----- Meeting Notes (10/8/13 10:34) The mobile market is driving growth and inovation in packaging.

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2 ----- Meeting Notes (10/8/13 10:34) The mobile market is driving growth and inovation in packaging. 2

3 Mobile drives growth and the future of computing Dynamic of industry is quickly changing Devices Smartphone/Tablets shipments >2X of PCs in 2012 Expected to grow to ~6X those of PCs in 2017 Semi Revenues Mobile (includes tablets and phones) exceeded PCs in 2012 Gap expected to grow to ~$34B in 2016 Companies looking to innovate and get a return on investments are shifting their focus to mobile 3

4 Adoption in U.S X pace of PCs in 80 s, 2X of Internet in the 90 s 2.6X as many new smartphone users as babies born every day in 2012 Continued growth Smartphone shipments forecast to surpass feature phones in the US in 2012 Expected to surpass feature phones worldwide in 2014 (~67% of total handset shipments in 2016) ~5 B cumulative sales from Expanding smartphone ownership demographics 60% of growth between June came from people younger than 24 and older than 45 More than just a technology product It is empowering people to connect with the world and improve quality of life like never before 4

5 Growth drivers Greater 3G/4G network coverage Increasing affordability of devices Affordable data plans Regulatory facilitation and government programs 3G/4G migration will drive smartphone growth and advanced network rollouts India: 135M 386M China: 217M 753M MEA: 144M 477M LatAm: 101M 412M 5

6 Misperception: CPU alone that drives the experience Not True (CPU only 15-20% of a Snapdragon chip) Snapdragon leads in all areas Modem & connectivity Now in 3rd gen LTE w/cat4 (up to 150 Mbps) & CA Supports connectivity (Wi-Fi, BT, GNSS) Applications SoC designed from the ground up for mobile Not a standard off-the-shelf solution Key to stay ahead in schedule & performance/power (4th gen Krait 400) Superior in class graphics at any tier Hexagon DSP enables ultra-low power applications Multimedia, camera setting the bar of what is expected in a mobile device UltraHD capture & playback and 7.1 surround sound in our most advanced processors Advanced camera features Some think innovation in smartphones has hit its peak still room for improvement and opportunities for continued innovation 6

7 Functions that make smartphone indispensable rely on core technologies Innovation will continue on several fronts: Processor, Graphics Multimedia Modem, RF, Connectivity Sensors Displays Qualcomm is uniquely positioned to innovate on all these fronts 6

8 Industrial Design drives component form factors Companies want to be unrestricted in the design of handsets they create from internal component form factors This is driving X, Y, and Z reductions continuously and at an increasing pace 7

9 Thickness decreasing. Recently at an expanding rate. Driving the thickness requirements of all components in last 4 years. 8

10 8-10 layer PWB supports fine pitch components, moving to 12 layer 0.4mm pitch for FCCSP and WLP is common 0.35mm starting to appear and will become more common in next 1yr Smaller PWB double sided high density Allows for thicker battery and accommodates thicker components like camera more easily 9

11 FCCSP All materials similar thicknesses 10

12 The requirements of the packages require new technologies and materials One size fits all doesn t work 11

13 Challenges for packaging solutions in wireless application - Current key issues in red. - Low CTE, High Modulus Substrate Materials - Preserving Si Strain Eng. And electrical performance(ecpi) - Higher Tj (>100C) - Power Distribution Network

14 Flip chip trends Conventional FC solder bump technology Moves to: Cu Pillar bond on lead technology - Mass reflow attach - Thermo-compression attach Bond on lead removes cost of processing solder resist at fine pitches TCFC process minimizes stress on ELK during cool down 13

15 Package Styles in typical Smartphone - MLP FCPoP processor - Multiple WLP packages (power management and RF) - FC/WB Hybrid package (Modem) 14

16 Comparison of thicknesses of mobile packages compared to standard US penny 15

17 Describe packages BD PoP and MLP PoP Thickness reduction - Thinner core - Thinner mold - Alternate approach is new package construction - Describe packages 16

