NVIDIA Tesla P100 GPU with HBM2

Transcription

1 NVIDIA Tesla P100 GPU with HBM2 2.5D & 3D Packaging TSMC CWS Samsung HBM2 Adv. Packaging reprt by Rmain FRAUX August 2017 Versin 1 21 rue la Nue Bras de Fer NANTES - FRANCE inf@systemplus.fr System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 1

2 Table f Cntents 3 Executive Summary Reverse Csting Methdlgy Cmpany Prfile 7 2.5D & 3D Packaging Market NVIDIA Cmpany Prfile NVIDIA Tesla P100 Characteristics Pascal GPU Supply TSMC CWS Samsung HBM2 17 Synthesis f the Methdlgy NVIDIA Tesla P100 Teardwn Package Views & Dimensins Passives Assembly DRAM Die View, Dimensins & Marking µbumps & TSVs Package Crss-Sectin Laminate & Frame Crss-Sectin Interpser Crss-Sectin GPU Crss-Sectin HBM2 Stack Crss-Sectin Cmparisn with AMD Fury X including SK-Hynix HBM1 65 Glbal Overview GPU Prcess Descriptin & Fundry Interpser Prcess Flw & Fundry HBM2 Stack Prcess Flw & Fundry CWS Prcess Flw & Fundry 95 f the cst analysis Yields Explanatin & Hyptheses GPU Frnt-End & Die Cst HBM2 Stack Interpser Frnt-End Cst (DRAM + Lgic) TSV Manufacturing Cst Micr-Bumping Manufacturing Cst Dies Cst (DRAM + Lgic) HBM2 Stack Cst TSV Manufacturing Cst Wafer Cst Interpser Cst Package Substrate Cst CWS Assembly Manufacturing Cst Final Cmpnent Cst Estimated Price Analysis 126 Manufacturer Financial Ratis Cmpnent Manufacturer Price Cmpany services System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 2

3 Executive Summary Executive Summary Reverse Csting Methdlgy Glssary Targeted fr High Perfrmance Cmputing (HPC) and deep learning, the NVIDIA Tesla P100 is the wrld's first artificial intelligence supercmputing data center GPU. It uses varius leading edge technlgies, including 3D stacked memry with 2.5D integratin n a silicn interpser in a Chip-n-Wafer-n-Substrate (CWS) prcess. Imprving memry perfrmance threefld ver the NVIDIA Maxwell architecture, the Tesla P100 acceleratrs are equipped with 12GB r 16GB f secnd generatin high bandwidth memry (HBM2). HBM2 greatly increases memry capacity and bandwidth ver first generatin HBM1 technlgy. HBM1 was limited t 1GB f memry per stack f fur dynamic randm access memry (DRAM) die with maximum capacity f 256MB and 125GB/sec f bandwidth. That cmpares t 8GB f memry per stack f eight stacked DRAM die with maximum capacity f 1GB and 180GB/sec bandwidth fr HBM2. The single 55mm x 55mm 12-layer ball grid array (BGA) package f the NVIDIA Tesla P100 includes mre than 3,500 mm² f silicn area. Tw industry leaders, TSMC and Samsung, had t cme tgether t deliver this much silicn area in a package. TSMC is the main prvider fr the Tesla P100. Using its 2.5D CWS platfrm, it manufactures the GP100 GPU die, featuring a 16nm FinFET prcess and 15.3 billin transistrs. It als prduces a large silicn interpser n tp f which the GPU is assembled at the wafer-level with its fur HBM2 stacks. Samsung prvides the HBM2 stacks. A 3D assembly prcess yields HBM2 stacks cmpsed f fur 1GB DRAM memry dies and ne buffer die, cnnected with via-middle thrugh-silicn vias and micr-bumps. The reprt includes a cmplete physical analysis f the packaging prcess, with details n all technical chices regarding prcess, equipment and materials. Als, the cmplete manufacturing supply chain is described and manufacturing csts are calculated. The reprt als cmpares the Tesla P100 with AMD s Fury X, which uses HBM1 and 2.5D assembly, t explain the interest in evlutin thrugh the HBM2 and CWS 2.5D platfrms. Finally, it describes NVIDIA s key mdule design and related prcess chices System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 3

4 Reverse Csting Methdlgy Executive Summary Reverse Csting Methdlgy Glssary The reverse csting analysis is cnducted in 3 phases: Teardwn analysis Package is analyzed and measured The dies are extracted in rder t get verall data: dimensins, main blcks, pad number and pin ut, die marking Setup f the manufacturing prcess. Csting analysis Setup f the manufacturing envirnment Cst simulatin f the prcess steps Selling price analysis Supply chain analysis Analysis f the selling price 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 4

