RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D. RoHS COMPLIANCE ITEM Halogen and Antimony Free

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1 Spec. No.: RAC-K-TS-0001 /14 Dte: Specifiction Title: Style: RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D RoS COMPIANCE ITEM logen nd Antimony Free Product specifiction contined in this specifiction re suject to chnge t ny time without notice If you hve ny questions or Purchsing Specifiction for ny qulity Agreement is necessry, plese contct our sles stff. Note: Stock conditions Temperture: +5 C +35 C Reltive humidity: 25% 75% The period of gurntee: ithin 2 yer from shipmen t y the compny. Solderility shll e stisfied. okkido Reserch Center Approvl y: T. Snnomiy Drwing y: M. Shiuy

2 RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Pge: 1/12 1. Scope 1.1 This specifiction covers the detil requirements for fixed chip resistors networks; rectngulr type, style of RAC06 2D, 06 4D, 10 2D, 10 4D, 16 4D, 16 8D. 1.2 Applicle documents JIS C : 2011, JIS C : 2006, JIS C : 2006 IEC : 2008, IEC : 2003, IEC : 2004 EIAJ RC Clssifiction Type designtion shll e the following form. (Exmple) 1. RAC 16 4 D 103 J C TP Style 2. RAC 16 4 D JP C TP Style 1 Fixed chip resistors networks; rectngulr type 2 Size 3 Numer of element Style 4 s 5 Rted resistnce 103 E24 Series, 3 digit, Ex > 10kΩ, 1000 E96 Series, 4 digit, Ex >100Ω > 10.2kΩ JP Chip jumper 6 Tolernce on rted resistnce F ±1% J ±5% 7 Terminl style C D E 8 Pckging form Convex Type ith Corner Flt Type Flt Type ow profile B T TP Bulk (loose pckge) Pper tping

3 RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Pge: 2/12 3. Rting 3.1 The rtings shll e in ccordnce with Tle 1. Style Termintions style Rted element dissiption () Rted network dissiption () Tle 1 Temperture coefficient of resistnce ( 10 6 / C) Rted resistnce rnge(ω) Preferred numer series for resistors Tolernce on rted resistnce ± ~100k F(±1%) RAC06 2D D,E ±350 10~27 E24 J(±5%) ±200 30~1M ± ~100k F(±1%) RAC06 4D D,E ±350 10~27 E24 J(±5%) ±200 30~1M ±400 3~9.1 RAC10 2D C ±300 E24 J(±5%) 10~1M RAC10 4D 0.25 ±200 ±100 F(±1%) 10~1M ±200 RAC16 4D C E24 1~9.1 J(±5%) +300~ M~10M RAC16 8D C ±200 10~1M E24 J(±5%) Style imiting element voltge(v) Mx over lod voltge(v) Numer of element RAC06 2D RAC06 4D 4 RAC10 2D RAC10 4D RAC16 4D RAC16 8D Note. Rted current of chip jumper: 1(A) Note. Resistnce vlue of chip jumper: 50mΩ mx. networks D (Independence type) Ctegory temperture rnge( C) Derting The derted vlues of dissiption (or current rting in cse of chip jumper) t temperture in excess of 70 C shll e s indicted y the following curve. Percentge 100 of the rted dissiption (Current) (%) 0 55 Are of recommended opertion Amient temperture ( C) Figure 1Derting curve

4 RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Pge: 3/ Rted voltge d. c. or. c. r. m. s. voltge clculted from the squre root of the product of the rted resistnce nd the rted dissiption. E : Rted voltge (V) E = P R P : Rted dissiption () R : Rted resistnce (Ω) imiting element voltge cn only e pplied to resistors when the resistnce vlue is equl to or higher thn the criticl resistnce vlue. At high vlue of resistnce, the rted voltge my not e pplicle. So clled RCV (Rted continuous working Voltg) is determined y 4. Pckging form The stndrd pckging form shll e in ccordnce with Tle 2. Tle 2 Symol Pckging form Stndrd pckging quntity / units Appliction B Bulk (loose pckge) 1,000 pcs. RAC06, 10,16 T Pper tping 8mm width, 2mm pitches 10,000 pcs. RAC06 2D, 4D, RAC10 2D, 4D TP Pper tping 8mm width, 4mm pitches 5,000 pcs. RAC16 4D, 8D

