Technical Note DDR2 Package Sizes and Layout Requirements

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Laurel Higgins
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1 echnical ote 2 ackage Sizes and ayout equirements : 2 ackage Sizes and ayout equirements Introduction Introduction 2 breaks new ground in many areas, including its creativity in packaging solutions his new technology will be offered in several configurations with many new densities 2 s life expectancy is predicted to span several generations of process technology, and a majority of memory users would like to see a trend that moves toward smaller package sizes herefore, the oint lectron evice ngineering ouncil has defined a packaging guideline that enables optimal packaging solutions over the complete life span of 2 products oard ayout: hat oard esigners ust now revious technology supported x16, x8, and x4 in one common footprint for SO or nder the old paradigm, each of the densities and configurations on 1 was compatible with the single standard 66-pin SO package this held true on the standard 60-ball package as well he electrical array accommodated all densities and configurations he 4x and x8 configurations were a subset of the x16 configuration, which made this work particularly well See igure 1 on page 2 his allowed the board designer to utilize one common footprint for all densities and configurations 2 s x16 device has a different ballout from the x4/x8 array he early 2 x16 package may include up to 92 balls, but the x4/x8 package might only have 60 balls with a different ball array herefore, in order to be compatible with all vendors, densities, and future package options, it is absolutely critical for the designer to understand both the complexity of the new 2 devices and the multiple layout combinations : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved roducts and specifications discussed herein are for evaluation and reference purposes only and are subject to change by icron without notice roducts are only warranted by icron to meet icron s production data sheet specifications ll information discussed herein is provided on an as is basis, without warranties of any kind

2 -47-08: 2 ackage Sizes and ayout equirements Introduction igure 1: eneric 1 ackage Solution x16 x16 ssq Q4 Q5 Q6 ssq Q7 x Q8 ata footprint for x16 configuration Q9 QS # 9 7 Q4 Q6 QS # x4 S# S# Q5 Q in SO x Q Q6 Q5 Q4 QS # all op iew # S# S# x Q9 Q8 Q7 Q6 Q5 Q4 ata footprint for ote: or 1, all densities and all configurations utilize the same footprint: 66-pin SO or 60- ball x4 3 x8 x8 configuration which is a subset of the x16 configuration ata footprint for x4 configuration which is a subset of the x8 configuration x4 QS # 9 7 # S# S# 3 : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved

3 -47-08: 2 ackage Sizes and ayout equirements Introduction 2 ackages: efined by nlike previous memory technologies, all 2 devices will be offered only in packages, and there are different ball assignments for the different packages has defined larger package sizes with support balls for the earlier 2 product densities and smaller package outlines without support balls for a future migration path his technical note identifies the different package families and electrical connections critical to the layout aspects of 2 dditionally, it discusses the common landing pattern a pad array that can accommodate the footprints for all -approved 2 devices all rid rrays and ackage Sizes ithin the working committees of there have been four primary package variations defined for 2 S he comprehensive sets of drawings are available at wwwjedecorg ccess the drawings through > -11 committee > O-207 profile hese four variations include two families of packages one set with support balls outrigger balls that allows for a maximum package size of 21mm x 125mm and one set without support balls that advocates smaller footprints See igure 2 for simplified ball arrays and package variations efore beginning any 2 board layout work, the designer must identify the target devices and determine how this may affect placement and routing If more than one configuration, vendor, or density might be utilized, the package size could vary greatly and additional landing pads may be required igure 3 on page 4 illustrates the common landing pattern in use with a variety of package options igure 2: ariations of the O ackages op iew 92-all 21mm 84-all 18mm 68-all 21mm 60-all 15mm 125mm 125mm 125mm 125mm ackage O-207 ariation -z -z -z -z umber of otal alls umber of Support alls aximun Size in mm x 21 x x x x 125 : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved

4 -47-08: 2 ackage Sizes and ayout equirements Introduction igure 3: xample lacements of ypical ackages Sizes on the ommon anding attern 84-all 8mm x 14mm 84-all 8mm x 16mm 92-all 84 balls 8 outriggers 11mm x 19mm 60-all 8mm x 12mm 68-all 60 balls 8 outriggers 8mm x 16mm 16mm 96 ads 123mm x 219mm epresents open pad on epresents populated solder ball on component ote: nderstanding the all rray odule outline for reference only he 60-ball and 68-ball packages are offset by 16mm in the x-direction he optimal device package would be very small with the least amount of electrical connectors/solder balls possible owever, due to larger 2 die sizes of the first density, this may not be achievable he first generations of higher density parts typically have a larger die size and may require the package with outrigger balls In the x16 configuration with a package size larger than 18mm x 125mm, two outrigger balls have been added to each corner of the array his provides the required mechanical strength to securely mount the device to the enerally, if the overhang of the package is over 3mm, support balls are recommended efer to able 1 on page 5 for 2 maximum package dimensions he electrical array of the 84-ball package is identical to that of the larger 92-ball device but without the outriggers, ensuring a smooth transition to smaller packages because routing changes are unnecessary igure 4 on page 5 shows the compatibility of these two x16 packages ikewise, for the x4/x8 package there are two options, one with support balls and one without support balls he larger 68-ball package for the x4/x8 configuration, which includes outrigger balls and has the same electrical array as the smaller 60-ball package See igure 5 on page 6 for more details : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved

