Metal Element Current Sense Resistor

Transcription

1 Metl Element Current Sense Resistor UR Series Robust metl strip ble to withstnd high temperture nd high current. ow TCR nd Inductnce Resistnce Rnge from m to 15 m Power rtings from 1W to 3W in 1206, 2010 nd 2512 chip size Designed for current sense circuits in power electronic systems Higher wttge devices feture PCB clernce gp to mximize therml performnce Electricl Dt IRC Type Coting 2 Power rting t 80 C (Wtts 1206 Chip Size Stndrd Resistnce Vlues (m 1 TCR (±ppm/ C Tolernce (±% Dielectric Withstnding Voltge (Volts URG1 Green 1 1, 2, 3, 5, 7, , Chip Size URG15 Green 1.5 1, 2, 3, 5, 7, , Chip Size URG1 1 11, 12, URG2 2 7, 8, 9, URG25 Green 2.5 4, 4.5, 5, 6 50 URG3 3 URB1 Blck 1, , 1.5, 2, 2.5, , , , 7 75 URB2 2, 0.75, 1, 1.5, , Notes: 1 Non-stndrd resistnce vlues vilble (contct fctory. For resistnce vlues bove 20 m, plese refer to our RC / RF / RMA series. 2 Blck coting = wve or IR re ow soldering; Green coting = IR re ow solder. Wve re ow - solder msk must mtch the W nd D dimensions on pge 2 of dt sheet. 3 Pckge sizes 2010 nd 1206 with the green coting re uncoted on the top surfce nd unmrked for resistnce vlue. Environmentl Dt Test Short Term Overlod (5x rted power for 5 seconds R/R ± % + m (blck; R/R ± 1% (green od t rted power (1000 hours cyclic 70 C R/R ± 1% + m (blck; R/R ± 1% (green Tempertture Cycling (-55 C to +150 C; 1000 cycles R/R ± % + m (blck; R/R ± 1% (green Dry Het (+170 C, no lod; 1000 hours R/R ± 1% + m (blck; R/R ± 1% (green Resistnce to Solder Het (260 C for 10 seconds R/R ± % + m (blck; R/R ± 1% (green Solderbility (235 C for 2 seconds Minimum 95% coverge Resistnce to Solvents No deteriortion of protective coting or mrking Operting Temperture -55 C to 170 C Generl Note IRC reserves the right to mke chnges in product speci ction without notice or libility. All informtion is subject to IRC s own dt nd is considered ccurte t time of going to print. Telephone: Fcsimile: Website: A Subsidiry of TT electronics plc UR Issue December 2009 Sheet 1 of 6

2 Physicl Dt W D T Coting Resistnce Vlue (m W T D 1206 Chip Size (1 Wtt Green ± ± ± ± Chip Size (1.5 Wtt Green ± ± ± ± Chip Size (1 Wtt, 2 Wtt, 2.5 Wtt, nd 3 Wtt Green Blck 2.68 ± ± ± ± ± ± ± ± ± ± ± ± Dimensions re for reference only 1.4 ± ± ± ± ± ± ± ± ± ± ± ± ± ± 0.38 Telephone: Fcsimile: Website: UR Issue December 2009 Sheet 2 of 6

3 Electricl Connections 4-wire pd lyout wire pd lyout wire mesurement points unit: mm unit: mm unit: mm Probe di. 4-wire pd lyout wire pd lyout wire mesurement points unit: mm unit: mm unit: mm Probe di. 4-wire pd lyout wire pd lyout wire mesurement points unit: mm unit: mm unit: mm Probe di. Pckge Resistnce (m-ohm Blck All Green Pckge Green Green Resistnce (m-ohm Green prts require the use of D dimensions on pge 2 for prts being ssembled in wve re ow processes. Telephone: Fcsimile: Website: UR Issue December 2009 Sheet 3 of 6

