Single In-line Memory Module (SIMM)

Transcription

1 Single In-line Memory Module (SIMM) This page is maintained by Thomas Unger and part of the Amiga computers related kickstart archives. All brands, trademarks and copyrights on this page are owned by their respective owners. Last updated: DRAM-Chip-to-Module-Size-Correlation Single In-line Memory Modules (SIMM) are available as 30-pin modules with 8Bit data width (with parity: 9Bit) or 72-pin modules with 32Bit data width (with parity: 36Bit). The data capacity of a module is given in MegaByte (1 MegaByte= 1 MByte= 1 MB) and 1 Byte is eqivalent to a data width from 8 Bit. Small Outline J-Lead (SOJ) Thin Small Outline Package Type II (TSOP Type II) Common used packages of the soldered DRAM chips are Thin Small Outline Package Type II (TSOP Type II) or Small Outline J-Lead (SOJ) 30-pin modules are available in 256kB, 1MB, 2MB, 4MB, 8MB and 16MB with or without parity and 2, 4 or 8 data chips per module. Normally the chips are placed one-sided only. 72-pin modules (also called PS/2) are available in 1MB, 2MB, 4MB, 8MB, 16MB, 32MB, 64MB and 128MB with or without parity in both EDO and FPM type and 2, 4, 8 or 16 data chips. The chips are placed one-sided or on both sides. Looking at the number of pins on each individual data chip on the module can give you an idea of the data capacity of the chips and thus the module. Remember the Number-of-Pins-to-Data-Capacity-per-Chip-Correlation: A module with 8 chips in SOJ-package and each 24 pins in 4 sets of 6 pins (--> 16MBit Chip) has a data capacity from 16MByte because 16MBit x 8 Chips = 16MByte 8Bit/Byte and a module with 4 chips in TSO-package and each 32 pins in 4 sets of 8 pins (--> 64MBit Chip) has a data capacity from 32MByte because 64MBit x 4 Chips = 32MByte 8Bit/Byte

2 This foto (found somewhere on the Internet) shows a very rare item: a 30-Pin SIM- Module with a data capacity from 16 MByte. It is difficult to read the part number (maybe xx16100), but the memory chips with 24 pins in 4 groups to 6 pins allow the identification. The charts below provide information for common Chip-to-Module-Size-Correlation. The number of pins per chip relates to common TSOP Type II- or SOJ- package with each 4 sets of pins: 30-pin SIMM Organization Data Capacity # Pins # Chips (# Pins per Data Chip) Parity 256kx8 256kByte 30 2 or 8 NO 256kx9 256kByte 30 3 or 9 YES 1Mx8 1MByte 30 2 (20) or 8 (20) NO 1Mx9 1MByte 30 3 or 9 YES 2Mx8 2MByte 30 4 (20) NO 2Mx9 2MByte 30 6 YES 4Mx8 4MByte 30 2 (24) or 8 (20) NO 4Mx9 4MByte 30 3 or 9 YES 8Mx8 8MByte 30 4 (24) NO 8Mx9 8MByte 30 6 YES 16Mx8 16MByte 30 8 (24) NO 16Mx9 16MByte 30 9 or 12 YES 72-pin SIMM Organization Data Capacity # Pins # Chips (# Pins per Data Chip) Parity 256Kx32 1MByte 72 2 (20) or 8 (20) NO 256Kx36 1MByte 72 9 or 12 YES 512kx32 2MByte 72 4 (20) or 16 (20) NO 512kx36 2MByte 72 6 or 18 or 24 YES 1Mx32 4MByte 72 2 (24) or 8 (20) NO 1Mx36 4MByte 72 3 or 9 or 12 YES 2Mx32 8MByte 72 4 (24) or 16 (20) NO 2Mx36 8MByte 72 6 or 18 or 24 YES