5 -47-08: 2 ackage Sizes and ayout equirements Introduction able 1: 2 ackage imension mm ote: ength idth ackage ax ax omment 92-all -z Includes support balls 84-all -z all -z Includes support balls 60-all -z hough the O-207 document allows a maximum package width of 125mm, most based module designs only support a maximum package width of 123mm igure 4: ad ayout and omparison of 92-all -z vs 84-all -z omponents Only 92-all -z 21mm x 125mm x16 onfiguration Only 84-all -z 18mm x 125mm 4 2 Q6 Q4 Q # 9 4 QS 0 QS S# 1 5 /QS# Q8 /QS# # S# Q7 Q5 O 4 2 Q6 Q4 Q # 9 4 QS 0 QS S# 1 5 QS#/ Q8 QS#/ # S# Q7 Q5 O op iew : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved

6 -47-08: 2 ackage Sizes and ayout equirements ommon anding attern igure 5: ad ayout and omparison of 68-all -z vs 60-all -z omponents Only 68-all -z 21mm x 125mm x4/x8 onfiguration Only 60-all -z 15mm x 125mm,QS#/,Q6,/QS,Q4 # QS#/ QS,Q7,Q5 # O S# S# ,Q6,Q4,QS#/ 7 2,/QS # 9 4 QS S# 1 5 QS#/ # S# 8 3,Q7,Q5 O op iew ommon anding attern ayout ompatibility imensional equirements t first glance, it appears that all packages and all ball arrays are very similar, and routing should be easy as long as it is designed for the worst-case x16 configuration owever, if the board design has been routed for a 92-ball array, the 84-ball array will fit by default; likewise, if the design is routed for a 68-ball array, the 60-ball array will fit layout that needs to accommodate all packages and all configurations requires a special landing pattern with additional pads has defined a common landing pattern for use with the standard modules urrently, there are two variations which support the different component length requirements the SOI/I and the I solution he SOI/ I version allows for a slightly longer package size than the I option hese two variations of the provide layouts that accommodate most vendors, densities, and configurations for 2 components he SOI/I accepts x4, x8, and/or x16 components up to 21mm in length : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved

7 -47-08: 2 ackage Sizes and ayout equirements ommon anding attern he I allows a 21mm x4/x8 component, but only 196mm for x16 components ue to module space constraints, both have a maximum package width of 123mm igure 6 and igure 7 reflect the dimensional aspects of the as utilized on the SOI/I and I standard gerber files igure 6: I/SOI s Overall imensions 92-all -z or 84-all -z package 226mm ommon anding attern allows up to a 21mm x4, x8, or x16 component Q6 Q4 Q # 9 4 QS 0 QS S# 1 5 /QS# Q8 /QS# # S# Q7 Q5 O ,Q6,Q4,QS#/ all -z or 60-all -z package,/qs # 9 4 QS S# 1 5 QS#/ # S# 8 3,Q7,Q5 O * 33 x4, x8, x16 common die or x16 only component * * op iew x4, x8, only component 33 otes: 1 idth dimensions are not to scale but have a 123mm maximum 2 he x16 package is aligned to the top and the x4/x8 is aligned to the bottom of the : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved

8 -47-08: 2 ackage Sizes and ayout equirements ommon anding attern igure 7: I s Overall imensions Q6 Q4 92-all -z or 84-all -z package Q # 9 4 QS 0 QS S# 1 5 /QS# Q8 /QS# # S# Q7 Q5 O mm ommon anding attern allows up to a 21mm x4, x8, or a 196mm x16 component ,QS#/,Q6,Q all -z or 60-all -z package,/qs # 9 4 QS S# 1 5 QS#/ # S# 8 3,Q7,Q5 O * x4, x8, x16 common die or x16 only component 33 * * 33 op iew x4, x8, only component lectrical equirements otes: 1 idth dimensions are not to scale but have a 123mm maximum 2 he x16 package is aligned to the top and the x4/x8 is aligned to the bottom of the It is very important to realize that due to different electrical arrays, each package option has more or less rows ecause of this, the row identification of the may not match that of each individual device variation or example, pad 7 in the is ss, but ball 7 on the 84-ball package is address o simplify simulation when using the icron IIS models, the board designer has the option of utilizing the nomenclature for the device 7 = address or the nomenclature of the 7 = ss s a solution, the incorporates all pads from all ball arrays x4, x8, and x16, including those with or without the outriggers his means that a 96-pad array, for example, can accommodate any of the four package types See igure 8 on page 9 : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved

9 -47-08: 2 ackage Sizes and ayout equirements ommon anding attern igure 8: xploded iew of lectrical attern of ommon anding attern x16 ommon anding attern x4 and x QS# 4 QS 5 Q9 Q QS# /QS QS# Q6 QS Q7 Q6 /QS QS Q7 Q4 Q5 op iew Q4 Q5 # # O # # O S# S# S# S# he electrical array of the exists within row through row, and the outrigger pads are located at rows,, and or the x16 option, rows,,, and provide the upper data byte; for the x4/x8 options, the pads on rows,, and are no connects, and row provides additional power/ground pins : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved

