The Ascendance of Advanced Packaging: The Future is Now. Byong-Jin Kim I Sr. Director and RD Department Manager, Amkor Technology Malaysia.

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2 The Ascendance of Advanced Packaging: The Future is Now Byong-Jin Kim I Sr. Director and RD Department Manager, Amkor Technology Malaysia.

3 Market Dynamics Market Trends Package Opportunities Summary

4 Economics of Packaging Today

5 Global Semiconductor Outlook Continued growth.. Moore s Law extends Mobility Automotive IoT through a connected world But, greater need for advanced packages Advanced SiP Heterogeneous integration

6 Advanced Packaging: Must Pay to Play Developing & manufacturing new package platforms is expensive Requires a high degree of engineering expertise Requires ability to invest in new ideas Requires perpetual funding in R&D Adding new blocks of capacity expensive challenging ROI

7 Economics of Business Today Changing competitive environment Tier 1 OSATs dominate in technology Entry of foundry Suppliers upward ambition Pace of change accelerating! Forcing all in mentality

8 Market Trends

9 Major Package Trends Mobility IoT Automotive HPC / Networking Ultra Thin, Small Miniaturization Reliable, AEC-006 Performance Integration, SiP Integration Integration, SiP Integration 5G Secure 5G Thermal, Power Envelope tracking Power / Connected ADAS / Connected A.I. / A.R. A.R. / Streaming Home/Factory/Auto Infotainment / ECU Data Center/SiPHO

10 Key Market Segments Driving Packaging Technology Mobile Low ~80 packaged cost Flip die Chip WLCSP opportunities / Fan Out MEMS & Sensors Substrate SiP Wafer SiP Consumer/IoT Low cost Flip Chip WLCSP MEMS & Sensors Substrate SiP Automotive ~100 MEMS packaged & Sensors die opportunities Substrate SiP HPC Substrate SiP Wafer SiP Choices narrow as product becomes more complicated

11 Mobile Market Growth

12 Smartphone Segments Low-end Mid-end High-end Model Name Lenovo K3 Note OPPO R9S Apple iphone 7 Release Date Mar Oct Sep Price ~$X ~$2X ~$4X AP Spec Qualcomm Snapdragon MediaTek ~80 packaged MT6752 die opportunities Apple in high A10end smartphone 625 # of PKGs Source Amkor Teardown Amkor Teardown Amkor Teardown

13 Technology in the Mobile Market Segments AP/BB, Standalone AP or BB RF Connectivity Codec PMIC Sensor SoC Peripherals fccsp fccsp fccsp LCCSP (ETS, MSP) fccsp-hybrid TMV PoP WLCSP WLCSP WLCSP 5s WLCSP MEP/Fan-In PoP WLFO WLFO WLFO SWIFT SiP SiP

14 Wafer Level Packaging Smartphones Driving wafer-level packaging Phones getting thinner Number of WLFP per phone increasing WLP proliferating into other applications and markets

15 Number of SiP Packages Increasing RF Related Packages: Power amplifier, front-end module, antenna switch and Wi-Fi 2G 3G 4G Product Nokia 1800 ZTE Z Phone Samsung Galaxy S7 Release Date Nov Sept Feb Total Number of SiPs 1 2 8

16 5G Requires Massive Filtering # of Supported Bands 3G LTE 5G

17 Automotive ICs Electronic value added to vehicles estimated at 40% and increasing 2 with ~100 packaged die opportunities in high end automobiles Camera Modules Body Systems Info-Center MEMS & Sensors Safety Systems

18 2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center in World = China Telecom ~10M sq.ft. with 150 MW power requirement Source: Finisar OFC 2016

19 High Performance Computing & Networking More Devices More Applications More Data Data needs to be accessible always and in real-time 5G Edge Computing Advanced SiP / H.I GE Hyperscale Data Centers 2.5D TSV 10G/40GE Data Centers, Enterprise fcbga WLAN WiFi, LTE, Small Cell SiP

20 Next Level of Package Integration

21 The Big 5 Packaging Platforms Chip Scale Packaging Flip Chip MEMs System in Package: SiP Adv HI Wafer Laminate Laminate, Leadframe or Wafer Laminate Wafer & Laminate Module

22 Flip Chip Technologies A mature technology with focus on lowering cost The best choice for larger single die & big body packages Enables SiP packaging

23 MEMS IoT, wearables & industrial SOIC, QFN & laminate Low power, form factor & cost Sensor fusion A step into SiP System & functional integration

24 SiP Requires Advanced Packaging Capabilities Small Form Factor Passive comp. /IPD/Embedded Reference Design Side by Side Stacked POSSUM Cavity Embedded & Conformal Shielding PoP. H F2F 3D-WLFO Benefits Antenna, Crystal, SAW/BAW Filters 2.5D/3D Leadframe

25 Advanced SiP (Wafer-based Packaging) Provides very best in performance Thinnest form factor Ultimate in: Power Electrical Thermal

26 Wafer Level Packaging Evolution to Fan Out Bumping WLCSP WL-IPD Wafer Level Products Fan Out MEMS HD Fan Out on Subst HD Fan Out SWIFT WL MEMS Fan Out Fan Out SiP

27 Fan Out Package Evolution to Advanced Integration Miniaturization Integration Performance Reliability Cost Low Density FOWLP Limited scalability High Density FOWLP Better scalability, 3D compatible & extends to SiP Adv Wafer SiP Logic-Memory or Logic-Logic Fan-out module attach to substrate

28 Summary Technology Pace has Accelerated

29 Mobility IoT Automotive HPC / Networking Ultra Thin, Small Heterogeneous Integration is PRIMARY focus Miniaturization Reliable, AEC-006 Performance Integration, SiP Integration Integration, SiP Integration 5G Secure 5G Thermal, Power Envelope tracker Power / Connected ADAS / Connected A.I. / A.R. A.R. / Streaming Home/Factory/Auto Infotainment / ECU Data Center/SiPHO

30 Packaging the Future Economics of Packaging Requires intelligent growth & investments Mobility, IoT, Automotive & Networking Biggest market drivers for next 5-10 years Best Solution Innovative Technologies Enabling more functionality and offering higher levels of integration is a clear focus

31 Thank You Acknowledgements: Ron Huemoeller, Corporate Vice President, WWR&D and Technology Strategy.