3 4Mx32 16MByte 72 2 (32) or 8 (24) NO 4Mx36 16MByte 72 9 or 12 YES 8Mx32 32MByte 72 4 (32) or 16 (24) NO 8Mx36 32MByte 72 6 or 18 or 24 YES 16Mx32 64MByte 72 8 (32) NO 16Mx36 64MByte 72 9 or 12 YES 32Mx32 128MByte (32) NO 32Mx36 128MByte or 24 YES 2. Some Examples Chip name: HYB514100BJ-60, Number of chips on module: 9, Number of pins: 30 HYB BJ -60 HYB designates a Siemens device, the 51 designates a 5V device, the 4 designates a 4MBit chip, the 1 designates 1 bit data width, the 00 designates a FPM device and least the -60 indicates the speed of 60ns. The chip is thus 4MBit (4Mx1) 60ns FPM. If there are 9 such chips on the 30pin SIMM module, then it is 4Mx1x9=4Mx9. This is a 4 MByte 30pin FPM module with parity. 1st Chip name: upd Number of chips on module: 2 and 2nd Chip name: upd , Number of chips on module: 1, Number of Pins: 30 The upd denotes it is a NEC device Data chips: upd The 17 designates a 16 MBit chip with 2k refresh. The 4 designates 4 bits data width. The 00 designates a FPM device. The -60 indicates a speed of 60ns. The data chip is thus a 16 MBit (4Mx4) FPM 60ns device.

4 Parity chips: upd The 4 designates a 4 MBit chip The 1 designates 1 bit data width. The 00 designates a FPM device. The -60 indicates a speed of 60ns. The parity chip is thus a 4 MBit (4Mx1) FPM 60ns device. If there are 2 data chips and 1 parity chips on the module, then we have 4Mx4x2 + 4Mx1x1 = 4Mx8 + 4Mx1 = 4Mx9. This is a 4 MByte 30pin FPM module with parity. Chip name: MCM , Number of chips on module: 8, Number of pins: 72 MCM The MCM designates a Motorola device. The first 4 designates a 4 MBit chip and the second 4 designates 4 bits data width. The 00 designates a fast page device and least the -70 indicates a speed of 70ns. The chip is thus 4 MBit (1Mx4) 70ns FPM. If there are 8 such chips on the 72pin SIMM module, then it is 1Mx4x8=1Mx32. This is a 4 MByte 72pin FPM module with no parity. Chip name: MB , Number of chips on module: 2, Number of Pins: 72 MB The MB designates a Fujitsu device. The 18 designates a 16 MBit chip with 1k refresh and the 16 designates 16 bits data width. The 5 designates an EDO device. The -70 indicates a speed of 70ns. The chip is thus 16 MBit (1Mx16) 70ns EDO. If there are 2 such chips on a 72pin simm module, then it is 1Mx16x2=1Mx32. This is a 4 MByte 72pin FPM module with no parity. Chip name: HY , Number of chips on module: 16, Number of Pins: 72

5 Front view Back view HY The H5M designates a Hyundai device The first 4 designates a 4 MBit chip. The second 4 designates 4 bit data width. The 00 designates a FPM device. Least the -6 indicates a speed of 60ns. The chip is thus 4 MBit (1Mx4) 60ns FPM. If there are 16 such chips on a 72pin SIMM, then it is 2x1Mx4x8=2Mx32. This is a 8 MByte 72pin FPM module without parity.

6 Dynamic Random Access Memory (DRAM) This page is maintained by Thomas Unger and part of the Amiga computers related kickstart archives. All brands, trademarks and copyrights on this page are owned by their respective owners. Last updated: DRAM Package Information DRAM stands for Dynamic Random Access Memory. The charts below provide information for major packages of DRAM chips. Dual-in-line Package (DIP) Zig-Zag-in-line Package (ZIP) Small Outline Package (SOP) Shrink Small Outline Package (SSOP) Thin Small Outline Package (TSOP) Small Outline J-Lead (SOJ) 2. How to decrypt the OnChip Code In the late 1980s the most common DRAM types were PM (Page Mode) and FPM (Fast Page Mode). In early 1990s the most common types were FPM and FPM with EDO (Extended Data Out). Generally each manufacturer uses his own scheme to mark memory chips. However, a simple algorithm can be used in most cases to determine the exact type of chip. Usually the number starts with two or three characters which are specific to the manufacturer. For an FPM, nibble, SC or EDO chip the rest of the sequence is usually up to 16 Mbit chips built up more or less the same : first an indication of the manufacturer, total memory and refresh address range is given, then the number of bits per chip, then the mode of operation terminating with the memory speed (for manufacturers specific part number code decoding see the Part Number Chart).

