olution nnect S Intercon Speed I November, , HIROSE ELECTRIC CO., LTD. All rights reserved. Rev 3.0 November, 2010 Page 1

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Peregrine Lewis
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1 IT3 erie peed mezzanine Connector Sytem November, 2010 HIROSE ELECTRIC CO., LTD. HIROSE ELECTRIC USA, INC. Page 1

2 IT3 Serie Deign Overview A New Standard Mezzanine for Flexibility and Performance Flexibility: Hiroe IT3 mezzanine connector ytem i a comfortable in today data rate of PCIe and XAUI a it i in tomorrow 10+Gbp ytem. With the ability to tranmit differential, ingle ended, and power through one package and being tackable from mm, IT3 can olve your interface need for both current and future generation. Feature: Unique 3 piece tructure for excellent reflow olderability Differential, ingle ended, and power Low mating/extracting force Wide mialignment tolerance Stacking g height from 15 to 40mm Both SnPb and Pb free are available Staggered 1.5mm x 1.75mm BGA Detachable (Mating) Side Mating / Unmating Flexible 3-piece deign* ha many advantage *3-piece deign i HRS Patented Technology Page 2

3-piece Connector Deign Benefit Aembly friendly unique 3-piece IT3 erie mounting & mating procedure Mounting receptacle Reflow mounted on PCB Interpoer Intalled onto Mounting receptacle after reflow

3 3-piece Connector Deign Benefit Aembly friendly unique 3-piece IT3 erie mounting & mating procedure Mounting receptacle Reflow mounted on PCB Interpoer Intalled onto Mounting receptacle after reflow Mating receptacle Mated with Interpoer X-ray Inpection Friendly No need to reflow Low Thermal Ma for Reflow proce For any tacking height combination, receptacle i alway ame and it height i 6mm only. Small ize of receptacle ha wide proce window for reflow profile. Lead-Free application benefit from our eay reflow proce deign. Reflow receptacle only X-ray inpection from bottom ide 1. Significantly reduce frequency of fale call 2. Simple receptacle deign give clear viion for X-ray inpection. Page 3

IT3 Deign Feature & Benefit IT3D/M -***S - BGA Indutry tandard footprint 75 mm 0.

4 IT3 Deign Feature & Benefit IT3D/M -***S - BGA Indutry tandard footprint 75 mm mm Signal BGA Ground BGA IT3 unique 3 piece deign and contruction give indutry leading BGA reliability, while till providing the denity of 73 differential pair per linear inch. Mating / Un-mating operation reliable BGA connection *Patented Technology The IT3 divided receptacle tructure reduce thermal tre and enure long term reliability of the BGA ball connection with the PWB HRS IT3 Serie Competitor :10 acceptable HRS IT3 Serie : Not acceptable Competitor :3 acceptable : Not acceptable Page 4

5 Mechanical Deign Benefit 1 Floating interpoer unique flexible deign Floating Floating interpoer Floating interpoer enure table ignal connection. Floating Fixed Floating Fixed Mating and Floating tolerance: +/ 0.3mm in X direction, +/ 0.2mm in Y direction Wide range Mounting tolerance Error from datum poition 0.3mm Max. poition 0.2mm m Max Error fro om datum Page 5

Mechanical Deign Benefit 2 Lower force Inertion and

Houing deign prevent pin tubbing Con ntact force (N)

Diplacement of pring (mm) IT3 Supplier A IT3 Serie

6 Mechanical Deign Benefit 2 Lower force Inertion and Extraction Pre-load tructure Contact normal force Houing deign prevent pin tubbing Con ntact force (N) 0 Spring workload i decreaed. Diplacement of pring (mm) IT3 Supplier A IT3 Serie Appx. 200 po. 90 N 145 N Appx. 300 po. 135 N 218 N Exiting Expoed contact Page 6

7 3-piece Connector Aembly Benefit 2nd Reflow oldering compatible PCB IT3 connector 6mm IT3 erie for 30mm (or any) tacking height application Already confirmed that there are no iue to mount Hiroe IT3 erie connector on the bottom ide of PCB for 2 nd reflow oldering by major CEM. 19.7mm Other upplier for 30mm height application May not uitable for 2nd Reflow oldering due to the weight. Page 7

