AMD Radeon Vega Frontier Edition

Transcription

1 AMD Radeon Vega Frontier Edition 2.5D & 3D Packaging SPIL CoW last Samsung HBM2 Adv. Packaging report by Romain FRAUX November 2017 Version 1 21 rue la Noue Bras de Fer NANTES - FRANCE info@systemplus.fr System Plus Consulting AMD Radeon Vega Frontier Edition 1

2 Table of Contents 3 o Executive Summary o Reverse Costing Methodology Company Profile 7 o 2.5D & 3D Packaging Market o AMD Company Profile o AMD Radeon Vega Frontier Edition Characteristics o Vega GPU Supply o Globalfoundries o SPIL 2.5D Process Flow o Samsung HBM2 20 o o o o o o o o Summary of the Methodology AMD Radeon Frontier Edition Teardown Package Views & Dimensions Passives Assembly DRAM Die View, Dimensions & Marking µbumps & TSVs Package Cross-Section Laminate & Frame Cross-Section Interposer Cross-Section GPU Cross-Section 8-Hi HBM2 Stack Cross-Section Comparison with AMD Fury X including SK-Hynix HBM1 Comparison with NVIDIA Tesla P100 including Samsung 4-Hi HBM2 72 o Global Overview o GPU Process Description & Foundry o Interposer Process Flow & Foundry o HBM2 Stack Process Flow & Foundry o CoW Process Flow & Foundry 97 o Summary of the cost analysis o Yields Explanation & Hypotheses o GPU Front-End & Die Cost o HBM2 Stack o o o Interposer TSV Manufacturing Cost Micro-Bumping Manufacturing Cost Dies Cost (DRAM + Logic) 8-Hi HBM2 Stack Cost TSV Manufacturing Cost Microbumping Cost Interposer Cost CoW & Final Assembly Manufacturing Cost Final Component Cost Estimated Price Analysis 118 o Manufacturer Financial Ratios o Component Manufacturer Price Company services System Plus Consulting AMD Radeon Vega Frontier Edition 2

3 O V E R V I E W METHODOLOGY 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 3

4 Executive Summary o Executive Summary o Reverse Costing Methodology o Glossary 2 years after the release of the Radeon fury X using the world s first HBM integrated on chip, AMD presented at CES 2017 the Radeon Vega GPU featuring second generation of HBM. The analyzed version of the graphic card is the Radeon Vega Frontier Edition, exhibiting 13/25 TFLOPS and 16GB High Bandwidth Cache assembled in two 8-Hi HBM2 stacks. Packaged in a smaller, 47x47mm 10-layer fcbga, the component uses more than 2,800mm² of silicon area, highlighting an impressive silicon / package ratio. Compared to NVIDIA which uses only one major source (TSMC) for the manufacturing of the Pascal GPU, AMD choose to use multiple sources for the production of the Vega GPU. Indeed, the GPU die is made by Globalfoudries, featuring a 14nm FinFET process and 12.5 billion transistors. The interposer, with via-middle TSV, is provided by UMC which was also the provider for the Radeon Fury X. Regarding the 2.5D assembly of the component, two sources has been identified, with SPIL estimated to be the major one. The process used is supposed to be SPIL's Chip on Wafer after TSI backside process (CoW last). Regarding the HBM2, only two stacks of 8GB are used to obtain the 16GB capacity. As for NVIDIA, Samsung is the provider of the HBM2 stacks, whereas SK-Hynix was the supplier for previous Radeon Fury X. The 8GB HBM2 consists of eight 1GB HBM2 dies and a buffer die at the bottom of the stack, which are all vertically interconnected by TSVs and microbumps. The report includes a complete physical analysis of the packaging process, with details on all technical choices regarding process, equipment and materials. Also, the complete manufacturing supply chain is described and manufacturing costs are calculated. The report compares the Radeon Vega solution with NVIDIA Tesla P100, highlighting the choices made by both companies in term of integration. Also, the report features a comparison with AMD s Fury X, which uses HBM1 and 2.5D assembly, to explain the interest in evolution through the HBM2 and CoW 2.5D platforms System Plus Consulting AMD Radeon Vega Frontier Edition 4