7 Format : XXX AA BB CC D -EE XXX: Manufacturers Identification Code: MB Fujitsu GM Goldstar/LGS HM Hitachi HY Hyundai MT Micron M5M Mitsubishi MCM Motorola upd NEC MSM OKI MN Panasonic/Matsushita KM Samsung/SEC K Samsung/SEC (new code) LH Sharp HYB Siemens/Infineon TMS Texas Instruments TC Toshiba AA : Total Number of Megabits: 1 : 1 MBit 4 : 4 MBit 16 : 16 MBit/4k Refresh 17 : 16 MBit/2k Refresh 18 : 16 MBit/1k Refresh BB : Internal Organization (Data Width): 10 : 1 Bit (1 MBit Chips: 0 = 1 Bit) 40 : 4 Bit 80 : 8 Bit 16 : 16 Bit CC : I/O Mode: 0 : Fast Page Mode (FPM) 1 : Nibble Mode (NM) 2 : Static Column Mode (SCM) 3-9 : Fast Page Mode mit Extended Data Out (EDO) D : Package Information: J: SOJ- package. T: TSOP Type-II package EE : Access time in nano seconds. Sometimes the zero is omitted. In that case the number should be multiplied by 10 so that the speed falls into the 30 to 150ns range. Examples: TC > Toshiba, 1MB, 1bit (1Mx1), FPM, 60ns HYB > Siemens, 4MB, 4bit (1Mx4), FPM, 60ns HM > Hitachi, 16MB/1k refresh, 16bit (1Mx16),FPM, 60ns

8 DRAM Part Number Chart v1.0 ( ) 1. Notes / Hinweise Bitte beachten: Diese unvollständige Übersicht basiert auf meinem eigenen Archiv und diversen Quellen aus dem Internet. Die Fehlerfreiheit der Angaben kann grundsätzlich nicht garantiert werden. Die Links beziehen sich auf herstellerspezifische Algorithmen zur Ausbildung der Teilenummern (Part Numbers) und basieren auf Informationen der Chiphersteller und Chipmunk International. Please note: This fragmentary chart is based upon my own archives and references on the Internet and may contain errors. The links are related to manufacturers specific part number code algorithms. This is based upon information from the Chip Manufacturers and Chipmunk International. 2. Part Number Chart: DRAM 256kBit Organization/ Manufacturer 256kx1 64kx4 Fujitsu MB81256 MB81464 Goldstar GM71C256 Hitachi HM51256 HM51464 Hyundai 53C256 Micron Mitsubishi Motorola MT1256 M5M4256 MCM6256 NEC D41464 OKI MSM41256 MSM41464 Panasonic MH41256 MN41464 Samsung KM41256 Sharp LH2464 Siemens HYB41256 HYB41464 Texas Instr. TMS4256 TMS4464 Toshiba TC Part Number Chart: DRAM 1MBit Common number of pins in TSOP Type II- or SOJ- package: 20 (4 groups to 5 pins) Organization/ Manufacturer Fujitsu 1Mx1 MB81C1000 [F] MB81C1002 [S] 256kx4 MB81C4256 [F] Goldstar GM71C1000 [F] GM71C4256 [F] Hitachi HM [F] HM [F] HM [S] Hyundai HY [F] HY [F] Micron MT4C1024 [F] MT4C4256 [F] Mitsubishi M5M41000 [F] M5M44256 [F] Motorola MCM [F] MCM [F] NEC [F] [F] [S] OKI MSM [F] MSM [F] MSM [S]