4 Construction Blck Type A low TCR resistnce lloy plte with plted connection bnds is protectively coted nd numericlly mrked with the resistnce vlue, s described in Product Mrking. This version hs stndrd plted connection nd is suitble for wve or IR re ow soldering processes. Power Derting Curve Rted Power (% Ambient Temperture ( C Green Type A low TCR lloy plte is grooved to set the nl resistnce. The lower fces re solder plted for connections, nd the top surfce is protectively coted nd numericlly mrked with the resistnce vlue, s described in Product Mrking. This prt is suitble for wve nd IR re ow soldering processes. Wve re ow requires the solder msk to be dimensioned ccording to pge 2 using the W nd D dimensions of the prt. The power derting curve is guidnce bsed on conservtive design model. The UR is solid metl lloy construction tht cn withstnd signi cntly greter operting tempertures thn the conservtive model permits. The protective coting will operte up to 260 C nd the lloy cn withstnd in excess of 350 C. Therefore, the system therml design will be more signi cnt design prmeter due to the het limittions of the solder joint. Plstic Tpe Speci ction Top Tpe ψ D 0 A B E F W T Emboss Tpe Resistor ψ D 1 1.4Min. P1 P2 P0 direction of unreeling Size 2512 Resistnce (m A B W E F P 0 P 1 P 2 D 0 D 1 T ± , min. 0.81± ±0.1 12± ± ±0.05 4±0.1 4±0.1 2± ± , min. 0.80± ± ±0.1 12± ± ±0.05 4±0.1 4±0.1 2± ± min. 0.85± ± ±0.1 8± ± ±0.05 4±0.1 4±0.1 2± ± min. 0.87± The cumultive tolernce of 10 sprocket hole pitch is ± 0.2 mm. Crrier cmber shll not be more thn 1 mm per 100 mm through length of 250 mm. A & B mesured 0.3 mm from the bottom of the pcket. T mesured t point on the inside bottom of the pcket to the top surfce of the crrier. Pocket position reltive to sprocket hole is mesured s the true position of the pocket nd not the pocket hole. Telephone: Fcsimile: Website: UR Issue December 2009 Sheet 4 of 6

5 IRC Solder Re ow Recommendtions Sn-Pb Eutectic nd Pb-Free Reflow Profiles t P T P Rmp-up Criticl Zone T to T P T t Temperture T smx T smin ts Prehet Rmp-down 25 t 25 C to Pek Time * Bsed on Industry Stndrds nd IPC recommendtions Pro le Feture Sn-Pb Eutectic Assembly Pb-Free Assembly Averge Rmp-up rte (T smx to T p 3 C / second mx. 3 C / second mx. Prehet - Temperture Min (T smin - Temperture Mx (T smx - Time (T smin to T smx (ts Time mintined bove - Temperture (T - Time (t 100 C 150 C seconds 183 C seconds 150 C 200 C seconds 217 C seconds Pek Temperture (T P See Tble 1 See Tble 2 Time within 5 C of ctul Pek Temperture (tp seconds seconds Rmp-down Rte 6 C / second mx. 6 C / second mx. Time 25 C to Pek Temperture 6 minutes mx. 8 minutes mx. Note 1: All tempertures refer to topside of the pckge, mesured on the pckge body surfce. Note 2: Time within 5 C of ctul pek temperture (tp speci ed for the re ow pro les is supplier minimum nd user mximum. Pckge Thickness Tbel 1: SnPb Eutectic Process - Pckge Pek Re ow Tempertures Volume mm 3 < 350 Volume mm < 2.5 mm /-5 C /-5 C 2.5 mm /-5 C /-5 C Pckge Thickness Tbel 2: Pb-free Process - Pckge Pek Re ow Tempertures Volume mm 3 < 350 Volume mm Volume mm 3 > 2000 < 1.6 mm 260 C * 260 C * 260 C * 1.6 mm mm 260 C * 250 C * 245 C * 2.5 mm 250 C * 245 C * 245 C * Note 1: Pckge volume excludes externl terminls (blls, bumps, lnds, leds nd/or non-integrl het sinks. Note 2: The mximum component temperture reched during re ow depends on pckge thickness nd volume. The use of convection re ow processess reduces the therml grdients between pckges. However, therml grdients due to differences in therml mss of SMD pckges my still exist. Note 3: Components intended for use in ledfree ssembly process shll be evluted using the led-free pek temperture nd pro les de ned in Tble 1, 2 nd re ow pro le whether or not led-free. * Tolernce: The device mnufcturer/supplier shll ssure process comptibility up to nd including the stted clssi ction temperture t the rted MS level. Telephone: Fcsimile: Website: UR Issue December 2009 Sheet 5 of 6

6 Pckging Quntity Series Emboss Plstic Tpe , , ,000 Ordering Dt Specify type, resistnce, tolernce, ROHS complince nd pckging. Exmple: Metl Element Current Sense Resistor, 1-wtt, 10 m resistor. Smple Prt No. UR G R010 F F ST IRC Type Coting Color Code G = Green, B = Blck Power Rting (see specs tble Pckge Size Resistnce Vlue (EIA 4-digit code Exmple: = R010 Tolernce (EIA formt F = 1% J = 5% RoHS - Complince F = RoHS complint Construction Pckging ST = Stndrd ed Tpe Product Mrking Prt resistnce is indicted by using two mrking nottion syles: 4-digit: R002 = 2 m ; R designtes the deciml loction in ohms. 3-digit: 1M5 = 1.5 m ; M designtes the deciml loction in milliohm. Telephone: Fcsimile: Website: UR Issue December 2009 Sheet 6 of 6