3-piece Structure Pricing Benefit on t Solutio connect S ed gh

Main Board Main Board Daughter Card +) Receptacle Plug P=50%

Daughter Card +) I= 40% Receptacle interpoer R= 30% x 2 pc

8 3-piece Structure Pricing Benefit on t Solutio connect S ed gh Mated co ondition Optiona al Card et tc Competitor 2 piece Main Board Main Board Daughter Card +) Receptacle Plug P=50% R=50% Total = 100% Plug Hiroe 3 piece Main Board Main Board Daughter Card +) I= 40% Receptacle interpoer R= 30% x 2 pc Total = 100% Receptacle 50% 30% Save 20% in Optional card connection Page 8

9 Robut Solder Ball Attachment on t Solutio connect S gh Speed ed Hiroe IT3 erie A a contact lead i poitioned into a older ball, it prevent the ball from pealing off during evere hock &vibration tet. After reflow oldering Other connector & ilicon device package Uncontrolled co-planarity bring the migration of older ball from low to high temperature ide during reflow, which caue the oldering failure. The countermeaure are to improve the exce co-planarity or to implement the thicker metal mak to cover uch co-planarity. Not to cale Since the receptacle contact reide in the BGA ball, the IT3 i very trong for hock and vibration. (Patented Technology) Page 9

10 IT3 BGA mount yield tet at major CEM on t Solutio connect S ed gh Tet PCB appearance Teting condition overview Total PCB QTY: 190 board 95 board each at 2 major CEM Total Connector QTY: 1,900 connector Total BGA ball QTY: 902,500 ball Tet PCB tack up Tet PCB Pad deign Page 10

11 IT3 BGA mount yield tet at major CEM on t Solutio connect S ed gh Reult CEM1 CEM2 1) 2) DC MB MB DC Signal Pin Stencil Type 300 pin 200 pin 300 pin 200 pin Total Connector Teted Pin Teted 5DX Call Failure Connector Pin Connector Pin # of Conn. Call Rate % # of Pin Call Rate DPMJ # of Conn. Failure Rate % # of Pin 5mil , mil 75 42, mil , mil 75 28, Failure Rate DPMJ 5mil , mil , mil , mil , , pin 5mil , pin 5mil , pin 5mil , pin 5mil , Total Total , , , DX call rate wa 2.8%. (Flextronic changed 5DX algorithm and tried to inpect again. At the 2 nd time, call rate dropped to 0.84%. Thi mean IT3 call rate i 0.42% right now) Two BGA ball failure were confirmed out of 1,900 connector, Failure rate i 0.1%, and out of 902,500 ball, DPMJ; Defect Per Million Joint i 2.2. * Failure mode; Head-In-Pillow (Preure-Contact-open) Page 11

12 IT3 eay rework proce Rework equipment Reult Rework proce on connect St Solutio ed gh 6mm For any tacking height combination, receptacle i alway ame and it height i only 6mm. Cutomer doe not need to do any pecial proce for the rework. Alo, any pecial rework nozzle i not required for IT3 rework proce. (Standard rework nozzle work for IT3) Prior to rework proce, interpoer aembly mut be removed and pick and place tape hall be applied. Interpoer (middle part) i reuable Page 12

13 Unique interpoer deign for Signal Integrity Interpoer wafer Micro trip line tructure Up to 6.25G bp with fully populated pin aignment Over 10G bp with kipped pin aignment for differential pair Alo can be ued for power line Interpoer wafer tructure Signal Ground Signal / Ground configuration Page 13

14 IT3 Signal Integrity 1 -performing i IT3 connector were deigned d through h detailed d imulation and meaurement correlation for Gbp application. Single-ended Differential Simulation Meaurement NEXT FEXT Simulation Meaurement RL RL IL IL Board A 6 Board B 1066 Mbp 6 Via and 8 aggreor are included. NEXT FEXT 6.25 Gbp S Parameter (for IT3-17mm) Eye Diagram (at receiver of channel) Page 14

15 IT3 Signal Integrity pin Connector Throughput Running IT3 at higher data rate and lower denity can increae the throughput. Throug ghput (G bp) Skipped pin Gbp/Pair 25 Gbp/Pair Denity (%) IT Gbp/Pair 1) 20G ready with good ignal denity for many year. 2) Same deign rule can be re-ued. 3) No need to re-qualify part, or change operation. Page 15

