EECS 312 Digital Integrated Circuits. Instructor s Name: Prof. Pinaki Mazumder. T,Th 3:00 4:30 pm. Overview

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1 EECS 312 igital Integrated Circuits Instructor s Name: Prof. Pinaki Mazumder mazum@eecs.umich.edu T,Th 3:00 4:30 pm 1 Overview Logistics Go over syllabus & Course Overview igital ICs are omnipresent: Applications The first computers were huge and slow Modern Microprocessors and SP s Trends of power, complexity, productivity Moore s law ifferent styles s of VLSI Chip esign What I expect you to learn in this class 2 1

2 Logistics 1 Lecture Tuesday/Thursday Chrysler Syllabus Website is at: You need your umich password (not EECS!) Friday discussion sections led by the GSI, Gregory Brandon Review lecture topics, go through examples, answer questions I may offer supplementary lectures during the discussion hours Software labs Eldo based Will prepare you for future classes where Accusim is used No set time for these labs do on your own schedule Lab Reports will be, however, due on the indicated dates 3 Logistics 2 Textbook: igital Integrated Circuits: A esign Perspective, 2 nd edition by Jan Rabaey, Anantha Chandrakasan, and Bora Nikolic Lecture notes will be posted online a couple of days in advance before class sessions I will supplement the ppt slides with handouts from other sources throughout the semester 4 2

3 istribution of Points Pay 100% attention to lectures + iscussions Lab 30 % 5 Lab Expts Eight Written Home Work If you do not submit HW, your Final Grade will be Penalized. Read class notes + Handouts regularly Try all Homework Problems Try all Lab Expts 25 % Final Exam 20 % Home Work 25 % 6-8 uizzes o esign Project Late Homework Policy: 24 hours with 30% penalty and after that no credit5 6 3

4 All Pervasiveness of igital Integrated Circuits Global Market Size of Semiconductor evices: $250 Billion and heading towards $1 Trillion Consumer Electronics: igital TV, V, PA, Video Camera, Games,. Computers: Notebook, esktop, Clustered PC s, Communications: Cell Phone, Answering Machines, Appliances: Washing Machine, Microwave Cooker, Thermostat,. 7 Merging of Technologies Computers Embedded Processors Microcontrollers Communication Cell Phone Internet Voice Service Consumer Electronics Video Camera Personal Organizer Games 8 4

5 9 10 5

6 etailed History 11 Larger chips to keep up with more transistors 100 ie size (mm) ~7% growth per year ~2X growth in 10 years P6 486 Pentium proc Year 12 6

7 Integration, Integration, and Integration Year of Introduction Transistors , , , , ,000 Intel386 processor ,000 Intel486 processor ,180,000 Intel Pentium processor ,100,000 Intel Pentium II processor ,500,000 Intel Pentium III processor Intel Pentium 4 processor Intel Itanium processor ,000, ,000, ,000,000 Intel Itanium ,000,000 EECS 2 processor 312 Lecture esign Trends Smaller transistors Bigger chips (dies) Faster clock frequencies More complex designs Higher power consumption 14 7

8 SIA Roadmap of IC Technology ---- The MARCH Continues Year Channel length [nm] Short wire Pitch [ m] P Chip Size [mm 2 ] P Transistors [10 6 ] Global Clock [MHz] Local Clock [MHz] issipation [Watt] Min Logic Vdd [V] Wire length [km] Wiring levels ASIC Package Pins RAM bits/chip 267M 1.07G 4.29G 17.2G 68.7G 275G 1.10T P cost/transistor [ $] Transistor speed > 250 GHz Circuit speed for P P < 10 GHz

9 What does all this mean? Chips are getting bigger and harder to design Hierarchical design flow Good design principles needed Knowledge of fundamental design practices Ability to develop innovative design techniques This course is the first step in learning these design principles Next step = 427, then 627, followed by Intel, IBM, or your own start-up 17 esign Abstraction Levels + EECS 470 & 627 EECS 427 (Manual) (Verilog) EECS 270 EECS 312 SYSTEM MOULE GATE CIRCUIT Verilog & Manual esign of Large igital Systems evice & Circuit Equations EECS 320 S n+ G EVICE n+ evice Equations 18 9

10 What you will learn in this class Transistor level digital circuit design How to design and analyze the fundamental building blocks of all large-scale digital ICs CMOS combinational gates Sequential (storage) elements ynamic circuit families Memories Interconnect-related issues Based on the key quality metrics of circuit design: Speed, area, power, cost, reliability 19 Reading Exercises Read Sections 1.1 & 1.2 (pp. 4-15) of your textbook for subject matters of Today s Lecture Next lecture: Review of CMOS Logic operation Lecture Slides are posted. Study the Slides. Read in advance: Textbook pp

11 EPILOGUE Main Message of Today s Lecture: CMOS Juggernaut ut will Continue to Scale down to 20 nm and beyond for another 15 to 20 years! No replacement of CMOS is in sight. Non-Silicon Nanotechnologies such as CNT, Moltronics, NMR, Ion-Trap uantum Computing, are only good for research. evice Physics, Higher Order Physical Effects, Circuit Analysis, Circuit Modeling to Account for iscrepancies Between Analytical Models and SPICE Simulations are Extremely Important for the Nano-scaled CMOS Chip esign. You must learn them in EECS 312 and EECS Lecture on Sequential Elements Pinaki Mazumder Lecture #20 EECS 312 Reading: 7.1.1, Exclude EECS