9 Panasonic MN41C1000 [F] Samsung KM41C1000 [F] KM44C256 [F] Sharp LH64258 [S] Siemens HYB [F] HYB [F] Texas Instr. TMS4C1024 [F] TMS44256 [F] TMS44C256 [S] Toshiba TC [F] TC [F] TC [S] * F = FPM, N = Nibble, S = Static Column, E = EDO 4. Part Number Chart: DRAM 4MBit Common number of pins in TSOP Type II- or SOJ- package: 20 (4 groups to 5 pins up to data width of 4 Bit) Organization/ Manufacturer 4Mx1 1Mx4 512kx8 256kx16 Fujitsu MB [F] MB [F] MB [F] MB [F] MB [E] Goldstar GM71C4100 [F] GM71C4400 [F] GM71C4800 [F] GM71C4260 [F] GM71C4263 [E] Hitachi HM [F] HM [F] HM [F] HM [F] HM [E] Hyundai HY [F] HY [F] HY [F] HY [F] HY [E] Micron MT4C1004 [F] MT4C4001 [F] MT4C8512 [F] MT4C16257 [F] MT4C16270 [E] Mitsubishi M5M44100 [F] M5M44400 [F] M5M44800 [F] M5M44260 [F] M5M44265 [E] Motorola MCM54100 [F] MCM54400 [F] MCM54800 [F] MCM54260 [F] NEC [F] [F] [F] [F] [E] OKI MSM [F] MSM [F] MSM [S] Panasonic MN41C4400 [F] MSM [F] MSM [F] MSM [E] Samsung KM41C4000 [F] KM44C1000 [F] KM48C512 [F] KM416C256 [F] KM416C254 [E] Sharp LH64400 [F] LH64258 [S] Siemens HYB [F] HYB [F] HYB [F] HYB [E] Texas Instruments TMS44100 [F] TMS44400 [F] TMS45160 [F] TMS45169 [E] Toshiba TC [F] TC [F] TC [S] * F = FPM, N = Nibble, S = Static Column, E = EDO TC [F] TC [F] TC [E]

10 5. Part Number Chart: DRAM 16MBit - 5V Common number of pins in TSOP Type II- or SOJ- package up to data width of 8 Bits: 24 (4 groups to 6 pins). Check out manufacturers specific part number code for the 3,3V code sequence. Organization/ Manufacturer 16Mx1 4Mx4 Fujitsu MB [4,F] MB [2,F] MB [2,E] Goldstar GM71C16100 [4,F] GM71C17400 [2,F] GM71C17403 [2,E] Hitachi HM [4,F] HM [2,F] HM [2,E] Hyundai HY [4,F] HY [2,F] HY [2,E] HY [4,F] HY [4,E] Micron MT4C4M4B1 [2,F] MT4C4M4E8 [2,E] MT4C4M4A1 [4,F] MT4C4M4E9 [4,E] Mitsubishi M5M [4,F] M5M [2,F] M5M [2,E] Motorola NEC [2,F] [2,N] [2,S] [4,F] [4,N] [4,S] MCM [2,F] MCM [2,E] [2,F] [2,E] [4,F] [4,N] [4,S] [4,E] OKI MSM [4,F] MSM [2,F] MSM [2,E] Samsung (old code) KM41C16000 [4,F] KM44C4100 [2,F] KM44C4104 [2,E] Samsung (new code) K4F [4,F] Siemens Texas Instruments K4F [2,F] K4E [2,E] HYB [2,F] HYB [2,E] TMS [2,F] TMS [2,E] Toshiba TC [4,F] TC [2,F] TC [2,E] * F = FPM, N = Nibble, S = Static Column, E = EDO 2Mx8 MB [2,F] MB [2,E] GM71C17800 [2,F] GM71C17803 [2,E] HM [2,F] HM [2,E] HY [2,F] HY [2,E] MT4C2M8B1 [2,F] MT4C2M8E7 [2,E] M5M [2,F] M5M [2,E] [2,F] [2,E] [4,F] [4,N] [4,S] [4,E] MSM [2,F] MSM [2,E] KM48C2100 [2,F] KM48C2104 [2,E] K4F [2,F] K4E [2,E] HYB [2,F] HYB [2,E] TMS [2,F] TMS [2,E] TC [2,F] TC [2,E] 1Mx16 MB [1,F] MB [1,E] GM71C18160 [1,F] GM71C18163 [1,E] HM [1,F] HM [1,E] HY [1,F] HY [1,E] HY [4,F] HY [4,E] MT4C1M16C3 [1,F] MT4C1M16E5 [1,E] M5M [1,F] M5M [1,E] MCM [1,F] MCM [1,E] [1,F] [1,E] MSM [1,F] MSM [1,E] KM416C1200 [1,F] KM416C1204 [1,E] K4F [1,F] K4E [1,E] HYB [1,F] HYB [1,E] TMS [1,F] TMS [1,E] TC [1,F] TC [1,E]