5 NVIDIA Telsa P100 Characteristics 2.5D & 3D Packaging Market NVIDIA Prfile NVIDIA Tesla P100 Characteristics Pascal GPU Supply TSMC CWS Samsung HBM2 NVIDIA Tesla P100 with Pascal GP100 GPU Pascal architecture fr data center 21 TeraFLOPS f FP16, 10 TeraFLOPS f FP32, and 5 TeraFLOPS f FP64 Deep learning and HPC applicatins Memry Bandwidth: 732 GB/s Passive heat sink fr cling (bidirectinal) 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 5

6 Synthesis f the Graphic Card Teardwn Package Dies Size DRAM Dies Crss-Sectin - Substrate Crss-Sectin Interpser Crss-Sectin GPU Crss-Sectin HBM Stack Cmparisn TSV Diam. xµm Pitch xµm GPU Die Interpser TSV Diam. xµm Pitch xµm DRAM Die DRAM Die DRAM Die DRAM Die Lgic Die µbumps Diam. xµm Pitch xµm µbumps Diam. xµm Pitch xµm Flip-chip Bump Diam. xµm Pitch xµm BGA Bump Diam. xµm Pitch xmm PCB Substrate PACKAGE STRUCTURE: 3D Packaging: 5 stacked dies with TSV & µbumps (HBM stack). 2.5D Packaging: HBM stack and GPU stacked with µbumps n a silicn interpser hlding TSV. Flip-chip BGA: silicn interpser flip-chipped t a 12-layers PCB substrate 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 6

7 Package Views & Dimensins Graphic Card Teardwn Package Dies Size DRAM Dies Crss-Sectin - Substrate Crss-Sectin Interpser Crss-Sectin GPU Crss-Sectin HBM Stack Cmparisn 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 7

8 Package Views & Dimensins Graphic Card Teardwn Package Dies Size DRAM Dies Crss-Sectin - Substrate Crss-Sectin Interpser Crss-Sectin GPU Crss-Sectin HBM Stack Cmparisn 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 8

9 Dies Size Graphic Card Teardwn Package Dies Size DRAM Dies Crss-Sectin - Substrate Crss-Sectin Interpser Crss-Sectin GPU Crss-Sectin HBM Stack Cmparisn 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 9

10 Package Crss-Sectin Laminate Substrate Graphic Card Teardwn Package Dies Size DRAM Dies Crss-Sectin - Substrate Crss-Sectin Interpser Crss-Sectin GPU Crss-Sectin HBM Stack Cmparisn 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 10

11 Package Crss-Sectin Interpser Graphic Card Teardwn Package Dies Size DRAM Dies Crss-Sectin - Substrate Crss-Sectin Interpser Crss-Sectin GPU Crss-Sectin HBM Stack Cmparisn 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 11

12 Package Crss-Sectin HBM2 Stack Graphic Card Teardwn Package Dies Size DRAM Dies Crss-Sectin - Substrate Crss-Sectin Interpser Crss-Sectin GPU Crss-Sectin HBM Stack Cmparisn 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 12

13 HBM TSV Prcess Flw (1/2) Glbal Overview GPU Prcess GPU Wafer Fab Unit HBM Prcess HBM Wafer Fab Unit Interpser Prcess Interpser Wafer Fab Unit Final Assembly Prcess Final Assembly Unit 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 13

14 Main Steps f Ecnmic Analysis 4 Supply Yields GPU Cst HBM Stack Cst Interpser Cst Assembly Cst Cmpnent Cst 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 14

15 GPU Wafer & Die Cst Supply Yields GPU Cst HBM Stack Cst Interpser Cst Assembly Cst Cmpnent Cst 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 15

16 TSV Manufacturing Cst per prcess steps Supply Yields GPU Cst HBM Stack Cst Interpser Cst Assembly Cst Cmpnent Cst 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 16

17 HBM2 Stack Cst Supply Yields GPU Cst HBM Stack Cst Interpser Cst Assembly Cst Cmpnent Cst 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 17

18 Cmpnent Cst Supply Yields GPU Cst HBM Stack Cst Interpser Cst Assembly Cst Cmpnent Cst 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 18

19 COMPANY SERVICES 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 20

20 Business Mdels Fields f Expertise Related Reprts Cmpany services Feedbacks Cntact Legal Custm Analyses (>130 analyses per year) Reprts (>40 reprts per year) Csting Tls Trainings 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 21

21 Cntact PHOENIX YOLE Inc. FRANKFURT/MAIN Eurpa Sales Office NANTES Headquarter LYON YOLE HQ KOREA YOLE TOKYO YOLE KK Related Reprts Cmpany services Feedbacks Cntact Legal GREATER CHINA YOLE Headquarters 21 rue La Nue Bras de Fer Nantes FRANCE sales@systemplus.fr Eurpe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phenix USA (310) laferriere@yle.fr Asia Sales Office Takashi ONOZAWA Tky JAPAN nzawa@yle.fr Mavis WANG GREATER CHINA wang@yle.fr 2017 System Plus Cnsulting NVIDIA Tesla P100 GPU with HBM2 22