16 IT3 Serie Variation Stacking Height 100 ignal 200 ignal 300 ignal 10 x x x 10 Socke et Int terpoer (Plug) Pb Mounting IT3M-100S-BGA(57) IT3M-200S-BGA(57) IT3M-300S-BGA(57) Pb Mating IT3D-100S-BGA(57) IT3D-200S-BGA(57) IT3D-300S-BGA(57) 300S Pb-free Mounting IT3M-100S-BGA(37) IT3M-200S-BGA(37) IT3M-300S-BGA(37) Pb-free Mating IT3D-100S-BGA(37) IT3D-200S-BGA(37) IT3D-300S-BGA(37) 14 mm Under planning Under planning IT3M-300P-14BGA300P 15 mm Under Development IT3M-200P-15BGA IT3M-300P-15BGA 17 mm Currently no plan IT3-200P-17H(03) IT3-300P-17H(03) 18 mm Under planning Under Development Under planning 20 mm IT3-100P-20H(03) IT3-200P-20H(03) IT3-300P-20H(03) 22 mm Currently no plan IT3-200P-22H(03) IT3-300P-22H(03) 25 mm IT3-100P-25H(03) IT3-200P-25H(03) 25H(03) IT3-300P-25H(03) 300P 26 mm IT3-100P-26H(03) IT3-200P-26H(03) IT3-300P-26H(03) 28 mm IT3-100P-28H(03) IT3-200P-28H(03) IT3-300P-28H(03) 30 mm Currently no plan IT3-200P-30H(03) 30H(03) IT3-300P-30H(03) 300P 30H(03) 32 mm Currently no plan IT3-200P-32H(03) IT3-300P-32H(03) 35 mm Under planning Under Development Under Development 38 mm IT3-100P-38H(03) 38H(03) IT3-200P-38H(03) 38H(03) IT3-300P-38H(03) 300P 38H(03) 40 mm Under Development IT3-200P-40H(03) IT3-300P-40H(03) IT3 family pae EIA L1 qual and IPC9702 L2 qual Note: Part number hown are Production Releaed product Page 16

17 IT3 Specification Electrical Mechanical Low-Level Contact Reitance Dielectric Withtanding Voltage Inulation Reitance 50mΩ max * 1) Mated with 17mm height interpoer 150V / 1min. 1,000MΩ / 100V Contact Current Rating 1.0A continuou duty *2) Rated voltage Contact Wiping Length 50Vrm Contact Normal Force 0.45N Contact Mating Force *1) The value of contact reitance include 2 contact point and the bulk reitance. *2) Refer to IT3 derating curve on tet report TR0636E / 9+/ 0.3mm 3mmwith recommended pacer (1.4+/ 0.3mm w/o pacer) Mating force : 45N max/ 100po ignal 90N max/ 200po ignal 135N max/ 300po ignal Durability 100 cycle Page 17

18 IT3 Specification Material and finihe Inulator Contact Ball grid termination Socket Gla reinforced polyeter (LCP) UL 94V 0 Interpoer Gla reinforced polyeter (LCP&PBT) UL 94V 0 Cupper Alloy Plating: Contact area = Gold 0.76μm over Nickel 1.5μm Mounting area = Gold 0.03μm 003μmover Nickel 1.5μm 15μm Other = Nickel 1.5μm 0.7mm Dia Eutectic : Sn63 Pb37 type Pb free : Sn Ag3.0 Cu0.5 type Page 18

19 Application Example Server ntercon Internet Router &Switche Page 19

20 Appendix 20 Page 20 ntercon

21 Hybrid type i alo available IT3HY (85&100Ω) mating / internal tructure ntercon IT3HY-100P-38H (chematic only) IT3D-100S-BGA 85Ω QPI wafer Exiting 100Ω platic wafer IT3M-100S-BGA Page 21

22 22 Page 22 ntercon

High-Speed(10 + Gbps) BGA Mezzanine Connectors

High-Speed(10 + Gbps) BGA Mezzanine Connectors High-Speed(1 + Gbps) BGA Mezzanine Connectors IT3 Series Flexibility Hirose s IT3 mezzanine connector system is as comfortable in today s data rates of PCIe and XAUI as it is in tomorrow s 1 + Gbps systems.