5 RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Pge: 4/12 5. Dimensions The resistor shll e of the design nd physicl dimensions in ccordnce with elow. 5.1 Termintions style:e RAC06 2D RAC06 4D P P Q Q R 1 R 2 R 1 R 2 R 3 R 4 R 1 = R 2 R 1 = R 2 = R 3 = R 4 Figure 2 Tle 3 Figure 3 Style Termintions style Q P RAC06 2D E 0.8± ± ± ± ± ± RAC06 4D E 1.4± ± ± ± ± ± Reference Net weight (Reference) Style Termintions style Net weight(mg) RAC06 2D E 0.38 RAC06 4D E 0.65

6 RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Pge: 5/ Termintions style:d RAC06 2D RAC06 4D P P Q Q R 1 R 2 R 1 R 2 R 3 R 4 R 1 = R 2 R 1 = R 2 = R 3 = R 4 Figure 4 Tle 4 Figure 5 Style Termintions style Q P RAC06 2D D 0.8± ± ± ± ± ± RAC06 4D D 1.4± ± ± ± ± ± Reference Net weight (Reference) Style Termintions style Net weight(mg) RAC06 2D D 0.56 RAC06 4D D 0.98

7 RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Pge: 6/ RAC10 2D 5.4 RAC10 4D P Q1 P Q 1 Q 2 R 1 R 2 R 1 R 2 R 3 R 4 R 1 = R 2 R 1 = R 2 = R 3 = R 4 Figure 6 Tle 5 Figure 7 Style Termintions style Q or Q 1 Q 2 RAC10 2D C 1.0± ± ± ± RAC10 4D C 2.0± ± ± ± ±0.1 Style P RAC10 2D 0.2± ± Reference RAC10 4D 0.2± ± Net weight (Reference) Style Termintions style Net weight(mg) RAC10 2D C 1.1 RAC10 4D C 2.1

8 RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Pge: 7/ RAC16 4D P Q 1 Q 2 R 1 R 2 R 3 R 4 R 1 = R 2 = R 3 = R 4 Figure 8 Tle 6 Style Termintions style Q 1 RAC16 4D C 3.2± ± ± ± ±0.1 Style Q 2 P Reference RAC16 4D 0.3± ± Net weight (Reference) Style Termintions style Net weight(mg) RAC16 4D C 7

9 RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Pge: 8/ RAC16 8D P Q R 1 R 2 R 3 R 4 R 5 R 6 R 7 R 8 R 1 = R 2 = R 3 = R 4 = R 5 = R 6 = R 7 = R 8 Figure 9 Tle 7 Style Termintions style Q RAC16 8D C 3.8± ± ± ± ±0.1 Reference Style *P RAC16 8D 0.3± Net weight (Reference) Style Termintions style Net weight(mg) RAC16 8D C Mrking The Rted resistnce of RAC06 2D, 4D, RAC10 2D should not e mrked. 6.1 For the resistors The rted resistnce shll e mrked in 3 digits (E24) nd mrked on over cot side. Mrking exmple Contents [Ω] 12 [kω] 6.2 For the Jumper Chip Mrking exmple Contents 000 JP

