor for improvemed performance. - Footprint compatible with Varistor - Exceed varistors performances - RoHs package Package : - Package size 1.4 X1.1X0.5 mm - PCB Area : 1.54 mm² I/O1 1 2 GND 3 GND I/O2 SLP1411 UM5062

18 Function : - 2 lines uni directional protection against ESD Benefits : - Easy orientation detection. - Unidirectinal device provide lowest negative breakdown voltage. - IEC level 4 compliant - Smallest semiconductor package on the market - Replace varistor for improvemed performance. - Footprint compatible with Varistor - Exceed varistors performances - RoHs package Package : - Package size 1.0 x 0.6 mm - PCB Area : 0.6 mm² I/O1 1 2 GND 3 GND I/O2 SOT883 UM5082

19 Union s ESD/EMI Protection Product Offer Data Port Protection Interface UESD6V85CT36 [SC-88 Package] UESD56B [SOT563 Package]

20 SIM and USB Interface Protection High Performance Analog Solutions for Digital World Union s ESD/EMI Protection Product Offer UM5204 [ in SOT-363 or 563 package], ESD protection level greater than15kv, UM5204 can be used to protect power reset clock data line of SIM interface

21 Union s ESD/EMI Protection Product Offer SD Memory Card Protection UESD54B [ in SOT-353 package],esd protection level greater than15kv

22 Union s ESD/EMI Protection Product Offer Multi Media Card Protection UESD54B [ in SOT-353 package],esd protection level greater than15kv

23 Union s ESD/EMI Protection Product Offer Keypad Protection UM5055 [SOD-523] UM5059 [SOD-882] UESD54B [SC-88A] UESD55B [SC-89] UESD56B [SC-89]

24 Package Evolution-Thinner SOD882 I/O 1 I/O 2 UM5059 I/O 1 UM5059 M/P I/O 2 UM5059T FBP 0.52mm max. Thin SOD mm max. Normal mobile phone Slim Phone

25 Union s ESD/EMI Protection Product Offer Power Supply Protection SM05 [SOT-23-3]

26 Bottom Connector Protected Interface Vcc D+ (USB) D-(USB) D1. UM4717 Bottom Connector UM channel filter [100 Ω] C line= 36pF@ 0 Volt 1.6X4.0 mmx 0.575mm UM channel filter [100 Ω] C line= 36pF@ 0 Volt 1.6X3.0 mm X 0.575mm UM channel filter [100 Ω] C line= 36pF@ 0 Volt 1.3X3.3 mmx 0.5mm UM channel filter [100 Ω] C line= 36pF@ 0 Volt 1.3X2.5 mm X 0.4mm.. D8. UM channel filter [100 Ω] C line= 36pF@ 0 Volt 1.6X2.1 mm X0.575mm UM channel filter [100 Ω] C line= 36pF@ 0 Volt 1.3X1.7 mm X0.5mm We are thinner

27 New Generation EMI Filter 2* pitch UM8411 Series 400 microns pitch packages!! LCD I/O 3.3* pitch

28 Advantage vs. Passive Device PASSIVE EMI FILTERS Union QFN 0.00 Devices used on the baord db Fc= 200MHz Innochip samples db k 1.0M 10.0M 100.0M 1.0G f/hz Devoices Union Semi Innochip (ICVE21184E070R100) Passive device on Samsung board 900MHz 1.8GHz >25dB >25dB 7dB 15dB 17dB >30dB Union = Wide & Deep Frequency Rejection

29 LCD Monitor Protection UM5204 UESD6V85CT36 UESD56B UM8401 UM6401 UM4401 UM5204 UM5304 UM5204 UM5304 UM5204 UM5304 UM5204 UM5304 UESD55B UESD54B UM8401 UM6401 UM4401

30 portable medical device ESD Protection

31 POS Card Reader Card Reader ESD Protection SM05(SOT-23-3;2line ESD LCD LCD ESD Protection UESD54B(SC-70;4 line) UESD64B(SC-89;4 Line) UESD6V85CT36(SC-70;5 Line) UESD56B(SC-89;5 Line) UESD57B(6 Line) Bar Code Reader Printer ESD SIMCard Low capacitance ESD Protection n*4 LINE TVS Array UM5204(4 Line) (SOT-23/SC-70/SC-89) KEYPAD ESD Protection 4*4 LINE TVS Array UESD54B(SC-70;4 Line UESD64B(SC-89) USB USB Low capacitance ESD Protection UM5204(4 Line) (SOT-23/SC-70/SC-89)

32 PC Protection UM8401 UM6401 UM4401 UM5204 UM5204 UM8401 UM5204 UM5204 UM5304 UM5304 UM6401 UESD56B UM5304 UM5304 UESD55B UM4401 UESD55B UESD54B UESD54B

33 Union s ESD/EMI Protection Product Offer LVDS Protection UM5204 [ in SOT-363 or 563 package],esd protection level greater than15kv Application:LCD Hub Printer

34 Union s ESD/EMI Protection Product Offer S-Video/Audio Protection UM5204 UESD55B Application:NB Motherboard Audio/Video Card

35 DVI/HDMI Interface Protection High Performance Analog Solutions for Digital World Union s ESD/EMI Protection Product Offer UM5204 UM5204 Application:HDTV Monitor DVD