18 Very difficult to have high shrinkage and high modulus in same material Adding filler increases modulus but decreases shrinkage 17

19 Note the effect of Modulus as well CTE of the substrate 18

20 Trends over last 5 years in mobile space substrate manufacturing 19

21 Core Material CTE decreased from 15 to 3 in last 5 yrs for FCPoP packages This was used to control coplanarity and warpage of the package CTEs of 1.5ppm are being evaluated Next property to receive attention is the modulus 20

22 More homogeneous materials properties. Mold CTE similar CTE to die and thickness of organic dielectric and Cu layers negligible in determining warpage 21

23 Dissimilar materials but more symmetric construction minimizes warpage 22

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27 Mobile will reshape some of the largest industries on the planet: Energy - Mobile will play a key role in the smart grid, Consumers Energy to deploy 1.8 million smart meters with embedded cellular Auto - Cars become connected and enhance the in-car experience, safety Four major automakers kicked off LTE development programs Qualcomm chipsets selected for more than 30 connected car programs (16 diff companies) Health - Remote monitoring will reduce the cost of health care. Studies show mobile and wireless technologies can reduce mortality rates between 45% - 69%, emergency room admissions between 20% - 69% and even hospital re-admissions between 44% - 73% Home Just look at your home today and count the # of connected devices 26

28 ~5B cumulative smartphone sales estimated in (Gartner, Mar. 12) 650M+ tablets and notebooks expected to ship in 2016 (average of Gartner, Strategy Analytics and ABI, all Mar. 12) The average amount of traffic per smartphone nearly tripled in 2011; 150 MB/Mo, versus 55 MB/Mo in 2010 (Cisco, Feb. 12) There is no doubt there will be increasing data demand fuelled for example by increased smartphone penetration, proliferation of mobile computing and Internet of Everything connections 120M+ cellular Machine-to-Machine modules expected to ship in 2016 (average of ABI (Mar. 12) and IMS (Apr. 12)) There is also increased data utilization per device In 2011, the typical smartphone generated 35X more mobile data traffic than the typical basic-feature cell phone (Cisco, Feb. 12) Many wireless operators have seen a much stronger demand then the global doubling in mobile data we have seen the last couple of years Over the past five years, AT&T s wireless data traffic has grown 200X (AT&T, Feb. 12) China Mobile expects data traffic on its mobile network to surge >150% this year, and the company expects the sharp rise to continue in coming years (WSJ, Jun. 12) The FCC projected 35x growth from 2009 to 2014, using an average of industry projections Challenges bring out the best in us, and we are facing a formidable one: The 1000x challenge. The genesis of this goes back to the phenomenal mobile broadband data 27

29 growth in the last few years. Globally, the mobile traffic has been approximately doubling each year during last few years. However, the industry is now preparing for a staggering 1000x increase. But Qualcomm is not in the business of predicting when we will reach the 1000x demand, we are working on the solutions to enable the 1000x supply over the next decade. 27

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33 Density scaling is continuing Speed scaling is continuing Cost scaling seems not to be continuing, More steps in process, Longer FAB times, double and triple patterning 31

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35 Interposer is defined as fine dense interconnect layers Allows BEOL like routing in package level 33

36 Example of embedded substrate using standard substrate manufacturing flow Embedded MLCC for decoupling is shipped in volume today for high end Aps Processors in Smartphone One cap per processor core Die with small number of interconnects (<100) 34

37 SESUB, (Semiconductor Embedded SUBstrate) is TDK s the state of the art substrate solution for SiP In SESUB structure, IC chip thickness can be reduced down to 70um since it is covered with resin and sustained by it This make substrate thickness thin down to 300um, total module height as well To thin IC thickness thinner also contribute two additional advantages 1) Good heat dissipation because of embedded IC chip closer to a main board 2) Most of signal trace patterns can be routed with shortened and optimized to mother board or to SMT components. This make opportunity to reduce EMC interferences issue from those traces, depending on the design

38 Example of space reduction on board possible by using embedded die module

39 Examples of modules using ewlb 37

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41 Last statement 39