12 A TYPICAL PROCESSOR ARCHITECTURE 2006 EECS bit EECS 427 ISA Processor ALU Shifter 2006 EECS

13 16-bit EECS 427 ISA Processor Program Counter Register File 2006 EECS Clock rivers 2006 EECS

14 Sequential Logic Inputs COMBINATIONAL LOGIC Outputs Current State Registers Next state 2 storage mechanisms positive feedback Static charge-based ynami c 2006 EECS Positive Feedback: Bi-Stability V i1 V o1 =V i2 V o2 V o1 V o1 V i2 V i 2 5Vo1 V o2 =V i1 V i1 V o2 V i2 =V o1 V o1 A V i 25 C Metastable Point B 2006 EECS 312 V i1 =V o

15 Meta-Stability V i2 5V o1 Point1Metastable A small perturbation Causes FF to go to A. 1A A V i2 5V o1 C C B B V d i1 5V o2 Metastable Point V d i1 5V o2 Gain should be larger than 1 in the transition region 2006 EECS Types of Sequential Elements Latch Register stores data when is either high or low stores data when rises/falls (edge-triggered) Clk Clk Clk Clk 2006 EECS

16 Types of Latches Level-sensitive A transparent mode and an opaque mode depending on the level of 2006 EECS Timing Metrics Timing metrics for sequential elements differ from those of combinational logic Set-up time Time that data must be valid before clock transitions Hold time Time that data must remain valid after the clock edge Propagation delay Can be measured from clock to or data to Which is more meaningful? epends 2006 EECS

17 Register: Timing efinitions t Register t setup t hold ATA STABLE t t c2q ATA STABLE t 2006 EECS Characterizing Timing t 2 Clk Clk t C 2 Register t C 2 Latch 2006 EECS

18 Latch-Based esign N latch is transparent P latch is transparent when = 0 when = 1 N Latch Logic P Latch Logic 2006 EECS Maximum Clock Frequency FF s If the data races through the logic too fast, the data is contaminated LOGIC t p,comb t c- + t p,comb + t setup = T Also: t cdreg + t cdlogic > t hold t cd : contamination delay = minimum delay Usually t cdreg ~ t c EECS

19 Writing into a Static Latch Use the clock as a decoupling signal that distinguishes between the transparent and opaque states Converting into a MUX Forcing the state (can implement as NMOS-only) 2006 EECS Storage Mechanisms Static ynamic (charge-based) 2006 EECS

20 Mux-Based Latches Negative latch (transparent when = 0) Positive latch (transparent t when = 1) Clk Clk In Clk Clk In 2006 EECS T-gate Mux-Based Latch 2006 EECS

21 Pass-transistor Mux-Based Latch M M NMOS only Non-overlapping clocks 2006 EECS Master-Slave (Edge-Triggered) Register Master Slave 1 0 M 0 1 M Two opposite latches act to trigger on clock edge Also called master-slave topology Advantage: Transparency window is limited and more controllable isadvantage: Slower 2006 EECS

22 Master-Slave Register Multiplexer-based latch pair I 2 T 2 I 3 I 5 T 4 I 6 I 1 T 1 M I 4 T 3 High clock load (high switching activity, large power) 2006 EECS Clk- elay 2.5 Volts t c 2 q(lh) t c 2 q(hl) time, nsec 2006 EECS

23 Setup Time epiction M 2.0 I 2 2 T 2 Volts Volts I 2 2 T M time (nsec) T setup = 210ps time (nsec) T setup = 200ps 2006 EECS Reduced Clock Load Master-Slave Register T 1 I 1 T 2 I 3 I 2 I 4 Only 2 T-gates and 4 INV New data must now overpower the previously held state Possible reverse conduction path (keep I 4 weak) 2006 EECS

24 Latch-Based esign latch is transparent + latch is transparent when = 0 when = 1 Latch Logic + Latch Logic Latch To avoid race conditions, we need to make sure that the clocks are completely non-overlapping Otherwise consecutive latches may be transparent simultaneously 2006 EECS Avoiding Clock Overlap A X B (a) Schematic diagram (b) Overlapping clock pairs 2006 EECS

25 Overpowering the Feedback Loop NOR-based set-reset S R S R S R Forbidden State t Cross-coupled NORs 2006 EECS Clocked SR latch Adding clock to synchronize V M 2 M 4 M 6 M 8 M 1 M 3 S M 5 M 7 R This is not used in datapaths any more, but is a basic building memory cell 2006 EECS

26 (Volts) Sizing Issues W/L 2 = VTC 3.0 W/L 5 and 6 (a) Output voltage dependence on transistor width Volts 2 1 W = 0.9 m W = 1 m time (ns) (b) S W = 0.5 m W = 0.6 m W = 0.7 m W = 0.8 m Transient response 2006 EECS Lecture Summary Latch topologies are based on cross-coupled inverter pairs to hold state New states are overwritten by either decoupling the pair (break the loop) or by overpowering the loop Breaking the loop is cleaner (less contention, power) but results in more complex topologies Edge-triggered registers are slower than latches but are more robust/easy to design with since they are only transparent for a very limited duration 2006 EECS

27 Clock Skew in Alpha Processor Absolute skew smaller than 90 ps The critical instruction and execution units all see the clock within 65 ps 2006 EECS

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