5 Reverse Costing Methodology o Executive Summary o Reverse Costing Methodology o Glossary The reverse costing analysis is conducted in 3 phases: Teardown analysis Package is analyzed and measured The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking Setup of the manufacturing process. Costing analysis Setup of the manufacturing environment Cost simulation of the process steps Selling price analysis Supply chain analysis Analysis of the selling price 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 5

6 AMD Radeon Vega Frontier Edition Characteristics o 2.5D & 3D Packaging Market o AMD Profile o AMD Radeon Vega Characteristics o Vega GPU Supply o Globalfoundries o SPIL 2.5D Process o Samsung HBM2 AMD Radeon Vega Frontier Edition with Vega 10 GPU Vega architecture with 16GB of HBM2 AMD Radeon Vega Frontier Edition Specs Source: AMD 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 6

7 Summary of the o Summary o Graphic Card Teardown o Package o Dies Size o DRAM Dies o Cross-Section Substrate o Cross-Section Interposer o Cross-Section GPU o Cross-Section HBM Stack o Comparison TSV Diam. m Pitch µm Interposer GPU Die TSV Diam. µm Pitch µm DRAM Die DRAM Die DRAM Die DRAM Die DRAM Die DRAM Die DRAM Die DRAM Die Logic Die µbumps Diam. µm Pitch µm µbumps Diam. µm Pitch µm Flip-chip Bump Diam. µm Pitch µm BGA Bump Diam. µm Pitch mm BGA Package Substrate PACKAGE STRUCTURE: 3D Packaging: 9 stacked dies with TSV & µbumps (HBM stack). 2.5D Packaging: HBM stack and GPU stacked with µbumps on a silicon interposer holding TSV. Flip-chip BGA: silicon interposer flip-chipped to a 10-layers PCB substrate 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 7

8 Package Views & Dimensions o Summary o Graphic Card Teardown o Package o Dies Size o DRAM Dies o Cross-Section Substrate o Cross-Section Interposer o Cross-Section GPU o Cross-Section HBM Stack o Comparison 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 8

9 Package Cross-Section Laminate Substrate o Summary o Graphic Card Teardown o Package o Dies Size o DRAM Dies o Cross-Section Substrate o Cross-Section Interposer o Cross-Section GPU o Cross-Section HBM Stack o Comparison 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 9

10 Package Cross-Section Interposer o Summary o Graphic Card Teardown o Package o Dies Size o DRAM Dies o Cross-Section Substrate o Cross-Section Interposer o Cross-Section GPU o Cross-Section HBM Stack o Comparison 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 10

11 Package Cross-Section HBM2 Stack o Summary o Graphic Card Teardown o Package o Dies Size o DRAM Dies o Cross-Section Substrate o Cross-Section Interposer o Cross-Section GPU o Cross-Section HBM Stack o Comparison 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 11

12 Package Cross-Section HBM2 Stack o Summary o Graphic Card Teardown o Package o Dies Size o DRAM Dies o Cross-Section Substrate o Cross-Section Interposer o Cross-Section GPU o Cross-Section HBM Stack o Comparison 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 12

13 AMD Radeon Vega vs AMD Radeon Fury X Structure Comparison with AMD Radeon Fury X 3x more throughput (FP16 Teraflops) o Summary o Graphic Card Teardown o Package o Dies Size o DRAM Dies o Cross-Section Substrate o Cross-Section Interposer o Cross-Section GPU o Cross-Section HBM Stack o Comparison 4x more memory, 8x capacity/stack GPU 28nm (xxxmm²) HBM Stack: 4 stacked dies of 256KB = 1GB HBM2 Stack: 8 stacked dies of 1GB = 8GB 55 mm x 55 mm BGA Package HBM 4 x 4 stacked memory dies 4GB Memory HBM2 2 x 8 stacked memory dies 16GB Memory 47 mm x 47 mm BGA Package GPU 14nm FinFET (xxxmm²) Laminate substrate (10 layers PCB) AMD Radeon Fury X GPU & HBM Integration 2017 by System Plus Consulting Silicon Interposer (xxxmm²) Laminate substrate (10 layers PCB) AMD Radeon Vega GPU & HBM2 Integration 2017 by System Plus Consulting Silicon Interposer (xxxmm²) 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 13

