Fraunhofer Demo Day. Integrated Micro Camera Devices Dr. Michael Töpper, Dr. Andreas Ostmann Martin Wilke, Prof. Dr. Lang

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1 Fraunhofer Demo Day Integrated Micro Camera Devices Dr. Michael Töpper, Dr. Andreas Ostmann Martin Wilke, Prof. Dr. Lang

2 Modular Microelectronics Concept Traditional electronic system µcontroller capacitors MOSFET flash memory resistors Pt100 components on a PCB

3 Modular Microelectronics Concept Traditional electronic system Vision Modular System µcontroller capacitors system control / memory MOSFET flash memory resistors Pt100 temperature sensing power management PCB 3D stacked modules components on a PCB stacked modules

4 Modular Microelectronics Concept Modular System system control / memory temperature sensing power management Project Modular Micro Camera (MoMiCa) stacked modules 3D stacked modules

5 MoMiCa: Design Camera Components 13 Components on top 3 MPixel Image Sensor Omnivision 3642 lens CMT746 + lens holder 7 capacitors (0201) 1 resistor (0201) 1 inductor (0603) 1 microswitch 74 Embedded Components 32 bit microcontroller with image sensor interface (CogniVue CV2201 BGA 236 ) 256 Mbit Flash Memory (Macronix 8WSON MOSFET switch (IRF SOIC) USB ESD protection (NXP SOT457) 5 DC/DC-converters (Murata) oscillator 24 MHz (NXP 2 LEDs (0402) 34 capacitors (0201, 0603) 25 resistors (0201) 3 inductors (0603) 13 active components from 8 different manufacturers

6 25,4mm MoMiCa Technical Parameters Dual Core ARM9 with350 MHz (CP2201 of CogniVue) Integrated Image Processing-DSP (APEX) 3M-Pixel CMOS Sensor OmniVsion 16 MByte DDR SDRAM 32 MByte NAND Flash Mentor RTOS System Software USB 2.0 Device Interface Low Power (ca. 1,0-1,5 W ) < 3cm³ incl. Optics CV2201 PDK (Prototype Design Kit) 16mm around 1/5 of the volume of existing commercially available systems 31mm 25,4mm

7 MoMiCa- Design - 8-layers HDI-,High-Speed-Design - +2 layers for plugs and camera - 5 Voltages: 1,0 V; 1,5 V; 1,8 V; 3,0 V; 3,3 V - Stacked µvias 50 µm - 60 µm lines / 75 µm space - 16x16 mm² size

8 MoMiCa Components on Inner Layer For this prototyping: packaged ICs have been used due to pro/con of Wafer Level Packaging Camera Module after assembly of inner layer Panel with Modules

9 MoMiCa Camera Module 3 Mpixel image sensor 32 bit microcontroller capacitor DC/DC converter flash memory Modular camera with integrated 32 bit image processor and memory

10 Manufacturing Structures Inside through hole capacitor CogniVue Image Procesor 3 stacked chips in a package Macronics Flash Memory 2 stacked chips in a package cross section

11 Manufacturing Module after Singulation Geometry size 16 x 16 mm thickness w/o image sensor 3.6 mm weight 2 g w/o lens

12 Functional Test singulated MoMiCa modules were equipped with lens holders and 7 mm lenses programming using JTAG interface and needle adaptor Nucleus operation system from Mentor adaptation of real-time demos: Sobel filter for edge recognition feature tracking algorithm measured power consumption at full speed: 2 W (400 5 V USB voltage)

13 Further Miniaturization for Image Sensor Packaging: Wafer Level Packaging Objective Wirebonds Imagesensor with TSVs Imagesensor

14 3D Integration by Wafer-Level-Packaging Through Silicon Vias (TSV) of CMOS Wafers Back-Side Front-Side

15 Joining of Optics and Sensor Wafer

16 Process Steps for 3D Redistribution 5µm Cu Plating (No Via Filling) Other Bump metallurgies, technologies and sizes possible 35µm Au- Bumping

17 Dicinglane Joining of Optics and Sensor Wafer Textured Bondinterface. Glue is not allowed to interfere the light path. View onto lenses View onto bonded Optic wafer

18 Singulated Micro Cameras Singulated devices on support wafer After sample pick up

19 Results of WLC Test Pictures of the Micro Camera Device

20 Modular Microelectronics Vision Packaging of Sensors using 3 D-Integration Modular System Architecture Module Stacking Modular System Modular System Software The Vision: System construction as easy as Lego Embedded SiP Embedding Technology

21 Wafer Level System Integration Infrastructure at Fraunhofer IZM 2 wafer level process lines in Berlin & Dresden (process compatibility) High flexibility in processes and wafer size (4-12 ) Berlin Dresden

22 Dr. Michael Töpper Fraunhofer IZM Gustav-Meyer-Allee 25; Berlin; Germany Phone: +49 (0)