10 -47-08: 2 ackage Sizes and ayout equirements ommon anding attern able 2: ultifunctional ads on the ad ocation x4 x8 x16 1, 9, 2, 8, 1, 3, 7, 9 Q8 5 1, 9, 1, 9 Q4 Q7 Q4 Q7 2 QS 3 QS# 3 7 QS QS# 2, 8, 1, 3, 7, 9, 2, 8 Supply otes: 1 on 68-ball package, not applicable on 60-ball package ad sage hen a 68-ball package is placed on the, it is important to note that there are two outrigger balls and 9 that may be connected to supply pads on the 1 and 9 See able 3 and igure 9 below for a detailed example able 3: Special-se ads on the by package type ad sage ad ocation 92-all -z 84-all -z 68-all -z 60-all -z 1 ot pplicable 9 ot pplicable igure 9: Outrigger alls ay onnect to ower alls on ower pins on the ommon anding attern ower pins on the x16 package pins on the 68-ball x4/x8 package QS#/ 84-all -z 18mm x 125mm 4 2 Q6 Q4 Q9 1 QS 0 QS QS# Q8 QS# 5 3 Q7 Q5 68-all -z 21mm x 125mm op iew : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved

11 : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved igure 10: Showing lacement of ll ackage Options 4 2 Q6 Q4 Q all -z 18mm x 125mm 1 # 9 4 QS 0 QS S# 1 5 QS#/ Q8 QS#/ # S# Q7 Q5 O ote: 4 2 Q6 Q4 Q all -z 21mm x 125mm 1 # 9 4 QS 0 QS S# 1 5 /QS# Q8 /QS# # hese pads are only used by the x16 configuration 84-ball or 92-ball package S# Q7 Q5 O ommon anding attern op iew ss ssq QS# 4 ssq QS ssq 5 Q9 Q8 2 ssq 1 0 ssq 3 ss ssq QS# Q6 ssq QS Q7 Q4 ssq ssq Q5 ss # ss S# # S# O ss ss efer to individual data sheet for specific pin out,qs#/,q6,q all -z 21mm x 125mm,/QS # 9 4 QS S# 1 5 QS#/ # S# 8 3,Q7,Q5 O,QS#/,Q6,Q all -z 15mm x 125mm,/QS # 9 4 QS S# 1 5 QS#/ # S# 8 3,Q7,Q5 O : 2 ackage Sizes and ayout equirements ommon anding attern

12 -47-08: 2 ackage Sizes and ayout equirements ommon anding attern able 4: ross-eference of Signal ame/ocation to ackage all ocation Signal ame ad ocation 92-all -z Individual ackage ocations 84-all -z 68-all -z 60-all -z S# # S# /QS 3 /QS Q Q4/ 1 Q4/ Q Q5/ 9 Q5/ Q Q6/ 1 Q6/ Q Q7/ 9 Q7/ Q Q QS 7 7 QS 7QS 7 7 QS# 8 8 /QS# 8 /QS# 8 QS#/ 8 QS#/ : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved

13 -47-08: 2 ackage Sizes and ayout equirements ommon anding attern able 4: ross-eference of Signal ame/ocation to ackage all ocation ontinued Signal ame ad ocation 92-all -z Individual ackage ocations 84-all -z 68-all -z 60-all -z /QS /QS O QS QS# 8 8 /QS# 8 /QS# : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved

14 -47-08: 2 ackage Sizes and ayout equirements onclusion able 4: ross-eference of Signal ame/ocation to ackage all ocation ontinued Signal ame ad ocation 92-all -z Individual ackage ocations 84-all -z 68-all -z 60-all -z # onclusion ayout for 2 designs is easily managed once the 2 package options are understood Options include package-size variation, uniquely-defined ballout/electrical arrays, and required multiple-use pads for supporting configurations ecause of the diverse options available with 2, a defined common landing pattern provides the designer with maximum layout flexibility y using the, a printed circuit board can accommodate all 2 device configurations and will be compatible with most package options, regardless of vendor or future die revisions or additional information or the latest 2 data sheets, please refer to icron s eb site at wwwmicroncom/products 8000 S ederal ay, O ox 6, oise, I , el: prodmktg@microncom wwwmicroncom ustomer omment ine: icron, the logo, and the icron logo are trademarks of icron echnology, Inc ll other trademarks are the property of their respective owners : 09005aef815d7274/Source: 09005aef816ed2fc icron echnology, Inc, reserves the right to change products or specifications without notice 4708fm - ev 11/ icron echnology, Inc ll rights reserved

Technical Note. Maximize SPI Flash Memory Design Flexibility With a Single Package. Introduction

Technical Note. Maximize SPI Flash Memory Design Flexibility With a Single Package. Introduction Technical Note Maximize SPI Flash Memory Design Flexibility With a Single Package TN-25-08: Maximize SPI Flash Memory Design Flexibility Introduction Introduction This technical note discusses how a single