11 6. Part Number Chart: DRAM 64MBit - 3,3V Common number of pins in TSOP Type II- or SOJ- package up to data width of 8 Bits: 32 Organization/ Manufacturer Goldstar Hitachi Hyundai Micron Mitsubishi NEC 16Mx4 GM71V64400 [8,F] GM71V65400 [4,F] GM71V64404 [8,E] GM71V65404 [4,E] HM [8,F] HM [4,F] HM [8,E] HM [4,E] HY51V64400 [8,F] HY51V65400 [4,F] HY51V64404 [8,E] HY51V65404 [4,E] MT4LC16M4H9 [4,E] MT4LC16M4G3 [8,E] MT4LC16M4T8 [4,F] MT4LC16M4A7 [8,F] M5M [8,F] M5M [4,F] M5M [8,E] M5M [4,E] upd [8,F] upd [4,F] upd [8,E] upd [4,E] 8Mx8 GM71V64804 [8,E] GM71V65804 [4,E] HM [8,F] HM [4,F] HM [8,E] HM [4,E] HY51V64800 [8,F] HY51V65800 [4,F] HY51V64804 [8,E] HY51V65804 [4,E] MT4LC8M8C2 [4,E] MT4LC8M8P4 [8,E] MT4LC8M8B6 [4,F] MT4LC8M8E1 [8,F] M5M [8,F] M5M [4,F] M5M [8,E] M5M [4,E] upd [8,F] upd [4,F] upd [8,E] upd [4,E] OKI MSM51V65805 [4,E] MSM51V64405 [8,E] 4Mx16 GM71V65160 [4,F] GM71V65163 [4,E] HM [8,F] HM [4,F] HM [8,E] HM [4,E] HY51V64160 [8,F] HY51V65160 [4,F] HY51V64164 [8,E] HY51V65164 [4,E] MT4LC4M16R6 [4,E] MT4LC4M16N3 [8,E] MT4LC4M16F5 [4,F] M5M [8,F] M5M [4,F] M5M [8,E] M5M [4,E] upd [8,F] upd [4,F] upd [8,E] upd [4,E] Samsung (old code) KM44V16000 [8,F] KM44V16100 [4,F] KM44V16004 [8,E] Samsung (new code) K4F [8,F] K4F [4,F] K4E [8,E] Siemens/Infineon Texas Instruments Toshiba * F = FPM, E = EDO HYB [8,F] HYB [4,F] HYB [8,E] TMS [8,F] TMS [4,F] TMS [8,E] TC [8,F] TC [4,F] TC [8,E] 7. Manufacturers on the Internet KM48V8000 [8,F] KM48V8100 [4,F] KM48V8004 [8,E] KM48V8104 [4,E] K4F [8,F] K4F [4,F] K4E [8,E] K4E [4,E] HYB [4,F] HYB [8,E] HYB [4,E] TMS [8,F] TMS [4,F] TMS [8,E] TMS [4,E] TC [8,F] TC [4,F] TC [8,E] TC [4,E] HYB [?,F] HYB [?,E] " - Micron Technology, Inc. " - Oki Semiconductor " - Samsung 8. Download Part Number Chart V1.0 PNC_V1_0.RTF - Part Number Chart V1.0 in the Rich Text Format