10 RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Pge: 9/12 7. Performnce 7.1 The stndrd condition for tests shll e in ccordnce with Su cluse 4. 2, JIS C : The performnce shll e stisfied in Tle 8. Tle 8(1) No. Test items Condition of test (JIS C ) Performnce requirements 1 Resistnce Su cluse 4.5 As in The resistnce vlue shll correspond with the rted resistnce tking into ccount the specified tolernce. Chip jumper: 50mΩ mx. 2 Temperture chrcteristic of resistnce 4.8 Nturl resistnce chnge per chnge in degree centigrde. R2-R1 TCR(10-6 /Ω)= x 10 6 R1(t2-t1) t1 : 20 C C, t2: 125 C C -1-1 R1 : Resistnce t t1 temperture R2 : Resistnce t t2 temperture 3 Short time overlod 4.13 Test voltge: 2.5 times RCV Test period: 5s. Test potentil should not exceed mx. overlod voltge s shown in Tle-1. 4 Resistnce to soldering het 4.18 Test y piece. Temp. of solder th:260±5 C Immersion time: 10±1s After immersion into solder leving the room temp. for 1h or more, nd then mesure the resistnce. 5 Solderility 4.17 Test y piece. Flx: Rosin-Methnol Temp. of solder th: 235±5 C Immersion time: 2±0.5s 6 Temperture cycling 4.19 Test cycle: 5 cycles for duty cycle s specified elow. Step Temperture( C) Time(min.) 1-55± ~ ± ~3 See Tle 1. Resistor: R/R: ithin ±(2%+0.1Ω) Chip jumper: 50mΩ mx. No visile dmge Resistor: R/R: ithin ±(1%+0.05Ω) Chip jumper: 50mΩ mx. No evidence of ppernce dmge. 95% coverge min., good tinning nd no visile dmge. Resistor: R/R: ithin ±(1%+0.05Ω) Chip jumper: 50mΩ mx. No visile dmge

11 RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Pge: 10/12 Tle 8(2) No. Test items Condition of test (JIS C ) Performnce requirements 7 od life 4.25 Test temp.: 70±2 C Test voltge: Cycle of 1h 30min. ON nd 30min. OFF t dc rted voltge. Test period: 1,000 h 8 od life in humidity 4.24 Test condition: 40±2 C & 90~95% R.. Test voltge: Cycle of 1h 30min. ON nd 30min. OFF t dc rted voltge Test period: 1,000 h 9 Adhesion 4.32 Pressurizing force: 5N ( RAC06: 3N) Test time: 10±1sec. 10 Insultion resistnce 4.6 Test voltge: Mx. overlod voltge (DC) Test period: 1min. 11 Dielectric withstnding voltge 4.7 Test voltge: Mx. overlod voltge (AC) Test period: 1min. Resistor: R/R: ithin ±(3%+0.1Ω) Chip jumper: 50mΩ mx. No visile dmge Resistor: R/R: ithin ±(3%+0.1Ω) Chip jumper: 50mΩ mx. No visile dmge No remrkle dmge or removl of the termintions R 1GΩ No flshover, fire nd rekdown.

12 RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Pge: 11/12 8. Tping 8.1 Applicle documents JIS C : 2014, EIAJ ET 7200C: Tping dimensions RAC06 2D,RAC06 4D,RAC10 2D, RAC10 4D (Pper tping, 8mm width, 2mm pitches) Tping dimensions shll e in ccordnce with Figure 10 nd Tle 9. Sprock et hole φ ± ±0.1 A B 8±0.3 t Crrier cvity 2±0.05 Direction of unreeling Figure 10 Tle 9 Style A B t RAC06 2D 0.9± ±0.1 RAC06 4D 1.5± ±0.1 RAC10 2D 1.15± ± mx. RAC10 4D 1.2± ± mx. 3.5± RAC16 4D, RAC16 8D (Pper tping, 8mm width, 4mm pitches) Tping dimensions shll e in ccordnce with Figure 11 nd Tle 10. Sprocket hole 4±0.1 φ ± ±0.1 A B C t Crrier cvity 4± ±0.05 Direction of unreeling Figure 11 Tle 10 Style A B C t RAC16 4D 2.0± ± mx. 8.0±0.3 RAC16 8D 1.9± ± mx.

13 RAC06 2D, RAC06 4D, RAC10 2D, RAC10 4D, RAC16 4D, RAC16 8D Pge: 12/ Reel dimension Reel dimensions shll e in ccordnce with the following Figure 12 nd Tle 11. 2±0.5 Mrking φ60±1 φ13±0.2 φ178±2 Figure 12 Tle 11 Style A RAC06,10,16 9±0.5 Note: Mrking lel shll e mrked on plce of Mrking A or two plce of mrking A nd B. 9. Mrking on pckge The lel of minimum pckge shll e legily mrked with follows. 9.1 Mrking A (1) Clssifiction (Style, Rted resistnce, Tolernce on rted resistnce, Terminl style, Pckging form) (2) Quntity (3) ot numer (4) Mnufcturer s nme or trde mrk (5) Others 9.2 Mrking B (KAMAYA Control lel) A