14 Global Overview SPIL CoW last Process Steps: o Global Overview o GPU Process o GPU Wafer Fab Unit o HBM Process o HBM Wafer Fab Unit o Interposer Process o Interposer Wafer Fab Unit o CoW Process o CoW Assembly Unit o Final Assembly Process o Final Assembly Unit 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 14

15 Interposer TSV Process Flow (1/2) o Global Overview o GPU Process o GPU Wafer Fab Unit o HBM Process o HBM Wafer Fab Unit o Interposer Process o Interposer Wafer Fab Unit o CoW Process o CoW Assembly Unit o Final Assembly Process o Final Assembly Unit Interposer Interposer Si 300mm wafer TSV etch: DRIE Interposer C4F8 / SF6 Interposer Oxide Liner Interposer Oxide liner deposition: SiO2 PECVD Interposer drawing not to scale 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 15

16 Main Steps of Economic Analysis o Summary o Supply o Yields o GPU Cost o HBM Stack Cost o Interposer Cost o CoW Assembly Cost o Component Cost 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 16

17 HBM TSV Manufacturing Cost o Summary o Supply o Yields o GPU Cost o HBM Stack Cost o Interposer Cost o CoW Assembly Cost o Component Cost 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 17

18 DRAM Microbumping Cost o Summary o Supply o Yields o GPU Cost o HBM Stack Cost o Interposer Cost o CoW Assembly Cost o Component Cost 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 18

19 DRAM Wafer & Die Cost o Summary o Supply o Yields o GPU Cost o HBM Stack Cost o Interposer Cost o CoW Assembly Cost o Component Cost 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 19

20 HBM Stack Cost o Summary o Supply o Yields o GPU Cost o HBM Stack Cost o Interposer Cost o CoW Assembly Cost o Component Cost 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 20

21 Total Interposer Wafer Cost (TSV + µbump) o Summary o Supply o Yields o GPU Cost o HBM Stack Cost o Interposer Cost o CoW Assembly Cost o Component Cost 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 21

22 Chip-on-Wafer (CoW) Stack Wafer Cost o Summary o Supply o Yields o GPU Cost o HBM Stack Cost o Interposer Cost o CoW Assembly Cost o Component Cost 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 22

23 Related Reports o Company services o Related Reports o Feedbacks o Contact o Legal REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING PACKAGING NVIDIA Tesla P100 GPU with HBM2 Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM and DSP NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package TSMC Integrated Fan-Out Package AMD High-Bandwidth Memory Samsung 3D TSV Stacked DDR4 DRAM MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT ADVANCED PACKAGING 3D TSV and 2.5D Business Update - Market and Technology Trends 2017 Equipment and Materials for 3D TSV Applications 2017 PATENT ANALYSIS - KNOWMADE ADVANCED PACKAGING TSV Stacked Memory Patent Landscape Analysis 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 23

24 COMPANY SERVICES 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 24

25 Business Models Fields of Expertise o Company services o Related Reports o Feedbacks o Contact o Legal Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 25

26 Contact PHOENIX YOLE Inc. FRANKFURT/MAIN Europa Sales Office NANTES Headquarter LYON YOLE HQ KOREA YOLE TOKYO YOLE KK o Company services o Related Reports o Feedbacks o Contact o Legal GREATER CHINA YOLE Headquarters 21 rue La Noue Bras de Fer Nantes FRANCE sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA (310) laferriere@yole.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr 2017 System Plus Consulting AMD Radeon Vega Frontier Edition 26

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